• Journal of the Korean Vacuum Society
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• v.10 no.2
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• pp.164-172
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• 2001

We measured the pumpdown curves of an A5083 vacuum chamber and analyzed the outgassing in terms of desorption energies of water. The outgassing curves follow a ~$t^{-1.15}$ behavior before bakeout, which can be described by the first-order desorption of water molecules in the oxide layer. Analysis of the curves reveals that there exist several adsorption sites on the surface for water in the pressure range of ~$10^{-5}\;-\;10^{ -8}$Torr. Measurements utilizing the throughput method show that the room temperature outgassing rate is ~1{\times}10^{-13}$ Torr $\ell$/s $\textrm{cm}^2$ after 24 - h bakeout at $100^{\circ}C$.

• Journal of the Korean Vacuum Society
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• v.12 no.4
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• pp.201-206
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• 2003

A residual gas analyzer was used to study the outgassing behavior of stainless steel 304 chamber as a function of bake-out temperature up to $235 ^{\circ}C$ and to identify the gas species evolved during turn on and degassing of the three different types of hot cathode ionization gauges. It was found that $H_2O$, CO, and $H_2O$ were the dominent outgassing species in the vacuum chamber during bake-out but finally $H_2$ and CO(mass 28) persisted at room temperature. Dominant outgassing species were also $H_2$ and $H_2O$ while fuming on the ionizations and then $H_2$,$H_2O$ and CO were found to be the main species degassed gauges. It was appeared that the outgassing species and quantity were not agreed to the three different types of hot cathode ionization gauges.

• Transactions on Electrical and Electronic Materials
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• v.14 no.6
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• pp.334-338
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• 2013

In this study, the outgassing effects of selected vacuum materials on the vacuum characteristics were simulated by the $VacSim^{Multi}$ simulation tool. This investigation examined the feasibility of reliably simulating the outgassing characteristics of common vacuum chamber materials (aluminum, copper, stainless steel, nickel plated steel, Viton A). The optimum design factors for these vacuum systems were suggested based on the simulation results. The baking-out effects of the modeled systems and materials on the performance of the vacuum system were also analyzed. The simulation predicted that the overall outgassing effect was more significant in the turbomolecular pump system than in the diffusion pump system and that the utilization of a booster pump has a greater effect on the evacuation time than on the ultimate pressure.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.621-624
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• 2002

In this study, outgassing characteristics of MgO films, and the plasma cleaning effects of the deposited MgO films by atmospheric pressure plasma on outgassing rate were compared. The MgO layer was heated up to 350 $^{\circ}C$ and the outgassing characteristics were observed for the heated conditions. As the main impurity species $H_2,\;H_2O,\;N_2,\;CO_2,\;and\;H_2O$ were released from this panel. Impurity species of plasma treatment panel were lower than non-treated panels for the heating temperature

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.224-224
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• 2012

위성체가 작동하는 우주환경인 고진공상태에서는 위성체의 부품에서 발생 할 수 있는 outgassing으로 인해 위성체가 오염되어 위성체의 성능이 저하될 수 있으며, 특히 이차면경(second surface mirror) 및 광학렌즈 등을 오염시킴으로써 위성체 본연의 임무수행 실패라는 결과를 초래할 수도 있다. 따라서 지상에서 위성체의 부품에 대해 고온($85^{\circ}C$ 이상)과 고진공($5.0{\times}10-3Pa$ 이하)의 상태를 모사하여 오염물질을 제거함으로써 outgassing의 발생을 막고, 아울러 오염근원을 검출할 수 있는 vacuum bake-out 시험이 필수적이라 할 수 있다. 이를 위해서 한국항공우주연구원 위성시험동에는 전용 bake-out 챔버가 설치되어 있으며 저진공용 dry pump와 booster pump를 이용하여 5.0 Pa의 저진공을 형성하고, 2대의 cryopump를 이용하여 $5.0{\times}10-3Pa$ 이하의 고진공을 생성하게 되는데, Bake-out 챔버의 진공 배기시스템에 대하여 자세히 알아보고자 한다.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.8
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• pp.112-118
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• 2009

A pressure rise is generated while air bearing stages are moving in high vacuum environment. This study analyzed this pressure rise phenomenon theoretically and verified it experimentally using two different kinds of stages - linear and rotary air bearing stages. Results indicate that the pressure rise was caused by additional leakage resulting from stage velocity, along with adsorption and outgassing of gas molecules from the guide rail surface. Though tilting of the stage due to acceleration and deceleration reached several micrometers, it had a negligible effect on pressure rise because the tilting time was very short. Therefore, a rotary air bearing stage showed much less pressure rise than a linear stage because the rotary stage theoretically has nothing to do with the above causes. Additional leakage caused by stage velocity was inevitable if the stage had movements, but pressure rise caused by adsorption and outgassing could be suppressed by improving the surface quality to reduce real surface area, and by coating the guide rail surface with titanium nitride (TiN) which has less adhesion probability of gas molecules. The results also indicate that the pressure rise increased when the air bearing stage operated under high vacuum conditions.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.11
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• pp.961-968
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• 2009

In this work, transparent conductive oxide(TCO) films such as $In_2O_3-SnO_2$(ITO) and $In_2O_3-ZnO$(IZO) were prepared on polyethylene naphthalene(PEN) and glass substrates by using rf-magnetron sputtering system. The TCO films deposited on PEN substrate show very poor conductivity as compared to that of the TCO films deposited on glass substrates. From the results of the residual gas analysis(RGA) test, this poor stability of plastic substrate is presumed to be caused by the deteriorated adhesion between the TCO films and the plastic substrate due to outgassing from the plastic substrate during deposition of TCO films. From our experiment, it is found that the vaporization of some defects in the plastic substrates deteriorate the adhesion of the TCO films to the plastic substrate, because the most plastic substrates containing the water vapor and/or other adsorbed particles such as organic solvents. Mixing of these gases vaporized in the sputtering process will also affect the electrical property of the deposited TCO films. Inorganic thin composite $(SiO_2)_{40}(ZnO)_{60}$ film as a gas barrier layer is coated on the PEN substrate to protecting the diffusion of vapors from the substrate, so that the TCO films with an improved quality can be obtained.

• Journal of the Korean Vacuum Society
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• v.11 no.2
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• pp.87-96
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• 2002

Outgassing from such sources as paints, coatings, adhesives and other non-metallic surfaces can contaminate satellites, especially second surface mirror and optical lens, it cause satellite to fail in own missions. The vacuum bake-out test using high temperature(more than $85 ^{\circ}C$)and high vacuum(less than $5.0{\times}1-^{-3}$ Pa) certify that the components of satellite work properly and can survive and operate in space environment like high vacuum. In the bake-out chamber installed at SITC of KARI, Rotary vacuum pump and Booster pump produce low vacuum of 5.0 Pa, and then two cryopumps produce high vacuum of below $5.0{\times}10^{-3}$ Pa. Also 48 ceramic heaters were provided to simulate high temperature. During the vacuum bake-out test, we detected contaminants using RGA(Residual Gas Analyzer) and measure the outgassing rate of the contaminant using the TQCM(Thermoelectric Quartz Crystal Microbalance). Also, IR/UV Spectrometer and witness plate be used to certify that the components were suitable for the spacecraft. This paper includes the preparation and procedures of the bake-out test for SAR(Solar Array Regulator) and MLI(Multi Layer Insulator), which were the components of the spacecraft. Especially, we discussed the methods and results of the contamination measurement. In the bake-out for SAR, the contamination was measured continuously although it was on the decrease from TQCM results. And RCA established that it is a highly polymerized compound. In the MLI bake-out using RGA and witness plate, we didn't detect any contamination materials.

• Bulletin of the Korean Space Science Society
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• 2003.05b
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• pp.26-26
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• 2003

• Proceedings of the Korean Vacuum Society Conference
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• 1995.06a
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• pp.59-60
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• 1995