• Title/Summary/Keyword: nanometer

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다채널 표면 플라즈몬 공명 영상장치를 이용한 자기조립 단분자막의 표면 분석

  • Pyo, Hyeon-Bong;Sin, Yong-Beom;Yun, Hyeon-Cheol
    • 한국생물공학회:학술대회논문집
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    • 2003.04a
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    • pp.74-78
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    • 2003
  • Multi-channel images of 11-MUA and 11-MUOH self-assembled monolayers were obtained by using two-dimensional surface plasmon resonance (SPR) absorption. Patterning process was simplified by exploiting direct photo-oxidation of thiol bonding (photolysis) instead of conventional photolithography. Sharper images were resolved by using a white light source in combination with a narrow bandpass filter in the visible region, minimizing the diffraction patterns on the images. The line profile calibration of the image contrast caused by different resonance conditions at each points on the sensor surface (at a fixed incident angle) enables us to discriminate the monolayer thickness in sub-nanometer scale. Furthermore, there is no signal degradation such as photo bleaching or quenching which are common in the detection methods based on the fluorescence.

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Micro-Machined Capacitive Linear Encoder with a Mechanical Guide (마이크로 머시닝으로 제작한 기계적 가이드를 갖는 정전용량 선형 인코더)

  • Kang, Daesil;Moon, Wonkyu
    • Journal of Sensor Science and Technology
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    • v.21 no.6
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    • pp.440-445
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    • 2012
  • Contact-type Linear Encoder-like Capacitive Displacement Sensor (CLECDiS) is a novel displacement sensor which has wide measurable range with high resolution. The sensor, however, is very sensitive to relative rotational alignment between stator and mover of the sensor as well as its displacement. In addition to, there can be some disturbances in the relative rotational alignment, so some noises occur in the sensor's output signal by the disturbances. This negative effect of the high sensitivity may become larger as increasing sensitivity. Therefore, this negative effect of the high sensitivity has to be compensated and reduced to achieve nanometer resolution of the sensor. In this study, a new type capacitive linear encoder with a mechanical guide is presented to reduce the relative rotational alignment problem. The presented method is not only to reduce the alignment problem, but also to assemble the sensor to the stage conveniently. The method is based on a new type CLECDiS that has mechanical guide autonomously. In the presented sensor, when the device is fabricated by micro-machining, the guide-rail is also fabricated on the surface of the sensor. By the direct fabrication of the guide-rail with high precision micro-machining, errors of the guide-rail can be reduced significantly. In addition, a manual yaw alignment is not required to obtain large magnitude of the output signal after the assembly of the sensor and the stage. The sensor movement is going to follow the guide-rail automatically. The prototype sensor was fabricated using the presented method, and we verify the feasibility experimentally.

Development of Line Standards Measurement System Using an Optical Microscope (광학 현미경을 이용한 선표준물 측정 시스템 개발)

  • Kim, Jong-Ahn;Kim, Jae-Wan;Kang, Chu-Shik;Eom, Tae-Bong
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.8
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    • pp.72-78
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    • 2009
  • We developed a line standards measurement system using an optical microscope and measured two kinds of line standards. It consists of three main parts: an optical microscope module including a CCD camera, a stage system with a linear encoder, and a measurement program for a microscopic image processing. The magnification of microscope part was calibrated using one-dimensional gratings and the angular motion of stage was measured to estimate the Abbe error. The threshold level in line width measurement was determined by comparing with certified values of a line width reference specimen, and its validity was proved through the measurement of another line width specimen. The expanded uncertainty (k=2) was about 100 nm in the measurements of $1{\mu}m{\sim}10{\mu}m$ line width. In the comparison results of line spacing measurement, two kinds of values were coincide within the expanded uncertainty, which were obtained by the one-dimensional measuring machine in KRISS and the line standards measurement system. The expanded uncertainty (k=2) in the line spacing measurement was estimated as $\sqrt{(0.098{\mu}m)^2+(1.8{\times}10^{-4}{\times}L)^2}$. Therefore, it will be applied effectively to the calibration of line standards, such as line width and line spacing, with the expanded uncertainty of several hundreds nanometer.

Microstructure and Mechanical Properties of Ti-35Nb-7Zr-XCPP Biomaterials Fabricated by Rapid Sintering

  • Woo, Kee-Do;Park, Sang-Hoon;Kim, Ji-Young;Kim, Sang-Mi;Lee, Min-Ho
    • Korean Journal of Materials Research
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    • v.22 no.3
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    • pp.150-154
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    • 2012
  • Ti-6Al-4V ELI (Extra Low Interstitial) alloy have been widely used as alternative to bone due to its excellent biocompatibility, although it still has many problems such as high elastic modulus and toxicity. Therefore, biomaterials with low elastic modulus and non toxic characteristics have to be developed. A novel ${\beta}$ Ti-35wt%Nb-7wt%Zr-Calcium pyrophosphate (CPP) composite that is a biocompatible alloy without elemental Al or V was fabricated by spark plasma sintering (SPS) at $1000^{\circ}C$ under 70 MPa using high energy mechanical milled (HEMM) powder. The microstructure and phases of the milled powders and the sintered specimens were studied using SEM, TEM, and XRD. Ti-35wt%Nb-7wt%Zr alloy was transformed from ${\alpha}$ phase to ${\beta}$ phase in the 4h-milled powder by sintering. The sintered specimen using the 4h-milled powder showed that all the elements were distributed very homogeneously and had higher density and hardness. ${\beta}$ Ti alloy-CPP composite, which has nanometer particles, was fabricated by SPS using HEMMed powder. During the sintering process, $CaTiO_3$, TixOy, and CaO were formed because of the reaction between Ti and CPP. The Vickers hardness of the composites increases with the increase of the milling time and the addition of CPP. The biocompatibility of the Ti-Nb-Zr alloys was improved by addition of CPP.

Design of Turbulent In-situ Mixing Mixer and Fabrication of Cu-TiB2 Nanocomposities (난류 용탕 In-situ 합성 믹서의 설계 및 Cu-TiB2 나노 복합재료의 제조)

  • Choi, Baek-Boo;Park, Jung-Su;Yun, Ji-Hun;Ha, Man-Young;Park, Yong-Ho;Park, Ik-Min
    • Korean Journal of Materials Research
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    • v.17 no.1
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    • pp.11-17
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    • 2007
  • Turbulent in-situ mixing process is a new material process technology to get dispersed phase in nanometer size by controlling reaction of liquid/solid, liquid/gas, flow ana solidification speed simultaneously. In this study, mixing which is the key technology to this synthesis method was studied by computational fluid dynamics. For the simulation of mixing of liquid metal, static mixers investigated. Two inlets for different liquid metal meet ana merge like 'Y' shape tube having various shapes and radios of curve. The performance of mixer was evaluated with quantitative analysis with coefficient of variance of mass fraction. Also, detailed plots of intersection were presented to understand effect of mixer shape on mixing. The simulations show that the Reynolds number (Re) is the important factor to mixing and dispersion of $TiB_2$ particles. Mixer was designed according to the simulation, and $Cu-TiB_2$ nano composites were evaluated. $TiB_2$ nano particles were uniformly dispersed when Re was 1000, and cluster formation and reduction in volume fraction of $TiB_2$ were found at higher Re.

Scanning Kelvin Probe Microscope analysis of Nano-scale Patterning formed by Atomic Force Microscopy in Silicon Carbide (원자힘현미경을 이용한 탄화규소 미세 패터닝의 Scanning Kelvin Probe Microscopy 분석)

  • Jo, Yeong-Deuk;Bahng, Wook;Kim, Sang-Cheol;Kim, Nam-Kyun;Koo, Sang-Mo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.32-32
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    • 2009
  • Silicon carbide (SiC) is a wide-bandgap semiconductor that has materials properties necessary for the high-power, high-frequency, high-temperature, and radiation-hard condition applications, where silicon devices cannot perform. SiC is also the only compound semiconductor material. on which a silicon oxide layer can be thermally grown, and therefore may fabrication processes used in Si-based technology can be adapted to SiC. So far, atomic force microscopy (AFM) has been extensively used to study the surface charges, dielectric constants and electrical potential distribution as well as topography in silicon-based device structures, whereas it has rarely been applied to SiC-based structures. In this work, we investigated that the local oxide growth on SiC under various conditions and demonstrated that an increased (up to ~100 nN) tip loading force (LF) on highly-doped SiC can lead a direct oxide growth (up to few tens of nm) on 4H-SiC. In addition, the surface potential and topography distributions of nano-scale patterned structures on SiC were measured at a nanometer-scale resolution using a scanning kelvin probe force microscopy (SKPM) with a non-contact mode AFM. The measured results were calibrated using a Pt-coated tip. It is assumed that the atomically resolved surface potential difference does not originate from the intrinsic work function of the materials but reflects the local electron density on the surface. It was found that the work function of the nano-scale patterned on SiC was higher than that of original SiC surface. The results confirm the concept of the work function and the barrier heights of oxide structures/SiC structures.

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Effect of the Incident Optical Spot Size Upon the Quadrant Photodetector on the Optical Displacement Detection Sensitivity (4분할 광 검출기 상의 광점 크기가 변위 측정감도에 미치는 영향)

  • Lee, Eun-Joong;Lee, Jin-Woo;Kouh, Tae-Joon
    • Journal of the Korean Magnetics Society
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    • v.18 no.2
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    • pp.71-74
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    • 2008
  • In this paper, we have measured the effect of the optical spot size, incident upon the quadrant photodetector, on the optical displacement sensitivity of the optical beam deflection technique. We have built an optical displacement detection system based on the optical beam deflection method using 3 mW He-Ne laser and measured the displacement sensitivity with changing the optical spot size on the quadrant photodetector. We have also calculated the changes in the optical displacement sensitivity as a function of the incident laser spot size by modeling a circular optical spot with constant laser intensity. Our experimental and theoretical studies show that the optical displacement sensitivity increases with the decrease in the optical spot size. This suggests that in the design of the optical motion detection systems with sub-nanometer sensitivity, the displacement sensitivity can be optimized by reducing the size of the incident optical spot on the detector.

Improvement on the Passivation Effect of PA-ALD Al2O3 Layer Deposited by PA-ALD in Crystalline Silicon Solar Cells (결정질 실리콘 태양전지를 위한 PA-ALD Al2O3 막의 패시베이션 효과 향상 연구)

  • Song, Se Young;Kang, Min Gu;Song, Hee-Eun;Chang, Hyo Sik
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.10
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    • pp.754-759
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    • 2013
  • Aluminum oxide($Al_2O_3$) film deposited by atomic layer deposition (ALD) is known to supply excellent surface passivation properties on crystalline Si surfaces. Since $Al_2O_3$ has fixed negative charge, it forms effective surface passivation by field effect passivation on the rear side in p-type silicon solar cell. However, $Al_2O_3$ layer formed by ALD process needs very long process time, which is not applicable in mass production of silicon solar cells. In this paper, plasma-assisted ALD(PA-ALD) was applied to form $Al_2O_3$ to reduce the process time. $Al_2O_3$ synthesized by ALD on c-Si (100) wafers contains a very thin interfacial $SiO_2$ layer, which was confirmed by FTIR and TEM. To improve passivation quality of $Al_2O_3$ layer, the deposition temperature was changed in range of $150{\sim}350^{\circ}C$, then the annealing temperature and time were varied. As a result, the silicon wafer with aluminum oxide film formed in $250^{\circ}C$, $400^{\circ}C$ and 10 min for the deposition temperature, the annealing temperature and time, respectively, showed the best lifetime of 1.6ms. We also observed blistering with nanometer size during firing of $Al_2O_3$ deposited on p-type silicon.

Control of Size and Morphology of Particles Using CO2 Laser in a Flame (화염증 CO2 Laser를 이용한 입자의 크기 및 형상 제어)

  • Lee, Donggeun;Lee, Seonjae;Choi, Mansoo
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.23 no.11
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    • pp.1379-1389
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    • 1999
  • A new technique for control of size and shape of flame-made particles is Introduced. The characteristic sintering time can be controlled Independently of collision time by heating the particles with irradiation of laser because the sintering time strongly depends on temperature. A coflow oxy-hydrogen diffusion flame burner was used for $SiCl_4$ conversion to silica particle. Nanometer sized aggregates irradiated by a high power CW $CO_2$ laser beam were rapidly heated up to high temperatures and then were sintered to approach volume-equivalent spheres. The sphere collides much slower than the aggregate, which results in reduction of sizes of particles maintaining spherical shape. Light scattering of Ar ion laser and TEM observation using a local sampling device were used to confirm the above effects. When the $CO_2$ laser was irradiated at low position from the burner surface, particle generation due to gas absorption of laser beam occurred and thus scattering intensity increased with $CO_2$ laser power. At high irradiation position, scattering intensity decreased with $CO_2$ laser power and TEM image showed a clear mark of evaporation and recondensation of particles for high $CO_2$ laser power. When the laser was irradiated between the above two positions where small aggregates exist, average size of spherical particles obviously decreased to 58% of those without $CO_2$ laser irradiation with the spherical shape. Even for increased carrier gas flow rate by a factor of three, TEM photograph also revealed considerable reduction of particle size.

Fracture Behavior of Glass/Resin/Glass Sandwich Structures with Different Resin Thicknesses (서로 다른 레진 두께를 갖는 유리/레진/유리샌드위치 구조의 파괴거동)

  • Park, Jae-Hong;Lee, Eu-Gene;Kim, Tae-Woo;Yim, Hong-Jae;Lee, Kee-Sung
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.12
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    • pp.1849-1856
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    • 2010
  • Glass/resin/glass laminate structures are used in the automobile, biological, and display industries. The sandwich structures are used in the micro/nanoimprint process to fabricate a variety of functional components and devices in fields such as display, optics, MEMS, and bioindustry. In the process, micrometer- or nanometer-scale patterns are transferred onto the substrate using UV curing resins. The demodling process has an important impact on productivity. In this study, we investigated the fracture behavior of glass/resin/glass laminates fabricated via UV curing. We performed measurements of the adhesion force and the interfacial energy between the mold and resin materials using the four-point flexural test. The bending-test measurements and the load-displacement curves of the laminates indicate that the fracture behavior is influenced by the interfacial energy between the mold and resin and the resin thickness.