• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.34D no.2
• /
• pp.1-9
• /
• 1997

For the reduction of parasitic inductance and matching of bonding wire in the package of microwave devices, we propose multiple bonding wires buried in a dielectric material of FR-4 composite. This structure is analyzed using the method of moments (MoM) and compared with the common bondwires and ribbon interconnections. The FR-4 composite is modelled by the cole-cole model which can consider the loss and the variation of the permittivity in a frequency. At 20 GHz, the parasitic reactance is reduced by 90%, 80%, 60% compared to those of a single bonding wire in air, double bonding wires in air and ribbon interconnection in air, respectively. Also, the new bondwire shows very good matching of 60.ohm characteristic impedance and has 15dB, 10dB, 5dB improvement of the return loss and 2.5dB, 0.7dB, 0.2dB improvement of the insertion loss compared to the common interconnections. This technique can minimize the parasitic effect of bondwires in microwave device packaging.

• Journal of Welding and Joining
• /
• v.32 no.3
• /
• pp.53-59
• /
• 2014

The mechanical stability of solder joints in electronic devices with Sn-Ag-Cu is a continuous issue since the material was applied to the industry. Various shock test methods were developed and standardized tests are used in the industry worldwide. Although it is applied for several years, the detailed mechanism of the shock induced failure mechanism is still under investigation. In this study, the effect of external temperature was observed on large Flip-chip BGA components. The weight and size of the large package produced a high strain region near the corner of the component and thus show full fracture at around 200G level shock input. The shock performance at elevated temperature, at $100^{\circ}C$ showed degradation based on board pad designs. The failure mode and potential failure mechanisms are discussed.

• Proceedings of the Korea Concrete Institute Conference
• /
• 1997.10a
• /
• pp.519-526
• /
• 1997

The purpose of this study is to develop the analytical model for the reinforcement bar connection in group-filled steel pipe sleeve, which consists of beam elements for the reinforcement bar and shell elements for the sleeve and the mortar and spring elements for the bond stress-slip relationship. In the reinforcement bar connection using grout-filled steel pipe sleeve, the major variables are the bond stiffness between reinforcement bar and mortar($K_1$) and between sleeve and mortar($K_2$). It is nearly difficult to predict the exact bond stiffness with the experimental results. Therefore, The linearly elastic analyses using ABAQUS, FEM package show the validity of the mathematical equations for the bond stiffness and the choice of material elements in this paper. To predict the behaviour between yield and ultimate tensile strength, the nonlinear analyses must be performed henceforth.

• Transactions of Materials Processing
• /
• v.4 no.3
• /
• pp.233-244
• /
• 1995

Rolling force in the direct rolling(or twin-roll strip continuous casting) process fo semi-solid material has been computed using rigid-viscoplastic finite element method. Temperature distributions for calculations of rolling force and roll deformation are obtained from thermofluid analysis. Three dimensional roll deformation analysis has also been performed by using commercial package ANSYS. From the results, behavior of metal flow, rolling force and roll deformation have been investigated according to the process conditions of semi-solid direct rolling.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
• /
• 2003.11a
• /
• pp.112-117
• /
• 2003

The purpose of this work is to general approach to numerically simulating wear in rolling and sliding contact area between wheel and rail interface based on the analysis of dynamics with general MBS package. A simulation scheme is developed that calculates the wear at a detailed level. The estimation of material removal follows Archard's wear equation which states that the reduction of volume is linearly proportional to the sliding distance, the normal applied load and the wear coefficient and inverse proportional to hardness. The main research application is the wheel-rail contact of Korea High Speed Railway.

• Proceedings of the KWS Conference
• /
• 2003.05a
• /
• pp.224-227
• /
• 2003

The longitudinal thermosonic bonding method is investigated in this work for its application to the soldering process for electronic packaging. The effect of the ultrasonic is analyzed through lumped modeling, and the material properties of a viscoelastic model are measured experimentally. The thermosonic bonding method is verified by inserting the Cu pin and Au bump into solder block. As the solder thickness decreases, temperature of the solder is calculated to increase rapidly because of larger strain. Localized heating due to ultrasonic vibration is observed to melt the solder near the pin, which is adequate to the high density electronic package and Pb-free solder having high melting temperature.

• Applied Science and Convergence Technology
• /
• v.23 no.4
• /
• pp.169-178
• /
• 2014

Fluid model based numerical analysis is done to simulate a low damage etch back system for 20 nm scale semiconductor fabrication. Etch back should be done conformally with very high material selectivity. One possible mechanism is three steps: reactive radical generation, adsorption and thermal desorption. In this study, plasma generation and transport steps are analyzed by a commercial plasma modeling software package, CFD-ACE+. Ar + $CF_4$ ICP was used as a model and the effect of reactive gas inlet position was investigated in 2D and 3D. At 200~300 mTorr of gas pressure, separated gas inlet scheme is analyzed to work well and generated higher density of F and $F_2$ radicals in the lower chamber region while suppressing ions reach to the wafer by a double layer conducting barrier.

• Textile Coloration and Finishing
• /
• v.26 no.1
• /
• pp.1-6
• /
• 2014

We have designed and synthesized the colorimetric chemosensor through the reactions of 1,2-anthraquinone and indol-3-carboxaldehyde. Due to its well conjugated D-${\pi}$-A system and the existence of NH-fragment in indole moiety, we expected that the chemosensor can detect target anions with NH-fragment in indole part of the structure. In this regard, UV-Vis absorption spectra were measured to investigate sensing properties of the probe toward different anions in DMSO. This chemosensor shows to detect fluoride anions with absorption change in intensity. These properties are mainly related to the deprotonation effect. ICT system in this molecule was also observed by the computational approach using Material Studio 4.3 package.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2005.07a
• /
• pp.614-615
• /
• 2005

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, roll-to-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate ($LEXAN^{(R)}$) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen,chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate ($LEXAN^{(R)}$) films and its compatibility with OLED device fabrication processes.

• Proceedings of the Korean Society of Laser Processing Conference
• /
• 2006.11a
• /
• pp.103-107
• /
• 2006

Decapsulation of EMC(Epoxy Molding Compound) in package device is a method used to inspect inside of device by removing plastic molding. So far, chemical etching and mechanical grinding methods have been used widely. Recently, several works using laser have been carried out. This method has advantages with fast process time and precision than conventional methods because of noncontact process. Also, laser process is a clean process because of removing EMC directly without using toxic chemicals. The wavelength of laser used in this study is 355nm. Key parameters of removing EMC are laser power, scan speed, and number of scans of laser. It if confirmed that laser decapsulation is a useful process to inspect inside a device with a small thermal damage to chip surface.