• Health Policy and Management
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• v.30 no.2
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• pp.164-177
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• 2020

This study aims to compare the experience of selected countries in operating separate payment system for new healthcare technology and to find implications for price setting in Korea. We analyzed the related reports, papers, laws, regulations, and related agencies' online materials from five selected countries including the United States, Japan, Taiwan, Germany, and France. Each country has its own additional payment system for new technologies: transitional pass-through payment and new technology ambulatory payment classification for outpatient care and new technology add-on payment for inpatient care (USA), an extra payment for materials with new functions or new treatment (C1, C2; Japan), an additional payment system for new special treatment materials (Taiwan), a short-term extra funding for new diagnosis and treatment (NUB; Germany), and list of additional payments for new medical devices (France). The technology should be proven safe and effective in order to get approval for an additional payment. The price is determined by considering the actual cost of providing the technology and the cost of existing similar technologies listed in the benefits package. The revision cycle of the additional payment is 1 to 4 years. The cost or usage is monitored during that period and then integrated into the existing fee schedule or removed from the list. We conclude that it is important to set the explicit criteria to select services eligible for additional payment, to collect and analyze data to assess eligibility and to set the payment, to monitor the usage or cost, and to make follow-up measures in price setting for new health technologies in Korea.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.129-134
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• 2005

Electroplating copper is the important role in formation of 3D stacking interconnection in SiP (System in Package). The I-V characteristics curves are investigated at different electrolyte conditions. Inhibitor and accelerator are used simultaneously to investigate the effects of additives. Three different sizes of via are tested. All via were prepared with RIE (reactive ion etching) method. Via's diameter are 50, 75, $100{\mu}m$ and the height is $100{\mu}m$. Inside via, Ta was deposited for diffusion barrier and Cu was deposited fer seed layer using magnetron sputtering method. DC, pulse and pulse revere current are used in this study. With DC, via cannot be filled without defects. Pulse plating can improve the filling patterns however it cannot completely filled copper without defects. Via was filled completely without defects using pulse-reverse electroplating method.

• Journal of the Korean Ceramic Society
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• v.51 no.6
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• pp.533-538
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• 2014

Today, silicon and epoxy resin are used as materials of conversion lenses for white LEDs on the basis of their good bonding and transparency in LED packages. But these materials give rise to long-term performance problems such as reaction with water, yellowing transition, and shrinkage by heat. These problems are major factors underlying performance deterioration of LEDs. In this study, in order to address these problems, we fabricated a conversion lenses using glass, which has good chemical durability and is stable to heat. The fabricated conversion lenses were applied to a remote phosphor type. In this experiment, the conversion lens for white LED was coated on a glass substrate by a screen printing method using paste. The thickness of the coated conversion lens was controlled during 2 or 3 iterations of coating. The conversion lens fabricated under high heat treatment temperature and with a thin coating showed higher luminance efficiency and CCT closer to white light than fabricated lenses under low heat treatment temperature or a thick coating. The conversion lens with $32{\mu}m$ coating thickness showed the best optical properties: the measured values of the CCT, CRI, and luminance efficiency were 4468 K, 68, and 142.22 lm/w in 20 wt% glass frit, 80 wt% phosphor with sintering at $800^{\circ}C$.

• Journal of the Institute of Convergence Signal Processing
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• v.10 no.2
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• pp.120-126
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• 2009

There are many different types of surface defects on semiconductor Integrated Chips (IC's) caused by various factors during manufacturing process, such as cracks, foreign materials, chip-outs, chips, and voids. These defects must be detected and classified by an inspection system for productivity improvement and effective process control. Among defects, in particular, foreign materials and chips are the most difficult ones to classify accurately. A vision system composed of a carefully designed optical system and a processing algorithm is proposed to detect and classify the defects on QFN(Quad Flat No-leads) packages. The processing algorithm uses features derived from the defect's position and brightness value in the Maximum Likelihood classifier and the optical system is designed to effectively extract the features used in the classifier. In experiments we confirm that this method gives more effective result in classifying foreign materials and chips.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.242-242
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• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

• Journal of The Korean Society For Urban Railway
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• v.6 no.4
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• pp.393-399
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• 2018

It is well recognized that residual stresses of the rails, generated from the manufacturing process including roller straightening and heat treatment, play an important role in determining fatigue and fracture properties of the rails. Thus, it has been a challenge to measure the residual stresses accurately. In this work, contour method was employed to evaluate the residual stresses existing in interior of the rails. The cross section perpendicular to the longitudinal direction of the rail was cut at a very slow rate using electric discharge machining (EDM), after which a laser-based flexural measuring instrument enabled us to precisely measure the flection of the cross section. The measured data were converted into the residual stresses using the commercial finite element package, ABAQUS, through a user-defined element (UEL) subroutine, and the residual stresses of the new rails (50N, KR60, UIC60) with three different specifications were compared.

• Composites Research
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• v.20 no.3
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• pp.43-49
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• 2007

Dynamic instability of rotating disks is the most significant factor to limit its rotating speed. Application of composite materials to rotating disks may enhance the dynamic stability leading to a possible design of rotating disks with lightweight and high speed. Whereas much work has been done on the effect of transverse shear and rotary inertia, called Timoshenko effect, on the dynamic behavior of plates, there is little work on the correlation between the effect and the rotation of disk, especially nothing in case of composite disks. The dynamic equations of a rotating composite disk are formulated with the Timoshenko effect and the vibrational analysis is performed by using a commercial package MSC/NASTRAN. According to the results, the Timoshenko effect goes seesaw in some modes, unlike the well-known fact that the effect decreases as the rotating speed increases. And it can be concluded, based only on the present results, that decrement of the Timoshenko effect by disk rotation grows larger as the thickness ratio decreases, the diameter ratio increases, the modulus ratio increases, and the mode number increases.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.1-10
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• 2023

Recently, as the demand for high-performance computers and mobile products increases, semiconductor packages are becoming high-integration and high-density. Therefore, in order to transmit a large amount of data at once, micro bumps such as flip-chip and Cu pillar that can reduce bump size and pitch and increase I/O density are used. However, when the size of the bumps is smaller than 70 ㎛, the brittleness increases and electrical properties decrease due to the rapid increase of the IMC volume fraction in the solder joint, which deteriorates the reliability of the solder joint. Therefore, in order to improve these issues, a layer that serves to prevent diffusion is inserted between the UBM (Under Bump Metallization) or pillar and the solder cap. In this review paper, various studies to improve bonding properties by suppressing excessive IMC growth of micro-bumps through additional layer insertion were compared and analyzed.

• Korean journal of applied entomology
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• v.63 no.1
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• pp.73-74
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• 2024

To control western flower thrips (Frankliniella occidentalis), a significant pest of peppers, the control effects of eco-friendly agricultural materials were tested when treated alone and in combination. The control effects of yellow sticky roll traps installed on the stem, predatory natural enemy (Hypoaspis miles) inoculated on the stem, and plant extracts (50% custard apple seed oil + 10% cinnamon extract) sprayed on the foliage were 45.3%, 36.6%, and 50.2%, respectively, when treated individually. Meanwhile, when three eco-friendly agricultural materials were comprehensively applied, the control effect was maintained between 62.4% and 80.9% compared to untreated conditions during the pepper harvesting season. These methods can be utilized for the eco-friendly control of western flower thrips in pepper greenhouses.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.35-42
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• 2024

Recently, with the miniaturization and high integration of semiconductor chips, the bump bridge phenomenon caused by fine pitches is drawing attention as a problem. Accordingly, Cu pillar bump, which can minimize the bump bridge phenomenon, is widely applied in the semiconductor package industry for fine pitch applications. When exposed to a high-temperature environment, the thickness of the intermetallic compound (IMC) formed at the joint interface increases, and at the same time, Kirkendall void is formed and grown inside some IMC/Cu and IMC interfaces. Therefore, it is important to control the excessive growth of IMC and the formation and growth of Kirkendall voids because they weaken the mechanical reliability of the joints. Therefore, in this study, isothermal aging evaluation of Cu pillar bump joints with a CS (Cu+ Sn-1.8Ag Solder) structure was performed and the corresponding results was reported.