• 한국태양에너지학회:학술대회논문집
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• 2009.11a
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• pp.350-355
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• 2009

The crysralline silicon solar cell where the solar cell market grows rapidly is occupying of about 85% or more high efficiency and low cost endeavors many crystalline solar cells. The fabricaion process of high efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/AG contact, This metal contacts have only been used in limited areas in spite of their good srability and low contact resistance because of expensive materials and process. Commercial solar cells with screen-printed solar cells formed by using Ag paste suffer from loe fill factor and high contact resistance and low aspect ratio. Ni and Cu metal contacts have been formed by using electroless plating and light-induced electro plating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on 0.2~0.6${\Omega}$ cm, $20{\times}20mm^2$, CZ(Czochralski) wafer.

• Journal of environmental and Sanitary engineering
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• v.16 no.2
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• pp.38-46
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• 2001

In this work, the heterogeneous ion exchange membrane was used in a electrodialysis apparatus to treat a Ni planting rinse water because the heterogeneous ion exchange membrane was excellent efficiency as compared with low manufacturing cost, was easy to make, and had a good mechanical properties. For a regeneration of membrane and to obtain the optimal condition for a scale-up of apparatus after treating Ni plating rinse water, we would find about the limiting current density and the concentration polarization. When the Ni plating rinse water 150mg/L was treated with the electrodialysis apparatus using the heterogeneous ion exchange membrane, the limiting current density was about $1.49{\;}mA/\textrm{cm}^2$. And the limiting current density increased with the flow rate and concentration of Ni plating rinse water. We recognized that the used membrane could be reused by periodic backwashing because efficiency was constant when the membrane was backwashed after treating wastewater.

• Journal of the Korean institute of surface engineering
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• v.43 no.4
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• pp.165-169
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• 2010

$Ni-Al_2O_3$ nanocomposite coatings were fabricated by conventional electrodeposition technique using nickel sulfamate bath. Effect of plating parameters on electrodeposition of $Ni-Al_2O_3$ nanocomposite were studied. The properties of the nano composite were investigated by using SEM, XRD, and Vicker's microhardness test. The results demonstrated that $Al_2O_3$ incorporation in the composite coatings was found to be increased by increasing stir rate and $Al_2O_3$ content in plating bath. Microhardness of the composite coatings was also increased with increasing content of the nano particles in the plating bath. The surface morphologies of the nanocomposite coatings were found to be varied with varying pH, current densities as well as alumina content in the plating bath.

• Journal of the Korean Graphic Arts Communication Society
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• v.18 no.2
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• pp.133-141
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• 2000

Enhanced the value of badge good with the gold plating of emblem, sports pictogram, mascot in 2002 Asian Game and World Cup, applying the plating and coating technique to screen printing. In addition, tourist and characteristic goods were of great value and image of visual communication displayed outside. After the screen printing in the surface of stainless steel, it obtained the plate coloring of beautiful a black glossy with a black Ru plating. At the identical surface, it did that the electrodeposition coating process in order to making a conductor state of image areas and a nonconductor state of nonimage areas. After the electrodeposition process, it removed the printing ink of image areas with solvent. A manufacturing process, it removed the printing ink of image areas with solvent. A manufacturing process completed with copper, nickel and gold plating at bared metal surface.

• Polymer(Korea)
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• v.27 no.1
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• pp.61-68
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• 2003

In this study, we have investigated the preparation of mixed bead and fiber type hybrid ion-exchanger for recovering nickel ion from plating rinse water. There was little dependence of adsorption capacity for nickel ion on the mixing ratio of resin type and fiber type of ion exchangers. However, it increased with increasing the resin content in the mixed bed. It was shown that the data Langmuir and Freundlich's adsorption isotherm model were well fitted to the linear. Affinity between the functional groups in the ion exchanger and nickel ion in the process was confirmed. The pressure drop decreased with increasing the number of stage in the multistage bed, but it increased with increasing the resin content in the mixing bed. The initial breakthrough time in the multistage bed was short due to the increase of number of stage in the continuous process. It was found that the final breakthrough time of the multistage bed was little changed. The breakthrough time decreased with increasing the amount of fibrous ion exchanger in the mixed bed. The maximum adsorption capacities of the mixed and multistage beds were 2.51 meq/g and 2.69 meq/g, respectively. The desorption time for the nickel ion with $1N H_2SO_4$ solution was lower than 10 minutes and the yield of desorption was greater than 98 percent.

• Journal of the Korean institute of surface engineering
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• v.40 no.1
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• pp.32-38
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• 2007

Ni coating layers were formed using a newly developed electroless Ni plating solution. The properties of Ni coating layer such as internal stress, hardness, surface roughness, crystallinity, solderability and surface morphology were investigated using various tools. Results revealed that internal stress decreased with plating time and reached $40N/mm^2$ at 20 minutes of the plating time. Hardness increased with increasing P content and thickness. Surface roughness of the pad decreased with Ni and Ni/Au plating. Crystallinity decreased with increasing P content. Solderability based on wettability decreased with Ni and Ni/Au plating. Based on surface morphology, it is expected that Ni coating layer formed using a newly developed electroless Ni plating solution is lower than that formed using a commercial electroless Ni plating solution in possibility of black pad occurrence.

• Transactions of the Korean hydrogen and new energy society
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• v.20 no.4
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• pp.291-299
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• 2009

Ni-plated polytetrafluoroethylene(Ni-PTFE) particles($25{\mu}m$, $500{\mu}m$) were prepared by using nickel electroless plating. The Ni content in Ni-PTFE particles increased with increasing the amount of reduction agent. At about 53 wt% Ni content, $25{\mu}m$ Ni-PTFE particles showed conductivity of 320S/m. The Ni-PTFE particles were formed into the Ni-PTFE plate using heat treatment at $350^{\circ}C$ under $10{\sim}1000kg/cm^2$. The Ni-PTFE plate displayed the high conductivity of 5100S/m due to the formation of 3-dimentional Ni network. The plate was used as an electrode in an alkaline fuel cell(AFC). In terms of the current density, the Ni-PTFE electrode having higher Ni content(53 wt%) showed improved performance.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1419-1421
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• 1995

Nickel micro-structures are fabricated by electroless plating which shows better uniformity. Positive resist AZ4562 of 7 um thickness is patterned with minimum width of 2 um on poly-silicon as for sacrificial layer. The growth rate of Ni electroless plating is 10um/h both for the seed layer of Pt and TiW. TiW is found to be more practical than Pt, since it is very difficult to remove Pt with negligible damage to Ni structures.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.118-121
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• 2003

The electrochemical behaviors of UBM nickel were investigated. Electrode potential has been changed with the surface composition. Zinc is dissolved into the solution immediately after immersion. Electrode potential has three distinct regions: Zinc dissolution region, transient region and nickel plating region. The effects additives on electrode potential and polarization curves were also investigated. The addition of suppressor lowered the current density which is related with deposition rate.

• Journal of Advanced Marine Engineering and Technology
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• v.19 no.3
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• pp.50-61
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• 1995

In recent years, many ceramic researchers have discoved various methods of joining ceramic to metal. However, most of these joining methods are perfomed under vacuum and pressured circumstances. So, when we join ceramic to metal,the proceedings are very complicated and require a very high cost. The purpose of this study is to develop a new joining method of an alumina ceramic to an aluminum metal in air atmosphere. The joining condition, such as copper metallizing, nickel plating, brazing, etc. was investigated through the shear strength test of the trial joint. The results obtained from the above experimenta are summarized as follows : 1) In the case of the $Al_2O_3$/$Al_2O_3$joint, the shear strength of the joint was affected by the various foctor such as kaolin content, copper metallizing thickness, firing temperature, firing time. 2) The better shear strength of the $Al_2O_3$/Al joint was obtained when Ni plating was conducted under higher current density than existing plating condition. 3) The shear strength of the $Al_2O_3$/Al joint increases with the Ni plating thickness is confined to the range of this paper. 4) The shear strength of the thermal-shocked specimen($Al_2O_3$/Al joint) was far more deteriorated than that of the as-bonded specimen.