• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.53-58
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• 2003

The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.11
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• pp.2038-2042
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• 2010

In this paper, we confirmed the thermal & optical properties for improving the heat transfer coefficient by changing the via hole size and in FR4 PCB with the same area. Osram 1W power LED Package (Golden Dragon) was used and the K-factor which is relative constant between LED junction temperature and forward bias was measured with power source meter(KEITHLEY 2430) to measure the thermal resistance from PCB configuration. As results, thermal resistance in metal PCB came out to the lowest as $26 [^{\circ}C/W]$ and thermal resistance in FR4 PCB without via-holes emerged as the highest as $69 [^{\circ}C/W]$. However thermal resistance of FR4 PCB could have decreased until $32[^{\circ}C/W]$ in 0.6 mm by using the via hole. Also, the luminous flux could have improved, too.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.7
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• pp.3334-3340
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• 2011

In this study, a computer simulation work has been performed for the carbon dioxide removal process using aqueous amine solution in the GTL (Gas To Liquids) process. 30wt% DEA(diethnaol amine) aqueous solution was utilized as a carbon dioxide remvoal agent and an absorber-stripper two-columns configuration was used. Kent-Eisenburg modeling equation built-in amine specicial package was used for the modeling of the carbon dioxide removal process. PRO/II with PROVISION 9.0, a commercial process simulator was used. Through this simulation study, heat and material balance was obtained and packing column diameter and column height were also estimated.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.149-153
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• 2019

The technology of electronic packaging among semiconductor technologies is evolving as an axis of the market in its own field beyond the simple assembly process of the past. In the field of electronic packaging technology, the packaging of power modules plays an important role for green electric vehicles. In this power module packaging, the thermal reliability is an important factor, and silicon nitride plays an important part of package substrates, Silicon nitride is a compound that is not found in nature and is made by chemical reaction between silicon and nitrogen. In this study, this core material, silicon nitride, was fabricated by reaction bonded silicon nitride. The fabricated silicon nitride was studied for thermo-mechanical properties, and through this, the structure of power module packaging was made using reaction bonded silicon nitride. And the characteristics of stress were evaluated using finite element analysis conditions. Through this, it was confirmed that reaction bonded silicon nitride could replace the silicon nitride as a package substrate.

• Steel and Composite Structures
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• v.43 no.5
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• pp.533-552
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• 2022

The current article deals with the dynamic stability, and structural improvement of vibrating electrically curved screen on the viscoelastic substrate. By considering optimum value for radius curvature of the electrically curved screen, the structure improvement of the system occurs. For modeling the electrically system, the Maxwell's' equation is developed. Hertz contact model in employed to obtain contact forces between impactor and structure. Moreover, variational methods and nonlinear von Kármán model are used to derive boundary conditions (BCs) and nonlinear governing equations of the vibrating electrically curved screen. Galerkin and Multiple scales solution approach are coupled to solve the nonlinear set of governing equations of the vibrating electrically curved screen. Along with the analytical solution, 3D finite element simulation via ABAQUS package is provided with the aid of a FE package for simulating the current system's response. The results are categorized in 3 different sections. First, effects of geometrical and material parameters on the vibrational performance and stability of the curves panel. Second, physical properties of the impactor are taken in to account and their effect on the absorbed energy and velocity profile of the impactor are presented. Finally, effect of the radius and initial velocity on the mode shapes of the current structure is demonstrated.

• International Journal of Advanced Culture Technology
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• v.11 no.3
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• pp.163-171
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• 2023

A blind box is a kind of sales method in that you can only get the product information by opening the package. In 2019, blind box products began to grow rapidly in the Chinese market, and gradually formed a special "blind box economy". The particularity of blind box products is that driven by consumers' curiosity, consumers' purchasing behavior can be directly induced by the visual and tactile perception of commodity packaging. Therefore, it is necessary to explore the psychological needs of consumers and master the blind box packaging design elements under the influence of consumer psychology. This paper takes figurine blind box packaging elements as the research scope and Chinese blind box consumers as the research object. Through market research and literature study, We are designed to conduct a questionnaire survey and SPSS empirical study to find out the differences in the preferences of different consumer temperament types for blind box packaging, taking the characteristics of blind box products and consumer psychology as the relevant theoretical background. The research results show that among the blind box consumers, choleric type consumers predominate, the color of the blind box packaging presents red, orange, and yellow preference, and the material presents metal, and plastic preference. The shape of the blind box shows a preference for special shape.

• Journal of Sensor Science and Technology
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• v.32 no.4
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• pp.207-212
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• 2023

H₂S is a toxic and harmful gas, even at concentrations as low as hundreds of parts per million; thus, developing an H₂S sensor with excellent performance in terms of high response, good selectivity, and fast response time is important. In this study, an H₂S sensor with a high response and fast response time, consisting of a sensing material (SnO₂), an electrode, a temperature sensor, and a micro-heater, was developed using micro-electro-mechanical system technology. The developed H₂S sensor with a micro-heater (circular type) has excellent H₂S detection performance at low H₂S concentrations (0-10 ppm), with quick response time (<16 s) and recovery time (<65 s). Therefore, we expect that the developed H₂S sensor will be considered a promising candidate for protecting workers and the general population and for responding to tightened regulations.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.5 no.3
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• pp.199-212
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• 2007

If a type IP-2 transport package were to be subjected to a free drop test and a penetration test under the normal conditions of transport, it should prevent a loss or dispersal of the radioactive contents and a more than 20% increase in the maximum radiation level at any external surface of the package. In this paper, we suggested the analytic method to evaluate the structural safety of a type IP-2 transport package using a thick steel plate for a structure part and a bolt for tying a bolt. Using an analysis a loss or dispersal of the radioactive contents and a loss of shielding integrity were confirmed for two kinds of type IP-2 transport packages to transport radioactive waste drums from a waste facility to a temporary storage site in a nuclear power plant. Under the free drop condition the maximum average stress at the bolts and the maximum opening displacement of a lid were compared with the tensile stress of a bolt and the steps in a lid, which were made to avoid a streaming radiation in the shielding path, to evaluate a loss or dispersal of radioactive waste contents. Also a loss of shielding integrity was evaluated using the maximum decrease in a shielding thickness. To verify the impact dynamic analysis for free drop test condition and evaluate experimentally the safety of two kinds of type IP-2 transport packages, free drop tests were conducted with various drop directions. For the tests we examined the failure of bolts and the deformation of flange to evaluate a loss or dispersal of radioactive material and measured the shielding thickness using a ultrasonic thickness gauge to assess a loss of shielding integrity. The strains and accelerations acquired from tests were compared with those by analyses to verify the impact dynamic analysis. The analytic results were larger than the those of test so that the analysis showed the conservative results. Finally, we evaluated the safety of the type IP-2 transport package under the stacking test condition using a finite element analysis. Under the stacking test condition, the maximum Tresca stress of the shielding material was 1/3 of the yielding stress. Two kinds of a type IP-2 transport package were safe for the free drop test condition and the stacking test condition.

• Korean Journal of Materials Research
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• v.26 no.1
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• pp.22-28
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• 2016

In this study, we fabricated high quality color conversion component with green/red phosphor and low melting glass frit. The color conversion component was prepared by placing the green and red phosphor layer on slide glass via screen printing process. The properties of color conversion component could be controlled by changing coating sequence, layer thickness and heat treatment temperature. We discovered that optical properties of color conversion component were generally determined by the lowest layer. On the other hand, the heat treatment temperature also affected to correlated color temperature (CCT) and color rending index (CRI). The color conversion component with a green (lower) - red (upper) layer which was sintered at $550^{\circ}C$ showed the best optical properties: CCT, CRI and luminance efficacy were 3340 K, 78, and 56.5 lm/w, respectively.