• Proceedings of the Korean Vacuum Society Conference
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• 2006.08a
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• pp.90-90
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• 2006

• Journal of The Korean Society of Grassland and Forage Science
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• v.21 no.4
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• pp.181-190
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• 2001

This study was conducted to investigate the effect of swine liquid manure(SLM) and phosphorus fertilizer from September, 1998 to July, 1999 on the soil fertility on Italian ryegrass field, Cheju volcanic ash soil. pH(lst investigated), Mg (2nd investigated) and Cu content (2nd investigated) on soil grown by Italian ryegrass were significantly increased by an increase of fertilizer P(P

• Journal of Korean Society on Water Environment
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• v.21 no.1
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• pp.66-72
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• 2005

Effect of the pH, molar ratio of Cu(II)/EDTA, concentration of Cu(II)-EDTA and ionic strength on the photocatalytic oxidation(PCO) of Cu(II)-EDTA in solar light was studied in this work. Experimental results in this work were compared with previous results obtained with UV-lamp. In the kinetics, Cu(II)-EDTA decomposition was favorable below neutral pH. The removal of Cu(II) and DOC was favorable as $TiO_2$ dosage increased. The initial rate for the decomplexation of Cu(II)-EDTA linearly increased as the concentration of Cu(II)-EDTA increased. The removal of Cu(II) and DOC was not much affected by variation of ionic strength with $NaClO_4$ as a background ion while much reduction was observed in the presence of background ions having higher formal charges. The removal trend of Cu(II) and DOC with variation of ionic strength and concentration of Cu(II)-EDTA in solar light was similar with that in UV light. Variation of the molar ratio of Cu(II)/EDTA showed a negligible effect on the removal of both Cu(II) and DOC. However, removal of both Cu(II) and DOC was two-times greater than that previous results obtained with UV light.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.382-385
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• 2003

Chemical mechanical polishing(CMP) is an essential process in the production of copper-based chips. On this work, the stability of Hydrogen Peroxide($H_2O_2$) as oxidizer of Cu CMP slurry has been investigated. $H_2O_2$ is known as the most common oxidizer in Cu CMP slurry. Copper slowly dissolves in $H_2O_2$ solutions and the interaction of $H_2O_2$ with copper surface had been studied in the literature. Because hydrogen peroxide is a weak acid in aqueous solutions, a passivation-type slurry chemistry could be achieved only with pH buffered solution.[1] Moreover, $H_2O_2$ is so unstable that its stabilization is needed using as oxidizer. As adding KOH as pH buffering agent, stability of $H_2O_2$ decreased. However, stability went up with putting in small amount of BTA as film forming agent. There was no difference of $H_2O_2$ stability between KOH and TMAH at same pH. On the other hand, $H_2O_2$ dispersion of TMAH is lower than that of KOH. Furthermore, adding $H_2O_2$ in slurry in advance of bead milling lead to better stability than adding after bead milling. Generally, various solutions of phosphoric acids result in a higher stability. Using Alumina C as abrasive was good at stabilizing for $H_2O_2$; moreover, better stability was gotten by adding $H_3PO_4$.

• Korean Journal of Materials Research
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• v.4 no.8
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• pp.877-887
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• 1994

Cu-Ni-Si-P alloys have been studied in order to develop connector material which has a favorable combination of strength, electrical conductivity, elastic limit, thermal softening resistence and bend formability. Three kinds of trial alloys with various nickel and silicon content were melted and cast, hot rolled at about $900^{\circ}C$ and cold rolled. Mechanical properties and electrical conductivities of these alloys annealed at $450^{\circ}C$, $500^{\circ}C$ and $550^{\circ}C$ were investigated. An alloy with the composition of Cu-2.7%Ni-0.53%Si-O.O29%P, which shows a favorable combination of high strength and high electrical conductivity, has been developed. Various characteristics of the alloy 1 connector material were evaluated and compared with phospher bronze(C521OR-H) and brass(C26OOR-EH) connector material.

• Journal of the Korean Chemical Society
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• v.35 no.5
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• pp.512-519
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• 1991

The axial ligations of nitrogenous bases (pyridine, imidazole, 1-methylimidazole and 2,6-lutidine) to Zn(II)-, Cu(II)-, and Ni(II)-tetrakis(o-chlorophenyl)porphyrin(o-ClTPP), and -tetraphenylporphyrin (TPP) were investigated in organic solvents $(CH_2Cl_2,\;C_6H_6,\;CH_3NO_2,\;(CH_3)_2CO,\;CHCl_3,\;DMF\;and\;DMSO)$ and at 0.01M of ionic strength. The equilibrium constants for the ligation reactions of methalloporphyrins were determined using spectrophotometric method at 15∼35${\circ}C$. In case of M(II)-TPP the equilibrium constants K were considerably larger than those of M(II)-(o-Cl)TPP, depending on steric effect of the porphyrin. The linear relationships between logK of the axial ligation and $pK_a$ of nitrogenous base were shown in M(II)-TPP, but not in M(II)-(o-Cl)TPP. The stabilities of MTPP(L) were controlled by the reation enthalpy and entropy, while those of M(o-Cl)TPP almost by the reaction entropy. The coordinating power of solvent to the methalloporphyrin were also studied in $CHCl_3,\;(CH_3)_2CO$, DMF and DMSO. From those results the solvent effects on the equilibrium constants were discussed.

• Journal of Environmental Science International
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• v.8 no.4
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• pp.491-496
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• 1999

Removal of Cu(II), Cr(III) and Pb(II) ions from aqueous solutions using the adsorption process on the loesses has been investigated. Variations of contact time, pH, adsorption isotherms and selectivity of coexisting ions were experimental parameters. pH of KJ and YIK samples diluted to 1% solution, was rearly the same with each value of pH 5.58 and 5.49, and both samples showed weak acidic properties. From chemical analysis, both samples contain remarkably different amounts of ${SiO}_{2}$, ${Al}_{2}O_{3}$ and ${Fe}_{2}O_{3}$. From XRD measurement, quartz was mainly observed in both samples. Kaolinite was also observed, also in both samples, but Feldspar was only observed in KJ sample. Adsorption of metal ions on the loesses were reached at equilibrium by shaking for about 30min. The adsorption of Cr(III) ion was higher than that of Cu(II) oand Pb(II) ions. The order of amount adsorbed among the investigated ions was Cr(III)>Pb(II)>Cu(II). In acidic solution, the adsorptivity of loesses was increased as pH increased. The adsorption of Cr(III) ion on the loesses were fitted to the Freundlich isotherms. Freundlich constants(1/n) of KJ and YIK loesses were 0.54 and 0.55, respectively.

• Journal of the Korean Ceramic Society
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• v.40 no.5
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• pp.447-454
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• 2003

Samples were prepared by the solid-state reaction method. The nominal composition of the samples was B $i_{1.84}$P $b_{0.34}$S $r_{1.91}$C $a_{2.03}$C $u_{3.06}$ $O_{10+{delta}$ prepared from powder of B $i_2$ $O_3$, PbO, SrC $O_3$, CaC $O_3$, and CuO. They were pulverized, mixed with AgO, A $u_2$ $O_3$and MgO of 50 wt%. Finally, they were sintered at 820 to 85$0^{\circ}C$ in air. The structural characteristics, the microstructure of surface and the critical temperature with respect to the each samples were analyzed by XRD, $T_{c}$, SEM and EDS respectively. It was found that the the critical temperature of the silver oxide additive samples (99.58 K) is higher than those of gold or magnesium oxides additive samples, but all those values are lower than that of pure Bi-2223 phase. The microstructure of surface showed the tendency which the AgO additive samples become more minuteness than A $u_2$ $O_3$ and MgO additive samples.s.samples.s.

• Transactions on Electrical and Electronic Materials
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• v.12 no.2
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• pp.72-75
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• 2011

In this study, $(K_{0.5}Na_{0.5})(Nb_{0.97}Sb_{0.03})O_3+0.9$ mol% $K_{5.4}Cu_{1.3}Ta_{10}O_{29}+x$ mol% $K_4CuNb_8O_{23}$ (x = 0, 0.2, 0.6, 0.8) ceramics were prepared by a conventional mixed oxide method. Their microstructure and electric properties were investigated. The secondary phase was made by virtue of $K_4CuNb_8O_{23}$ (KCN) addition in the $(K_{0.5}Na_{0.5})(Nb_{0.97}Sb_{0.03})O_3$ system ceramics. However, the sinterability of the ceramics increased with increasing $K_4CuNb_8O_{23}$ content. At the 0.6 mol% $K_4CuNb_8O_{23}$ added composition ceramics sintered at $1,060^{\circ}C$, kp and $d_{33}$ showed the optimum values of 0.39 and 145 pC/N, respectively, suitable for piezoelectric actuator application.

• Bulletin of the Korean Chemical Society
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• v.27 no.10
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• pp.1572-1576
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• 2006

A dimeric precursor, $[Cu(dmae)(OCOCH_3)(H_2O)]_2$ for the CVD of copper metal films, (dmaeH = N,N-dimethylaminoethanol) was synthesized by the reaction of copper(II) acetate monohydrate ($Cu(OCOCH_3)_2{\cdot}H_2O$) and dmaeH in toluene. The product was characterized by m.p. determination, elemental analysis and X-ray crystallography. Molecular structure of $[Cu(dmae)(OCOCH_3)(H_2O)]_2$ shows that a dimeric unit $[Cu(dmae)(OCOCH_3)(H_2O)]_2$ is linked to another through hydrogen bond and it undergoes facile decomposition at 300 C to deposit granular copper metal film under nitrogen atmosphere. The decomposition temperature, thermal behaviour, kinetic parameters, evolved gas pattern of the complex, morphology, and the composition of the film were also investigated.