• Journal of the Computational Structural Engineering Institute of Korea
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• v.17 no.3
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• pp.241-249
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• 2004

There is an over head hoist transporter(OHT) by the system for delivering the wafer in semiconductor processing. The transfer system consist of carrier, vehicle, rail and support. The Tail supporting the wafer and the transfer system should maintain enough strength and stiffness. To achieve lightness and enough strength and stiffness, optimization algorithm should be introduced in design process. In this study, two kinds of section shapes as L-type, C-type is carried out the structure analysis and optimization. Total weight of rail is to be minimized while displacement should not exceed limit. To improve the initial model, topology optimization is done by the plain problem. Size optimization is done with 3D solid element and PLBA algorithm, the RQP algorithm. The weight of optimum model as L-type, C-type is decreased by 2.3%, 10% respectively. It is improved better than the initial model in the strength and stiffness of the structure.