• Title/Summary/Keyword: packaging distribution

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Effects of Vibration Fatigue on Compression Strength of Corrugated Fiberboard Containers for Packaging of Fruits during Transport

  • Jung, Hyun-Mo;Park, Jeong-Gil
    • Journal of Biosystems Engineering
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    • v.37 no.1
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    • pp.51-57
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    • 2012
  • Purpose: The compression strength of corrugated fiberboard containers used to package agricultural products rapidly decreases owing to various environmental factors encountered during the distribution of unitized products. The main factors affecting compression strength are moisture absorption, long-term top load, and fatigue caused by shock and vibration during transport. This study characterized the durability of corrugated fiberboard containers for packaging fruits and vegetables under simulated transportation conditions. Methods: Compression tests were done after corrugated fiberboard containers containing fruit were vibrated by an electro-dynamic vibration test system using the power spectral density of routes typically traveled to transport fruits and vegetables in South Korea. Results: To predict loss of compression strength owing to vibration fatigue, a multiple nonlinear regression equation ($r^2=0.9217$, $RMSE=0.6347$) was developed using three independent variables of initial container compression strength, namely top stacked weight, loading weight, and vibration time. To test the applicability of our model, we compared our experimental results with those obtained during a road test in which peaches were transported in corrugated containers. Conclusions: The comparison revealed a highly significant ($p{\leq}0.05$) relationship between the experimental and road-test results.

Development of Wafer Bond Integrity Inspection System Based on Laser Transmittance

  • Jang, Dong-Young;Ahn, Hyo-Sok;Mehdi, Sajadieh.S.M.;Lim, Young-Hwan;Hong, Seok-Kee
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.2
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    • pp.29-33
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    • 2010
  • Among several critical topics in semiconductor fabrication technology, particles in addition to bonded surface contaminations are issues of great concerns. This study reports the development of a system which inspects wafer bond integrity by analyzing laser beam transmittance deviations and the variations of the intensity caused by the defect thickness. Since the speckling phenomenon exists inherently as long as the laser is used as an optical source and it degrades the inspection accuracy, speckle contrast is another obstacle to be conquered in this system. Consequently speckle contrast reduction methods were reviewed and among the all remedies have been established in the past 30 years the most adaptable solution for inline inspection system is applied. Simulation and subsequently design of experiments has been utilized to discover the best solution to improve irradiance distribution and detection accuracy. Comparison between simulation and experimental results has been done and it confirms an outstanding detection accuracy achievement. Bonded wafer inspection system has been developed and it is ready to be implemented in FAB in the near future.

Dielectric Characteristics of Alumina by Surface Etching Effects (표면에칭효과에 의한 산화알루미늄 유전체의 정전용량 특성)

  • Oh Han-Jun;Park Chi-Sun
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.4 s.33
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    • pp.61-67
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    • 2004
  • The structural, electrical properties of the electrolytic capacitors were examined. By the addition of additives to hydrochloric acid solution increased the dielectric aluminum surface layer. For etch tunnels formed in hydrochloric acid, the away and density of the tunnels was not uniform, while for those formed in hydrochloric acid with additives the distribution presented relative uniformity. When the etched surface formed in hydrochloric acid with $5\%$ ethylene glycol, the enlargement of specific surface area was more effective.

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Reliability of Multiple Oxides Integrated with thin $HfSiO_x$ gate Dielectric on Thick $SiO_2$ Layers

  • Lee, Tae-Ho;Lee, B.H.;Kang, C.Y.;Choi, R.;Lee, Jack-C.
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.4
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    • pp.25-29
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    • 2008
  • Reliability and performance in metal gate/high-k device with multiple gate dielectrics were investigated. MOSFETs with a thin $HfSiO_x$ layer on a thermal Si02 dielectric as gate dielectrics exhibit excellent mobility and low interface trap density. However, the distribution of threshold voltages of $HfSiO_x/SiO_2$ stack devices were wider than those of $SiO_2$ and $HfSiO_x$ single layer devices due to the penetration of Hf and/or intermixing of $HfSiO_x$ with underlying $SiO_2$. The results of TZDB and SILC characteristics suggested that a certain portion of $HfSiO_x$ layer reacted with the underlying thick $SiO_2$ layer, which in turn affected the reliability characteristics.

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Effect of Relative Humidity and Temperature on the Compression Strength of Corrugated Boxes on Distribution Channel (유통중 온습도 변화에 따른 골판지 상자의 압축강도에 대한 연구)

  • 이명훈;김종경
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.35 no.2
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    • pp.33-38
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    • 2003
  • In order to design the high strength corrugated fiberboard containers for agricultural products that can be used for the cold chain system, a large number of individual boxes were placed in various humidity environments at two different temperature of 5 and $20^{\circ}C$. The results indicated that temperature changes do not effect on physical strength of corrugated fiberboard containers as much as humidity changes did. The main conclusion from this study was that compression strength of corrugated fiberboard containers dropped significantly at high humidity condition, but the rates varied depending on the number of walls, temperature, and perimeter of containers. The packaging designer must consider the corrugated fiberboard boxes are also greatly affected by dimensional variations such as the length versus width ratio. Based on this study, water-resistant board would not be necessary if the ambient relative humidity does not reach to a critical point, 85 percent in the cold chain system. However, the designer must count for the unexpected fluctuation of rotative humidity resulting in severe loss of the compression strength of corrugated fiberboard container.

Design of CO2 Absorber Mix Tuned for Ripening of Packaged Kimchi (포장 김치의 숙성에 맞춘 CO2 흡수제 배합비율 설계)

  • Jung, Soo Yeon;Lee, Dong Sun;An, Duck Soon
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.27 no.1
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    • pp.35-40
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    • 2021
  • Calcium hydroxide (CH) reacts with CO2 to produce moisture, and sodium carbonate (SC) reacts with CO2 in the presence of moisture. Using these different characteristics of these two reactants, a CH/SC mixture of CO2 absorber tuned for kimchi ripening to produce CO2 in a flexible package was selected. A ratio of CH:SC (1:2) in highly gas permeable microporous spunbonded film (Tyvek) sachet was found to be appropriate for delayed and consistent CO2 absorption useful for kimchi package. Addition of superabsorbent polymer (SAP) as moisture buffer was helpful for boosting the consistency of CO2 absorption. In a package of 0.5 kg kimchi at 10℃, the sachet consisting of 0.794 g of CH + 2.276 g of SC + 0.4 g of SAP suppressed its volume expansion and maintained a suitable range of CO2 partial pressure (PCO2) steadily inside. These optimal conditions may vary depending on the type and salinity of kimchi, storage and distribution temperature, and the material and area of the absorber sachet. This study showed a potential of mixture CO2 absorber to be tuned for CO2 producing packaged kimchi for the purpose of keeping consistent PCO2 at tolerable volume expansion.

A Causal Relationship Model of Factors Influencing One Tambon One Product (OTOP) Snack Food Product Quality in Thailand

  • BOONNARAKORN, Sawitree;DEEBHIJARN, Samart;SAENGMANEE, Woranart
    • The Journal of Asian Finance, Economics and Business
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    • v.9 no.8
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    • pp.123-134
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    • 2022
  • In 2021 One Tambon One Product (OTOP) food products reached $3,447 billion domestically and $200 million internationally. Mirroring Japan's highly successful OVOP (One Village One Product) poverty reduction and rural employment program, Thailand's OTOP program has since become a global model of success as well. From May through June 2022, OTOP snack food vendor entrepreneurs were contacted and asked to contribute their opinions about what factors affected their enterprise's food product quality. Using systematic random sampling across six Thai regions, 311 export entrepreneurs, production managers, and marketing managers participated. The results revealed that product innovation (PDTI), process innovation (PCSI), packaging design (PKD), and the 4P marketing mix (4PMM) all positively influenced OTOP snack food product quality (PDQ), which, when combined, had a total effect R2 value of 27%. Also, the latent variable TE values for PDTI, PKD, 4PMM, and PCSI, were 0.38, 0.29, 0.22 and 0.11, respectively. Seven of the nine hypotheses examined were supported, with packaging design (PKD) determined to have the greatest influence on the 4P marketing mix (4PMM).

Formation of Indium Bumps on Micro-pillar Structures through BCB Planarization (BCB 평탄화를 활용한 마이크로 기둥 구조물 위의 인듐 범프 형성 공정)

  • Park, Min-Su
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.4
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    • pp.57-61
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    • 2021
  • A formation process of indium bump arrays on micro-pillar structures is proposed. The space to form indium bump on the narrow structures can be secured applying the benzocyclobutene (BCB) planarization and its etch-back process. We exhibit a detailed overview of the process steps involved in the fabrication of 320×256 hybrid camera sensor for short-wavelength infrared (SWIR) detection. The shear strength of the BCB, which has undergone the different processes, is extracted by quartz crystal microbalance measurement. The shear strength of the BCB is three orders of magnitude higher than that of the indium bump itself. The measured dark current distribution of the fabricated SWIR camera sensor indicates the suggested process of indium bumps can be useful for embodying highly sensitive infared camera sensors.

A Study on Evaluation for Sampling and Analytical Methods of Diatomaceous Earth Dust (규조토 분진 측정 및 분석 방법의 비교에 관한 연구)

  • Lim, Hyun Sul;Kim, Ji Yong;Cheong, Hoe Kyeong
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.5 no.2
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    • pp.212-225
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    • 1995
  • This study was performed in a diatomite factory located at Pohang City, Kyeongsangbuk-Do. The major objectives were to evaluate sampling and analytical methods of diatomaceous earth dust. Concentrations of total and respirable diatomaceous earth dust were measured. Size distribution of dust was analyzed by a personal cascade impactor and the particle size analyzer which is an application of multiple diffraction method. Also crystalline silica in respirable and total dust samples was analyzed quantitatively by X-ray diffraction and Fourie Transform Infrared Spectroscopy(FTIR). The results were as follows: The airborne total and respirable dust concentrations, particle size distribution, and cristalline silica(quartz) concentrations showed approximately a log-normal distribution. The means of totaldust concentrations at flour maufacturing, fire brick grinding and packaging processes exceeded the Korean and American Conference of Governmental Industrial Hygienists standards, $10mg/m^3$. The size distribution of diatomaceous earth dust was log-normal and identified as the rspirable particle mass and thoracic particle mass. The crystalline silica in respirable and total dust samples was identified to quartz and contained about 10 % in those samples. Finally, it is necessary to study the applicability of multiple diffraction for particle size distribution to compare the ACGIH's size selective sampling with other materials containing crystalline silica. Also, advanced quantitative study to X-ray diffraction and FTIR methods shoud be carried out 10 verify general and specific characteristics for respirable crystalline silica.

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Development of the Functional Films Coated with Nano-TiO2 Particles for Food Packaging and Removal of Off-flavor from Soybean Sprouts (나노 TiO2를 적용한 식품 포장 필름 개발 및 콩나물의 이취 제거)

  • Choi, Yeonwook;Jeon, Kyu Bae;Song, Kihyeon;Kim, Jai Neung
    • Korean Journal of Food Science and Technology
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    • v.47 no.6
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    • pp.733-737
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    • 2015
  • For testing the ultraviolet (UV)-blocking property of functional films coated with Nano-$TiO_2$ particles, UV-Vis spectra of oriented polypropylene (OPP) films uncoated and coated with $TiO_2$ of 3% and 5% in Polyurethane (PU) and polyvinyl butyral (PVB)-Cellulose binders were measured. The result of UV-Vis analyses showed that the film coated with 5% $TiO_2$ in PVB binders had a significant effect on UV protection of 90% compared with the film uncoated. Also The result of The photodegradation of methylene blue (MB), OPP films coated with 5% in both PU and PVB binders had a high photocatalytic activity for MB degradation. To evaluate the effect of the developed functional film coated with Nano-$TiO_2$ particles, fresh soybean sprouts were used. Nano-$TiO_2$ coated film was observed to decompose the off-flavor produced by soybean sprouts within packages during distribution, but uncoated film did not. Therefore, Nano-$TiO_2$ coated film package could give the greatest effect in extending the shelf life of soybean sprouts.