• Title/Summary/Keyword: open packaging

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Analytical Model for Predicting Degassing Pressure of the One Way Valve with Ring Type Rubber Disk for Packaging (포장용 링타입 고무막 One-way 밸브의 가스배출압력 예측을 위한 수학적 분석 모델)

  • Oh, Jae Young;Lee, Jin Yong;Yu, Ha Kyoung
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.22 no.2
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    • pp.33-37
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    • 2016
  • One-way degassing valves usually designed for coffee packaging are recently applied to the various food packaging such as fermented health functional food or home meal replacement (HMR) packaging. The optimized degassing pressure by food product is important factor for keeping effective freshness and improving preservation of the food, therefore the development of degassing valves specified with various open pressure is needed. In this study, the mechanical characteristics of the degassing valve with ring type rubber disk were analyzed and a mathematical model was developed to predict the open pressure of the valve. The model was verified with test results derived from several available valves, and it may be useful in designing and developing a new valve.

A Study on a In-mold Packaging Process using Injection Molding (사출성형을 이용한 마이크로 채널의 패키징 공정에 관한 연구)

  • Lee, Kwan-Hee;Park, Duck-Soo;Yoon, Jae-Sung;Yoo, Yeong-Eun;Choi, Doo-Sun;Kim, Sun-Kyoung
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1821-1824
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    • 2008
  • A novel in-mold packaging process has been developed to manufacture devices with closed channels. In this unified process, fabrication of open channels and forming the rigid cover on top of them are sequentially integrated in the same mold. The entire process is comprised of two phases. In the first phase, the open channels are fabricated under an exquisitely controlled temperature and pressure using the conventional micro injection molding technology. In the second phase, the closed channels are fabricated by conducting the injection molding process using the molded structure with the open channels as a mold insert. As a result, the in-mold technology can eliminate the bonding processes such as heating, ultrasonic or chemical processes for cohesion between the channel and the cover, which have been required in conventional methods.

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