• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.124-128
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• 2001

We apply for the first time a low cost and loss wafer level packaging technology for RF-MEMS device. The proposed structure was simulated by finite element method (FEM) tool (HFSS of Ansoft). S-parameter measured of the package shows the return loss (S11) of 20dB and the insertion loss (S21) of 0.05dB.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.1097-1098
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• 2013

• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2002년도 춘계학술대회
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• pp.193-197
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• 2002

The certification of software products can provide a greater level of acceptance and feeling of security to customers of these products. This paper presents a certification method for the quality of package software. First of all, the evaluation criteria are derived from IS0/1EC 9126 and 12119 standards, and then the evaluation module are designed considering the measurement scale type. The results can be applied to construct the certification scheme of software product quality for the commercial purpose.

• 대한원격탐사학회지
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• 제8권1호
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• pp.59-69
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• 1992

The IMAPRO sotfware package was mainly focused to provide an algorithm which is capable of displaying various color composite images on IBM PC, VGA(Video Graphic Array) card with no special hardware. It displays the false color images using a low-cost eight-bit place refresh buffer. This produces similar quality to the one obtained from image board with three eight-bit plane. Also, it provides user friendly menu driven method for the user who are not familier with technical knowladge of image processing. It may prove useful for universities, institute and private company where expensive hardware is not available.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 추계학술발표대회 개요집
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• pp.58-60
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• 2004

In the field of welding the behavior of a welded structure under consideration may be predicted via heat transfer and residual stress analysis. In order to facilitate the industrial applications of welding, numerical modeling of heat transfer and residual stress in weldment has been carried out applying Finite Element Method (FEM) and the analysis with the external load including this residual stress due to welding has been done. The present work includes the specialized finite element codes for the calculation of nonlinear heat transfer details and residual stress redistributed along with the external load in the welded structures. A basic interface, which allows models, built in commercial preprocessing package access to the data necessary to build standard input decks for these specialized FEM codes, which are not supported by commercial package. The results from the FEM codes are imported back into commercial package for visualization. In addition the residual stress values are exported to commercial package (such as ANSYS, PATRAN etc.) for further analysis with the external loads, which make the FEM codes fully applicable to the industrial purpose.

• 한국의상디자인학회지
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• 제13권4호
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• pp.153-165
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• 2011

The purpose of this study is to take into consideration the package products of wedding miniature dress. The method of the research was mainly focused on precedent research data and general references. Furthermore the data on wedding dresses was mainly collected from internet sites. Ai; reflection customer's demands, more personal and distinctive design was planned reflecting trend in the sector of wedding dress. The results of the research is the following. First, the first consideration for designing product in wedding miniature was designed with the focus on what consumers are easy to make and on brilliance when having made. 8 pairs for barbie miniature and 2 pairs for ball joints were designed. Among these things, it designed colorfully with 6 pairs for wedding dress and 4 pairs for shooting, which are used in the right size. Second, as a result of seeing consumers' response by up-loading totally 10 pieces of miniature clothes on wedding miniature. com site, and were the most popular products. The aim is to suggest package product based on these two works. The design-based pattern, the fabric of being used, lace material, beads, and several trimmings are offered to 2 wedding miniature package products. Consumers can make own collection with a handicraft-based feeling by using this.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• 한국항공운항학회지
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• 제29권3호
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• pp.44-51
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• 2021

PIP is an abbreviation of 'Performance Improvement Package', which is a package that can improve performance by applying some design changes to existing aircraft. Boeing provides PIP applicable to B777-200, and Airbus provides PIP applicable to A350-900 as standard. PIP provided by Boeing and Airbus is a separate task, but it is expected to reduce fuel consumption by reducing drag through aerodynamic improvements. The PIP applied to the A350-900 includes work such as increasing Winglet Height and re-twisting Outboard Wing. This study is to verify the effect of PIP application of the A350-900 aircraft and use it as basic data for economic analysis. The aerodynamic improvement studies and expected effects of the PIP application were examined, and the actual flight data of the PIP-applied and the non-applied aircraft were compared to confirm the PIP application effect. This paper provides empirical results for the aviation industry on the PIP application efficiency as a method of improving fuel efficiency and reducing carbon emission.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2003년도 ICCAS
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• pp.1349-1353
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• 2003

CEMTool is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present a compiler based approach to the implementation of the command mode generalized PDE solver in CEMTool. In contrast to the existing MATLAB PDE Toolbox, our proposed FEM package can deal with the combination of the reserved words such as "laplace" and "convect". Also, we can assign the border lines and the boundary conditions in a very easy way. With the introduction of the lexical analyzer and the parser, our FEM toolbox can handle the general boundary condition and the various PDEs represented by the combination of equations. That is why we need not classify PDE as elliptic, hyperbolic, parabolic equations. Consequently, with our new FEM toolbox, we can overcome some disadvantages of the existing MATLAB PDE Toolbox.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1991년도 추계학술대회 논문집
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• pp.87-94
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• 1991

This Paper is to aim the microdefect evaluation of semiconductor Package into a quantitative from NDI's image processing of ultrasonic wave. Accordingly, for the detection of delamination between the Joining condition of boundary microdefect of semiconductor packaga the result from sampling original image, histogramming, binary image or image processing of multinumerloal value is such as the follows. ([) The least limitation from the microdefect detection of the semiconductor package by surveying high ultrasonic wave seems to be about 0.8 $\mu\textrm{m}$ in degree. (2) A result of applying the image processing of multinumerical value to the semiconductor package it was possible to devide the Category into the effectiveness.