• Proceedings of the Korean Institute of Building Construction Conference
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• 2023.11a
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• pp.211-212
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• 2023

Polishing tiles among porcelain tiles are more durable and aesthetic than ceramic tiles, so their demand has recently increased. In particular, since polishing tiles have a very low absorption rate, organic adhesives with chemical bonds are mainly used. However, organic adhesives have low economic efficiency and some volatile organic compounds (TVOCs). Therefore purpose of this study was to evaluate the performance of polishing tile adhesion by developing organic-inorganic adhesives, which have chemical bonds and mechanical bonds. As a result, since the amorphous chain and chemical bonds of the polymer in the tile adhesives, both tensile and shear adhesion strength were satisfied with the KS L 1592, KS L 1593, and the rate of length change itself in the thermal cycling was lower than organic adhesives. So it is thought that it is possible to replace some organic adhesives.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2018.11a
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• pp.79-80
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• 2018

Recently, the interest in remodeling of new and old buildings is increasing worldwide. As a result, the frequency of use of architectural adhesives has increased. Currently, adhesives used in buildings are made of organic materials in most cases, and epoxy resin adhesives are most widely used. However, epoxy resin adhesives contain formaldehyde and VOCs in the room during construction, which can cause sick house syndrome. In case of building fire, it may cause damage due to carbon monoxide generated from organic materials. It is urgent to study the problem of epoxy fill adhesive made of such organic materials. Therefore, the purpose of this study is to investigate the effect of the adhesion of epoxy resin adhesive, which is a problem of epoxy resin adhesive, which is an existing organic adhesive by using inorganic materials such as magnesia and phosphate, And the inorganic adhesive which does not emit the release amount as an inorganic material.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2018.11a
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• pp.48-49
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• 2018

Recently the old buildings have been increasing and increasing reconstruction. As a result, the frequency of use of architectural adhesives has increased. Adhesives are not only used for bonding but also for building materials used in various fields. However, since the adhesive is made of an organic material, it causes various skin diseases and sick house syndrome, and when a fire occurs, harmful substances are generated, and incomplete combustion may cause personal injury. Therefore, in this study, to solve the disadvantages of conventional adhesives, we tried to develop inorganic adhesives using inorganic materials.

• Journal of the Korea Institute of Building Construction
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• v.19 no.4
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• pp.289-297
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• 2019

Epoxy resin adhesives are currently used as adhesives in buildings. Epoxy resin adhesives, which are organic materials, generate harmful substances when producing adhesives, and toxic substances are high in the residential space after installation. In addition, a large amount of carbon monoxide generated from organic materials in the case of a building fire leads to personal injury. This study evaluates the feasibility of inorganic adhesives using pure inorganic materials such as magnesia, phosphate, and borax as inorganic adhesives to replace existing organic adhesives. As a result of the experiment on the selection of adequate phosphate and the characteristics of the addition rate of borax used as a retarder, the potassium phosphate monobasic was obtained as a suitable phosphate and the characteristics according to the borax addition rate were compared with the quality standard of KS F 4923 The hardening shrinkage and heat change rate satisfied the quality standards. The tensile strength was satisfactory when the borax addition rate was 4% or more, but the adhesive strength did not meet the quality standards. Further studies are needed to improve adhesion strength.

• 한국문화재보존과학회:학술대회논문집
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• 2005.03a
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• pp.1-11
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• 2005

No one can tell when, exactly, the conservation of potteries & ceramics began, however, according to the documents, it has a long history. Among the materials discovered up to the present, organic adhesives extracted from animals and plants such as bitumen were mainly used and resin, in 19th century, as well. As for inorganic adhesives, clay, lime and plaster were used as well as rivet, as one of mechanical methods. According to the conservation case studies in Korea, lacquer and gilding powdered gold were applied as treatment methods in some ceramics, but, in general, plaster and resins were used widely.

• Journal of Conservation Science
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• v.26 no.1
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• pp.85-94
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• 2010

Color stable hydrogenated bisphenol-A (HBA) epoxy adhesives containing organic-inorganic hybrid nanocomposites were prepared and investigated the properties. Isophorone-diamine (IPDA) was used as a hardener and polyhedral organomeric silsesquioxanes (POSS; EP0408 and EP0409) having epoxy function groups were used to tailor adhesives in the nanoscale range. The dependence of the concentration of different nano materials were studied since the large surface area of the nanosized particles can cause significant changes in properties of adhesives. HBA-IPDA adhesives containing different amount of nanomaterials have been applied to the fresh Namsan granite and compared with those of commercial adhesives, which have problems of color change as well as a high viscosity. The mechanical properties of HBA-IPDA containing POSSs are consistent with those of commercial adhesives in addition to the low viscosity.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.29 no.3
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• pp.7-16
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• 1997

The constituents of deposits on paper machine and holes/spots in paper have been studied by consequently a combination of analytical techniques, such as FTIR, Py-GC-MS, and. EDS. FTIR spectroscopy was used prior to Py-GC-MS and EDS analysis, as preliminary analysis technique. The analysis of organic components were carried out with the use of a pyrolysis unit connected to a GC-MS, and inorganic components in ash were analysed by SEM equipped with an EDS analyzer after pyrolysis at 59$0^{\circ}C$. The deposits on the dryer section were complex pitch, which was the mixture of the organic contents of fatty acid ester and starch, and the inorganic contents of talc, clay, and calcium carbonate. The complex pitch was estimated to come from the coated broke. We knew the deposits on the metering rod of sym-sizer were associated with the interaction of unstable AKD and CaCO$_3$. The compositions of holes or spots varied considerably and were associated with chemical interaction within the system. The holes, spots, and blotches in the finished paper were PE and PP that were streamed out from pulp sources, complex pitch that were caused by the interaction of the different additives in the system, polymer such as flexible PVC that used for the prop of palette, and hot melt as adhesives that came from the inadequate handling of broke. In addition, we identified that poly(caprolactam) which is used for forming fabrics or press felts, could be mixed with the raw materials by accident and results in streak on coating.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• Applied Chemistry for Engineering
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• v.9 no.1
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• pp.135-140
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• 1998

The constituents of deposits on paper machine and holes/spots in paper have been analyzed by a combination of analytical techniques, such as FTIR, Py-GC-MS, and EDS. FTIR spectroscopy was used prior to Py-GC-MS and EDS analysis, as a preliminary analysis. The analysis of organic components was carried out with a pyrolysis unit connected to a GC-MS, and inorganic components in ash were analyzed by SEM equipped with an EDS analyzer after pyrolysis at $590^{\circ}C$. The deposits on the dryer section were complex pitch, which was the mixture of the organic components of fatty acid ester and starch, and the inorganic components of talc, clay, and calcium carbonate. The complex pitch was estimated to come from the coated broke. We knew the deposits on the metering rod of sym-sizer were associated with the interaction of unstable alkyl keten dimer(AKD) and $CaCO_3$. The compositions of holes or spots varied considerably and were associated with chemical interaction within the system. The holes, spots, and blotches in the finished paper were PE and PP from pulp sources, complex pitch that were caused by the interaction of the different additives in the system, polymer such as flexible PVC that was used for the prop of palette, and hot melt as adhesives that came from the inadequate handling of broke. In addition, we identified that poly(caprolactam) which is used for forming fabrics or press felts, could be mixed with the raw materials by accident and results in streaks on coating.

• Journal of Conservation Science
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• v.35 no.4
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• pp.295-307
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• 2019

In the process of the conservation treatment of the glass eyes of the stone standing Maitreya of Daejosa temple, Buyeo (Treasure No. 217), a blackish material, expected to be the adhesive for fixing the glass eyes, was collected and analyzed. Infrared spectroscopy and pyrolysis/gas chromatography/mass spectrometry (pyrolysis/GC/MS) were employed to identify the organic material in the sample. The IR analysis revealed the presence of materials such as apatite or bone black. The pyrogram of the sample was similar to that of Asian lacquer, among traditional adhesives. In particular, the pyrolysis/GC/MS analysis with online methylation detected 1,2-dimethoxy-3-pentadecylbenzene, methyl 7-(2,3- dimethoxyphenyl) heptanoate, and methyl 8-(2,3-dimethoxyphenyl)octanoate. These are known to be the pyrolysis products of catechol and its oxidation product, which indicated the presence of Asian lacquer in the sample. X-ray diffraction, X-ray fluorescence, and thermal gravimetry analysis showed that the sample contained ca. 60% inorganic substances, including apatite. Radiocarbon dating of the sample suggested that the blackish material was applied between the late 13^th and early 15^th century, revealing some discrepancy with the art-historical manufacturing time of the Maitreya. From the above analysis, it was concluded that Asian lacquer and bone ash were used to attach the glass eyes by forming a thick blackish lacquer layer.