• Title/Summary/Keyword: nitrogen defect

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저온 공정 온도에서 $Al_2O_3$ 게이트 절연물질을 사용한 InGaZnO thin film transistors

  • 우창호;안철현;김영이;조형균
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.11-11
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    • 2010
  • Thin-film-transistors (TFTs) that can be deposited at low temperature have recently attracted lots of applications such as sensors, solar cell and displays, because of the great flexible electronics and transparent. Transparent and flexible transistors are being required that high mobility and large-area uniformity at low temperature [1]. But, unfortunately most of TFT structures are used to be $SiO_2$ as gate dielectric layer. The $SiO_2$ has disadvantaged that it is required to high driving voltage to achieve the same operating efficiency compared with other high-k materials and its thickness is thicker than high-k materials [2]. To solve this problem, we find lots of high-k materials as $HfO_2$, $ZrO_2$, $SiN_x$, $TiO_2$, $Al_2O_3$. Among the High-k materials, $Al_2O_3$ is one of the outstanding materials due to its properties are high dielectric constant ( ~9 ), relatively low leakage current, wide bandgap ( 8.7 eV ) and good device stability. For the realization of flexible displays, all processes should be performed at very low temperatures, but low temperature $Al_2O_3$ grown by sputtering showed deteriorated electrical performance. Further decrease in growth temperature induces a high density of charge traps in the gate oxide/channel. This study investigated the effect of growth temperatures of ALD grown $Al_2O_3$ layers on the TFT device performance. The ALD deposition showed high conformal and defect-free dielectric layers at low temperature compared with other deposition equipments [2]. After ITO was wet-chemically etched with HCl : $HNO_3$ = 3:1, $Al_2O_3$ layer was deposited by ALD at various growth temperatures or lift-off process. Amorphous InGaZnO channel layers were deposited by rf magnetron sputtering at a working pressure of 3 mTorr and $O_2$/Ar (1/29 sccm). The electrodes were formed with electron-beam evaporated Ti (30 nm) and Au (70 nm) bilayer. The TFT devices were heat-treated in a furnace at $300^{\circ}C$ and nitrogen atmosphere for 1 hour by rapid thermal treatment. The electrical properties of the oxide TFTs were measured using semiconductor parameter analyzer (4145B), and LCR meter.

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The Effect of Blue Light Interception and SPF Boosting of Sunscreen Prepared with Bandgap-controlled TiO2 (밴드갭이 제어된 TiO2 를 이용한 자외선 차단제의 블루라이트 차단 및 SPF 부스팅 효과)

  • Sung Eun Wang;Jung Kyung Yoon;Gui Su Chung;Sung Bong Kye;Ho Sik Rho;Dae Soo Jung
    • Journal of the Society of Cosmetic Scientists of Korea
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    • v.49 no.2
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    • pp.159-167
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    • 2023
  • Titanium dioxide (TiO2) is commonly used in sunscreen formulations to protect the skin surface and prevent the penetration of harmful ultraviolet (UV) rays by the physical scattering action of light. However, a disadvantage of using TiO2 is that it can cause white turbidity when used on skin due to its inactive mineral ingredient. In addition, when TiO2 particles are reduced to nanosize to eliminate opacity, they can increase the transmittance of visible light and reduce whitening, but may lead to serious skin problems, such as allergic inflammation. To overcome these issues, the bandgap of TiO2 was controlled by adjusting the amount of oxygen defect and nitrogen amount, resulting in color TiO2 tailored to the skin. This innovative technology can reduce the whitening phenomenon and effectively block blue light, which is known to cause skin aging by inducing active oxygen. The bandgap controlled TiO2 compounds proposed in this study are hypoallergenic, broad-spectrum, and environmentally friendly. Furthermore, these compounds have been shown to significantly enhance sun protection factor (SPF) of sunscreens, demonstrating their compatibility with blue light blocking products.

The role of porous graphite plate for high quality SiC crystal growth by PVT method (고품질 4H-SiC 단결정 성장을 위한 다공성 흑연 판의 역할)

  • Lee, Hee-Jun;Lee, Hee-Tae;Shin, Hee-Won;Park, Mi-Seon;Jang, Yeon-Suk;Lee, Won-Jae;Yeo, Im-Gyu;Eun, Tai-Hee;Kim, Jang-Yul;Chun, Myoung-Chul;Lee, Si-Hyun;Kim, Jung-Gon
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.25 no.2
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    • pp.51-55
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    • 2015
  • The present research is focused on the effect of porous graphite what is influenced on the 4H-SiC crystal growth by PVT method. We expect that it produces more C-rich and a change of temperature gradient for polytype stability of 4H-SiC crystal as adding the porous graphite in the growth cell. The SiC seeds and high purity SiC source materials were placed on opposite side in a sealed graphite crucible which was surrounded by graphite insulator. The growth temperature was around $2100{\sim}2300^{\circ}C$ and the growth pressure was 10~30 Torr of an argon pressure with 5~15 % nitrogen. 2 inch $4^{\circ}$ off-axis 4H-SiC with C-face (000-1) was used as a seed material. The porous graphite plate was inserted on SiC powder source to produce a more C-rich for polytype stability of 4H-SiC crystal and uniform radial temperature gradient. While in case of the conventional crucible, various polytypes such as 6H-, 15R-SiC were observed on SiC wafers, only 4H-SiC polytype was observed on SiC wafers prepared in porous graphite inserted crucible. The defect level such as MP and EP density of SiC crystal grown in the conventional crucible was observed to be higher than that of porous graphite inserted crucible. The better crystal quality of SiC grown using porous graphite plate was also confirmed by rocking curve measurement and Raman spectra analysis.