• Journal of Korean Academy of Nursing
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• v.13 no.2
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• pp.58-69
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• 1983

This study on stressful life events and coping methods of hypertensive and nonhypertensive patients was applied to people who was divided into two groups from April 5 to March 10, 19 83. One is hospitalized patients in medical wards of three university hospital in Seoul. The other is inhibitants in two Dongs of Seoul. This study compared the number and seversity of stressful life events reported by hypertensive and nonhypertensive patients, indentified coping methods used by the two groups and explored the relationship between stressful life events and coping methods. Two instruments are used in this study. The first one to measure stressful life events, is Holmes ＆ Rahe (1967)'s S.R.R.S. (Social Readjustment Rating Scale). Which is translated & am-ended. So that it consists of 46 items. The second one is for evaluating coping method. It consists of f items amended through preliminary test after consideration of related literature review and survey on the basis of Bell (1977)'s‘18-item-Questionnaire.’The materials were analyzed by S.P.S.S. (Statistical Package for the Social Science) program-The results of analysis were as follows: 1. There were no significant difference in the number and severity of stressful life events reported by hypertensive and nonhypertensive patients (p>.05). 2. There were significant difference in use of short-term coping methods (p<.01) and long-term coping methods (p<.05).

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.5-8
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• 2009

In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multi-layer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.

• Steel and Composite Structures
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• v.21 no.4
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• pp.703-753
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• 2016

The ratcheting behavior was studied experimentally for Z2CND18.12N elbow piping under cyclic bending and steady internal pressure. Dozens of cyclic plasticity models for structural ratcheting responses simulations were used in the paper. The four models, namely, Bilinear (BKH), Multilinear (MKIN/KINH), Chaboche (CH3), were already available in the ANSYS finite element package. Advanced cyclic plasticity models, such as, modified Chaboche (CH4), Ohno-Wang, modified Ohno-Wang, Abdel Karim-Ohno and modified Abdel Karim-Ohno, were implemented into ANSYS for simulating the experimental responses. Results from the experimental and simulation studies were presented in order to demonstrate the state of structural ratcheting response simulation by these models. None of the models evaluated perform satisfactorily in simulating circumferential strain ratcheting response. Further, improvement in cyclic plasticity modeling and incorporation of material and structural features, like time-dependent, temperature-dependent, non-proportional, dynamic strain aging, residual stresses and anisotropy of materials in the analysis would be essential for advancement of low-cycle fatigue simulations of structures.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.43-49
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• 2006

The properties, behavior and reliability of the residual void in blind via hole(BVH) were carried out for the shape of BVH using the void extraction process. The residual void was perfectly removed in the specimens applied by the void extraction process, which was improved by 40% rather than the conventional process. The residual void in BVH was to be eliminated under a condition of 1.5 atm for more 30 sec with regardless of the shape of BVH. It was also observed that the residual void in BVH was not formed after the reliability test with JEDEC standard.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.1
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• pp.25-29
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• 1999

Time-temperature indicators (TTI) from three different companies obtained and were attached to food packages materials to evaluate degree of their color change according to storage time and temperature. Five temperature (-10 -5, 0, 5 and 10) was selected to represent standard freezing, refrigerating and room temperature, and evaluated performance by color change based on magnitude of color change and hunter system (L, a, b). Response end point was measured and recorded to find characteristic of each indicator. Comparison and discussion were conducted for accuracy and precision of each time-temperature. More research should be conducted at variable temperature and with various food to determine applicability of TTI on various storage condition.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.218-220
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• 2006

Sn-3.0Ag-0.5Cu solder is widely used as micro-joining materials of flip chip package(FCP) because of the fact that it causes less dissolution and has good thermal fatigue property. However, compared with ternary electroplating in the manufacturing process, binary electroplating is still used in industrial field because of easy to make plating solution and composition control. The objective of this research is to fabricate Sn-3.0Ag-0.5Cu solder bumping having accurate composition. The ternary Sn-3.0Ag-0.5Cu solder bumping could be made on a Cu pad by sequent binary electroplating of Sn-Cu and Sn-Ag. Composition of the solder was estimated by EDS and ICP-OES. The thickness of the bump was measured using SEM and the microstructure of intermetallic-compounds(IMCs) was observed by SEM and EDS. From the results, contents of Ag and CU found to be at $2.7{\pm}0.3wt%\;and\;0.4{\pm}0.1wt%$, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.3
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• pp.265-271
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• 2008

TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.

• Asian Pacific Journal of Cancer Prevention
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• v.16 no.12
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• pp.4955-4958
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• 2015

Background: Skin cancer is the most common type of cancer worldwide. It has an increasing trend. This study investigated the epidemiological trend and morphological changes in skin cancer in Iran. Materials and Methods: This study was done using existing data, extracted from the National Cancer Registry System and the Disease Management Center of Iranian Ministry of Health between 2003 and 2008. Data on epidemiologic trend was analyzed using Joinpoint software package. Results: The incidence of skin cancer is increasing in Iran, and more in men than women. There was a declining trend for basal cell carcinoma. Basal squamous cell carcinoma and melanoma had an increasing trend. The increase of skin cancer was related to squamous cell carcinoma. Conclusions: Our findings indicated that the increase of skin cancer was attributed to squamous cell carcinoma. It is necessary to be planning for the control and prevention of this disease as a priority for health policy makers.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.5
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• pp.27-35
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• 2010

A loader used for uploading materials into truck is a kind of construction equipment. Mainly, a wheel loader is applied to construction work. Recently, an automatic transmission for the wheel loader is used to help drivers get the repetitive works done comfortably. It is composed of geartrain, clutch pack, hydraulic control system and TCU. Especially, a high-performance proportional control valve and its control algorithm is demanded to achieve the shift quality during a change of speed. In this paper, the commercial package program was used in order to justify model of the proportional control valve and simulate it. Steady-state and dynamic characteristics of PCV were analyzed to classify attractive forces and hydraulic control characteristics. This model also was verified the validity compared to the experimental result. Using the developed model, performances of PCV were predicted as studying design parameters.

• Transactions of Materials Processing
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• v.11 no.5
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• pp.405-413
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• 2002

A process planning system for cold forging of non-axisymmetric parts of comparatively simple shape was developed in this study. Programs for the system have been written with Visual LISP in AutoCAD. Shape of the product must be drawn with the solid line and the hidden line, and with the plane and front view, as well. At the plane, the system recognizes the external shape of non-axisymmetric portions - the number of the sides of the regular polygons and the radii of circles inscribing and circumscribing the polygon. At the front view, the system cognizes the diameter of axisymmetric portions and the height of the primitive geometries such as polygon, cylinder, cone, concave, convex, etc. The system perceives that the list developed from the solid line must be formed by the operation of forward extrusion or upsetting, and that the list developed from the hidden line must be formed by the operation of backward extrusion. The system designs the intermediate geometries again by considering clearance between workpiece and die, and then finally the billet diameter, in reverse order from the finished product, on the basis of volume constancy and using the operations, the forming sequence, the number of operations and the intermediate geometries which were already designed. The design rules and knowledges for the system were extracted from the plasticity theories, handbook, relevant reference and empirical knowledge of field experts. Suitability of the process planning was analyzed using SuperForge of FVM simulation package. The results of analysis showed good formability.