• Title/Summary/Keyword: nitride

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Study of a large-area graphene transistor on a CaF2 substrate using a full-coverage polymer film as an additional dielectric

  • Yoojoo Yun;Jinseok Oh;Yoonhyuck Yi;Hyunkyung Lee;Byeongwan Kim;Haeyong Kang
    • Journal of the Korean Physical Society
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    • v.81
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    • pp.942-947
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    • 2022
  • We report the electrical transport properties of a dual-gate graphene device placed on a CaF2 substrate. A hexagonal boron nitride top-gate dielectric was introduced to confirm the electrical characteristics of the CaF2/graphene transistor because it is difficult to inject sufficient carriers through the CaF2 substrate owing to its thickness of 500 ㎛, and the typical ambipolar behavior of graphene with a slight n-doping effect was clearly observed. In addition, we used a polymethyl methacrylate (PMMA) film as a top-gate dielectric for large-scale graphene devices grown via chemical vapor deposition, which was transferred onto a CaF2 substrate. We controlled the high gate leakage current caused by the breakdown of the polymer due to non-uniformity by applying the film-transfer process rather than the direct coating method on the graphene device. Furthermore, the transport properties of large-area graphene in contact with CaF2 are discussed with respect to the effect of top-contacted PMMA.

Characterization of GaN thick layer grown by the HVPE: Comparison of horizontal with vertical growth

  • Lai, Van Thi Ha;Jung, Jin-Huyn;Oh, Dong-Keun;Choi, Bong-Geun;Eun, Jong-Won;Lim, Jee-Hun;Park, Ji-Eun;Lee, Seong-Kuk;Yi, Sung;Shim, Kwang-Bo
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.18 no.3
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    • pp.101-104
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    • 2008
  • GaN films were grown on the vertical and horizontal reactors by the hydride vapour phase epitaxy (HVPE). The structural and optical characteristics of the GaN films were investigated depending on the reactor-type. GaN epilayers were characterized by double crystal X-ray diffraction (DC-XRD), transmission electron microscopy (TEM) and photoluminescence (PL). Surface defects of two kinds of the GaN films were revealed by the wet chemical etching method, using $H_3PO_4$ acid at $200^{\circ}C$ for 8 minutes. Hexagonal etch pits were analyzed by optical microscopy and SEM. Etch pit densities were calculated to be approximately $1.4{\times}10^7$ and $1.2{\times}10^6\;cm^{-2}$ for GaN layers grown on horizontal and vertical reactors, respectively. Those results show GaN grown in the vertical reactor having a better quality of optical properties and crystallinity than that in the horizontal reactor.

Sliding Wear Properties of Carbon Fiber Reinforced $Si_3N_4$ Ceramics (탄소섬유강화 질화규소 세라믹스의 마찰마모 특성)

  • Park Yi-Hyun;Yoon Han-Ki;Kim Bu-Ahn;Park Won-Jo
    • Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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    • 2004.05a
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    • pp.347-351
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    • 2004
  • [ $Si_3N_4$ ] composites have been extensively studied for engineering ceramics, because it has excellent room and high temperature strength, wear resistance properties, good resistance to oxidation, and good thermal and chemical stability. In the present work, carbon short fiber reinforced $Si_3N_4$ ceramics were fabricated by hot press method in $N_2$ atmosphere at $1800^{\circ}C$ using $Al_2O_3\;and\;Y_2O_3$ as sintering additives. Content of carbon short fiber was $0\%,\;0.1\%\;and\;0.3\%$. The composites were evaluated in terms of density, flexural strength and elastic modulus through the 3-point bending test at room temperature. Also, The wear behavior was determined by the pin on disk wear tester using silicon nitride ball. Experimental density and flexural strength decreased with increasing content of carbon fiber. But specific modulus increased with increasing content of carbon fiber. In addition, friction coefficient and specific wear loss decreased with increasing content of carbon short fiber by reason of interfacial defects between matrix and fiber.

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Strength Properties and Elastic Waves Characteristics of Silicon Carbide with Damage-Healing Ability (손상치유 능력을 가지는 탄화규소의 강도 특성과 탄성파 특성)

  • KIM MI-KYUNG;AHN BYUNG-GUN;KIM JIN-WOOK;PARK IN-DUCK;AHN SEOK-HWAN;NAM KI-Woo
    • Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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    • 2004.05a
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    • pp.337-341
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    • 2004
  • Engineering ceramics have superior heat resistance, corrosion resistance, and wear resistance. Consequently, these art significant candidates for hot-section structural components of heat engine and the inner containment of nuclear fusion reactor. Besides, some of them have the ability to heal cracks and great benefit can be anticipated with great benefit the structural engineering field. Especially, law fracture toughness of ceramics supplement with self-healing ability. In the present study, we have been noticed some practically important points for the healing behavior of silicon nitride, alumina, mullite with SiC particle and whisker. The presence of silicon carbide (SiC) in ceramic compound is very important for crack-healing behavior. However, self-healing of SiC has not been investigated well in detail yet. In this study, commercial SiC was selected as sample, which can be anticipated in the excellent crack healing ability. The specimens were produced three-point bending specimen with a critical semi-circular crack of which size that is about $50-700{\mu}m$. Three-point bending test and static fatigue test were performed cracked and healed SiC specimens. A monotonic bending load was applied to cracked specimens by three-point loading at different temperature. The purpose of this paper is to report Strength Properties and Elastic Waves Characteristics of Silicon Carbide with Crack Healing Ability.

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A Study on the Properties of AlN Films Deposited with Nitrogen Ion Beam Assisted RF Magnetron Sputtering (질소이온 빔 보조 마그네트론 스퍼터로 증착 된 AlN 박막의 물성연구)

  • Heo, Sung-Bo;Lee, Hak-Min;Jeong, Chul-Woo;Choi, Dae-Han;Lee, Byung-Hoon;Kim, Min-Gyu;You, Yong-Zoo;Kim, Daeil
    • Journal of the Korean Society for Heat Treatment
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    • v.24 no.2
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    • pp.77-81
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    • 2011
  • Aluminum nitride (AlN) thin films were prepared by using nitrogen ion beam assisted reactive radio frequency (RF) magnetron sputtering on the glass substrates without intentional substrate heating. After deposition, the effect of nitrogen ion beam energy on the structural and optical properties of AlN films were investigated by x-ray diffraction (XRD), atomic force microscope (AFM) and UV-Vis. spectrophotometer, respectively. AlN films deposited with $N^+$ ion irradiation at 100 eV show the higher (002) peak intensity in XRD pattern than other films. It means that $N^+$ ion energy of 100 eV is the favorable condition for low temperature crystallization. AFM images also show that surface average roughness is increased from 1.5 to 9.6 nm with $N^+$ ion energy in this study. In an optical observation, AlN films which deposited by $N^+$ ion beam energy of 100 eV show the higher transmittance than that of the films prepared with the other $N^+$ ion beam conditions.

Flexural Strength and Dielectric Properties of in-situ Si3N4-SiO2-BN Composite Ceramics (반응소결된 Si3N4-SiO2-BN 복합체의 기계적 강도 및 유전물성에 관한 연구)

  • Lee, Hyun Min;Lee, Seung Jun;Baek, Seungsu;Kim, Do Kyung
    • Journal of the Korean Ceramic Society
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    • v.51 no.5
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    • pp.386-391
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    • 2014
  • Silicon nitride ($Si_3N_4$) is regarded as one of the most promising materials for high temperature structural applications due to its excellent mechanical properties at both room and elevated temperatures. However, one high-temperature $Si_3N_4$ material intended for use in radomes has a relatively high dielectric constant of 7.9 - 8.2 at 8 - 10 GHz. In order to reduce the dielectric constant of the $Si_3N_4$, an in-situ reaction process was used to fabricate $Si_3N_4-SiO_2$-BN composites. In the present study, an in-situ reaction between $B_2O_3$ and $Si_3N_4$, with or without addition of BN in the starting powder mixture, was used to form the composite. The in-situ reaction process resulted in the uniform distribution of the constituents making up the composite ceramic, and resulted in good flexural strength and dielectric constant. The composite was produced by pressure-less sintering and hot-pressing at $1650^{\circ}C$ in a nitrogen atmosphere. Microstructure, flexural strength, and dielectric properties of the composites were evaluated with respect to their compositions and sintering processes. The highest flexural strength (193 MPa) and lowest dielectric constant (5.4) was obtained for the hot-pressed composites. The strength of these $Si_3N_4-SiO_2$-BN composites decreased with increasing BN content.

An Evaluation of Skiving Cutting Characteristics of TiCN PACVD Coating Caribide Hob (TiCN PACVD코팅 초경호브의 Skiving절삭특성 평가)

  • Cheon, Jong-Pil
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.13 no.2
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    • pp.471-477
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    • 2012
  • SCM420 steel tempered after performing gear hove PACVD carbide coating on the surface after the cutting surface hardness was high. Difficult-to-cut, without coating is classified as mild as large, including materials like mild, high strength that improves tool life and productivity have limited availability. Drive to improve it in the TiCN-coated carbide call for war to the finish coating on cutting a hob skiving good workability, tool wear less, 2.5-fold increase in tool life results were obtained. Experiments using CNC Skiving hobbing machine with wet cutting conditions, cutting speed and feed rate to apply a variety of the tool wear and surface roughness data were obtained. Results from condition 2 (V = 200m/min F = 0.7mm/rev) cutting speed feed mark the cutting surface microstructure and surface roughness Rmax $4.7{\mu}m$(Ra $1.19{\mu}m$) of the data was obtained.

DC 반응성 마그네트론 스퍼터링으로 증착한 TaN 박막의 특성 및 신뢰성

  • Jang, Chan-Ik;Lee, Dong-Won;Jo, Won-Jong;Kim, Sang-Dan;Kim, Yong-Nam
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.310-310
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    • 2012
  • 최근 전자산업의 발달에 따른 전자제품의 소형화 및 고기능화 요구에 대응하기 위하여 저항(resistor), 커패시터(capacitor), IC (integrated circuit) 등의 수동소자를 개별 칩(discrete chip) 형태로 형성하여 기판의 표면에 실장하는 기술이 일반화되고 있다. 그러나, 수동 소자의 내장 기술은 기판의 패턴 밀도의 급격한 향상과 더불어 수동소자의 내장 공간도 협소해지는 문제점이 있다. 상기의 문제점을 해결하기 위해 개별 칩 형태의 내장형 저항체를 박막 형태의 내장 저항체를 구현하는 기술의 개발이 최근 주목을 받고 있다. 박막 저항체는 기존의 권선저항 및 후막저항과 비교하여 정밀한 온도저항계수를 가지며 이동통신에 적용시 고주파 영역(GHz)에서의 안정성과 주파수 특성이 좋다는 장점들을 가지고 있다. 박막 저항 물질로는 높은 경도와 우수한 열적 안정성을 가지고 있는 TaN (tantalum nitride)이 주로 사용되고 있다. 일반적으로, TaN 박막은 스퍼터링을 사용하며 제조되며 TaN 박막의 성질은 탄탈륨과 질소의 화학정량비, 박막의 결함 정도, 또는 공정압력 및 증착 온도, 플라즈마 파워 등과 같은 공정조건 등의 변화에 민감하게 변화하므로, TaN 박막의 다양한 연구가 더 필요한 실정이다. 본 연구에서는 반응성 마크네트론 스퍼터링을 사용하여 TaN 박막을 Si 기판 위에 증착하였고 TaN 박막의 원하는 특성을 제어할 수 있도록 질소 분압과 total gas volume을 조절하여 공정을 최적화하는 연구를 진행하였다. 또한 tensile pull-off 방법을 이용하여 TaN 박막의 부착강도를 평가하였고, 온도 사이클 및 고온고습 환경에 노출된 TaN 박막들의 열화 특성들에 대하여 연구하였다.

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Analysis of Wide-gap Semiconductors with Superconducting XAFS Apparatus

  • Shiki, S.;Zen, N.;Matsubayashi, N.;Koike, M.;Ukibe, M.;Kitajima, Y.;Nagamachi, S.;Ohkubo, M.
    • Progress in Superconductivity
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    • v.14 no.2
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    • pp.99-101
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    • 2012
  • Fluorescent yield X-ray absorption fine structure (XAFS) spectroscopy is useful for analyzing local structure of specific elements in matrices. We developed an XAFS apparatus with a 100-pixel superconducting tunnel junction (STJ) detector array with a high sensitivity and a high resolution for light-element dopants in wide-gap semiconductors. An STJ detector has a pixel size of $100{\mu}m$ square, and an asymmetric layer structure of Nb(300 nm)-Al(70 nm)/AlOx/Al(70 nm)-Nb(50 nm). The 100-pixel STJ array has an effective area of $1mm^2$. The XAFS apparatus with the STJ array detector was installed in BL-11A of High Energy Accelerator Research Organization, Photon Factory (KEK PF). Fluorescent X-ray spectrum for boron nitride showed that the average energy resolution of the 100-pixels is 12 eV in full width half maximum for the N-K line, and The C-K and N-K lines are separated without peak tail overlap. We analyzed the N dopant atoms implanted into 4H-SiC substrates at a dose of 300 ppm in a 200 nm-thick surface layer. From a comparison between measured X-ray Absorption Near Edge Structure (XANES) spectra and ab initio FEFF calculations, it has been revealed that the N atoms substitute for the C site of the SiC lattice.

Effects of thermal annealing of AlN thin films deposited on polycrystalline 3C-SiC buffer layer (다결정 3C-SiC 버퍼층위 증착된 AlN 박막의 열처리 효과)

  • Hong, Hoang-Si;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.112-112
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    • 2009
  • In this study, the effect of a long post-deposition thermal annealing(600 and 1000 $^{\circ}C$) on the surface acoustic wave (SAW) properties of polycrystalline (poly) aluminum-nitride (AlN) thin films grown on a 3C-SiC buffer layer was investigates. The poly-AlN thin films with a (0002) preferred orientation were deposited on the substrates by using a pulsed reactive magnetron sputtering system. Experimental results show that the texture degree of AlN thin film was reduced along the increase in annealing temperature, which caused the decrease in the electromechanical coupling coefficient ($k^2$). The SAW velocity also was decreased slightly by the increase in root mean square (RMS) roughness over annealing temperature. However, the residual stress in films almost was not affect by thermal annealing process due to small lattice mismatch different and similar coefficient temperature expansion (CTE) between AlN and 3C-SiC. After the AlN film annealed at 1000 $^{\circ}C$, the insertion loss of an $IDT/AlN/3C-SiC/SiO_2/Si$ structure (-16.44 dB) was reduced by 8.79 dB in comparison with that of the as-deposited film (-25.23 dB). The improvement in the insertion loss of the film was fined according to the decrease in the grain size. The characteristics of AlN thin films were also evaluated using Fourier transform-infrared spectroscopy (FT-IR) spectra and X-ray diffraction (XRD), scanning electron microscopy (SEM), and atomic force microscopy (AFM) images.

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