• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.6
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• pp.1003-1010
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• 2006

The usage increase of digital contents required solution for protection technology and interoperability of system. MPEG(Moving Picture Experts Group) proposed MPEG-21 Multimedia Frameworks. MPEG-21 IPMP is standard that provides the means to enable digital item and rights information to be persistently managed and protected across networks and devices. In this paper, MPEG-21 IPMP based system to protect digital contents designed by four structures of license server, production server, consumption server, tool server. License server create rights information document using the XML-based REL about multimedia contents of users. Production server makes a digital item by packaging multimedia resource and metadata, which is combined by REL information and IPMP information of multimedia resource. Consumption server takes care of the functions of players that use digital item, and tool server was implement to transmit for missing tool that might occur in all procedures.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.8
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• pp.3301-3306
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• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. Conventional pick-up device of the die bonder is simply operated by up and down motion of a collet and an ejector pin. However, this method may cause undesired problems such as position misalignment and/or severe die damage when the pick-up device reaches the die. In this study, to minimize the position alignment error and die damage, a die bonder is developed by adopting a new pick-up head for precise alignment and high speed feeding. To evaluate structural stability of the designed system, required finite element model of the die bonder is generated, and structural analysis is performed. Vibration analysis of the pick-up head is also performed using developed finite element model at operation frequency range. As a result of the analysis, deformation, stress, and natural frequency of the die bonder are investigated.

• Journal of the Korean Society of Food Science and Nutrition
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• v.33 no.6
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• pp.1056-1062
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• 2004

Migration of low molecular weight components from expanded polystyrene (ESP) to distilled water was measured at different temperature conditions. Overall migration and specific monomer migration were measured. Diffusion model based on Fick's law was used to determine the apparent diffusion coefficients at various experimental conditions. The overall and specific migration levels were estimated to give some practical implications for regulatory guideline development and safe package design. Diffusion coefficients for overall migration in KMnO$_4$ oxidizable extractives and specific migration of styrene monomer from ESP at 6$0^{\circ}C$ were 0.030 and 6.8${\times}$10$^{-5}$ $\textrm{mm}^2$/h, respectively. Their temperature dependence could be explained by Arrhenius equation with respective activation energies of 80.5 and 98.6 kJ/㏖. Experimental conditions ensuring desired migration level were suggested for reliable examination of migration from the packaging material. Some explanatory estimations of migrations were given for some typical conditions of potential usages.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.124-130
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• 2023

Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

• Journal of Information Technology Applications and Management
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• v.31 no.1
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• pp.123-138
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• 2024

With the increase in online shopping and delivery food consumption since the pandemic, solving environmental problems caused by single-use packaging has become an important issue. 'Upcycling' is a combination of 'Upgrade' and 'Recycle', and it is the rebirth of obsolete or discarded objects by adding new value to them, and there are currently various upcycled products on the market. In order to activate upcycling, consumers' awareness of the environment and their values for consumption are very important. This study aims to investigate the influence of students' environmental concern, environmental experience, and consumption value on their purchase intention of upcycled products. Based on the results of previous studies on environmental concern, environmental experience, and consumption value, hypotheses were set, and a survey was conducted among university students nationwide to test the hypotheses. The results of this study are as follows First, environmental concern has a significant positive effect on purchase intention of upcycled products. It can be seen that the more environmental concerns such as global warming and waste disposal problems increase, the more positive attitudes toward upcycled products increase. Second, the research hypothesis that environmental knowledge will have a positive effect on the purchase intention of upcycled products is rejected. It was found that environmental knowledge is acquired through environmental education and many SNS, but it does not have a direct effect on the purchase intention of upcycled products. Third, it was found that the consumption value of college students has a positive effect on the purchase intention of upcycled products by increasing their positive perception of upcycled products. Fourth, college students' purchase intention of upcycled products has a positive effect on their behavioral intention to purchase upcycled products. The results of the study provide implications for relevant organizations such as universities and companies to effectively design upcycling-related education. It is also expected to have a positive impact on the use of upcycled products by providing basic information on the characteristics of consumers who purchase upcycled products.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.1-10
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• 2018

Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.1
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• pp.279-290
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• 2018

The purpose of this study was to investigate the effect of consumption patterns of lactic acid bacteria(LAB) on the purchasing decisions of LAB products for the commercialization of lactic acid fermented products. The average use frequency of LAB product was 5 times/week and liquid type was the most preferred. The LAB products were purchased for their health benefits. The requirements for improvement of LAB products were natural (6.037), functional (5.936) and storage (5.856). Multiple regression analysis was conducted to examine the effect of consumption buying behavior on purchase decision-making behavior factors of LAB products. From the analysis results, comparison(. 468) appears to affect the ingredient factor. Comparison(.188), experience(.281), and showoff(.370) influence brand factors. Showoff(.598) influences design factors. Showoff (0.345) affected the price factor. Increasing the purchasing decision ability of LAB products will require producing a functional product in comparison with other products, and producing the products in a company with strong recognition. The packaging should suggest a luxurious design and expensive products.

• The KIPS Transactions:PartC
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• v.11C no.6 s.95
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• pp.731-738
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• 2004

With the increase of digital content usages, the protection for digital content and intellectual property becomes more important. The DRM(digital rights management) technologies are applicable to protect not only any kind of digital contents but also intellectual property. Besides such techniques are required for recorded digital broadcasting contents due to introduction of digital broadcasting techniques and storage devices such as personal video recorder. The conventional protection scheme for broadcasting content is the CAS(conditional access system) by which the access of viewer is controlled on the specific channels or programs. The CAS prohibits the viewer from delivering the digital broadcasting content to other person, so it results in restriction of superdistribution on the digital broadcasting content. In this paper, for broadcast targeting unspecfic many people, we will design the service model of the protection and distribution of digital broadcasting content using encryption and license by employing the concept of DRM. The results of implementation are also shown to verify some functions of each component. An implemented system of this paper has some advantages that the recording of broadcast content is allowed on set-top-box and superdistribution is available by consumer. Hence it provides content providers and consumers with trustworthy environment for content protection and distribution.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.175-182
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• 2017

In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.

• Journal of Distribution Science
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• v.12 no.8
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• pp.83-90
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• 2014

Purpose - Increasing sales of PB rice products can hinder the growth of domestic brands of rice, notwithstanding that the government is promoting domestic brands of rice. This analysis evaluated the influencing relationship among the variables of PB image, product credibility, and purchase intention of consumers who have never bought PB rice, to know the factors influencing consumers' decisions to purchase PB products. Research design, data, and methodology - PB products' brand image was analyzed as the factor that has a direct effect on purchase intention. The mediation effect of credibility on PB products is also analyzed, in terms of influencing the relationship between PB products' brand image and purchase intention. The analysis is performed on consumers that have not purchased a PB product and consumers who have purchased PB products from major distributors. Data is collected through questionnaires, from 389 of responders, and the AMOS 19.0 statistics package is used as a statistical tool. Results - It is proven that brand image has direct effects on the credibility of the product, and the credibility of product has a direct effect on purchase intention. However, it is revealed that brand image does not directly affect purchase intention, but that brand image indirectly affects it through the credibility of the product. Although the customers' recognition about PB image is low, the result shows that PB products' external attributes have effects on customers' purchase intention relating to the PB product. Therefore, it is important to establish the credibility of the PB product more than other products in terms of marketing. Conclusions - The following are the implications of the study. First, in a rice brand promotion, the credibility of the product should be ensured by a uniform brand image. To ensure the credibility of a product, the RPC brand and other brands should be unified, and the unified brand image should be applied to every product. Second, the package must possess a design as well as contents that could build consumers' perception of product credibility. Products' external attributes contribute to their credibility, which leads the consumers to purchase the products, including those consumers who have never bought PB rice products. Therefore, the products' credibility and sales can be reinforced by applying information about consumers' considerations when buying the PB rice product in different colors, font sizes, and packaging designs. This study is meaningful in two ways. First, it seeks to identify an NB revitalization strategy by exploring the purchasing behavior of customers who have no experience in buying PB rice products. Second, the results of previous studies about general brands are considered and applied in this study in order to investigate the influencing relationship among different factors of PB products. However, this study is a consumer awareness investigation; therefore, its results only have limited meaning to the relationship between brand image and purchase intention.