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http://dx.doi.org/10.3795/KSME-A.2010.34.12.1849

Fracture Behavior of Glass/Resin/Glass Sandwich Structures with Different Resin Thicknesses  

Park, Jae-Hong (School of Mechanical Engineering, Kookmin Univ.)
Lee, Eu-Gene (School of Mechanical Engineering, Kookmin Univ.)
Kim, Tae-Woo (School of Mechanical Engineering, Kookmin Univ.)
Yim, Hong-Jae (Dept. of Automotive Engineering, Kookmin Univ.)
Lee, Kee-Sung (School of Mechanical Engineering, Kookmin Univ.)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.34, no.12, 2010 , pp. 1849-1856 More about this Journal
Abstract
Glass/resin/glass laminate structures are used in the automobile, biological, and display industries. The sandwich structures are used in the micro/nanoimprint process to fabricate a variety of functional components and devices in fields such as display, optics, MEMS, and bioindustry. In the process, micrometer- or nanometer-scale patterns are transferred onto the substrate using UV curing resins. The demodling process has an important impact on productivity. In this study, we investigated the fracture behavior of glass/resin/glass laminates fabricated via UV curing. We performed measurements of the adhesion force and the interfacial energy between the mold and resin materials using the four-point flexural test. The bending-test measurements and the load-displacement curves of the laminates indicate that the fracture behavior is influenced by the interfacial energy between the mold and resin and the resin thickness.
Keywords
Nanoimprint Lithography; 4-Point Bending Test; Resin; Glass; Fracture; Interface Release Rate; Interfacial Energy; Crack Deflection;
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Times Cited By KSCI : 2  (Citation Analysis)
Times Cited By SCOPUS : 0
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