• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.437-438
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• 2008

박막태양전지에서 p-layer, i-layer, n-layer의 thickness와 doping concentration은 가장 기본이 되는 요소이다. 각 layer에서 위 두 가지 요소를 ASA simulator를 이용해서 높은 효율을 갖는 박막태양전지를 설계하기 위해 조절하였다. Simulation결과 p-layer의 thickness는 $9.5*10^{-9}m$, doping concentration은 0.2eV, i-layer의 thickness는 $4.535*10^{-7}m$, n-layer의 thickness는 $2*10^{-8}m$, doping concentration 은 0.1eV에서 최종 11.48%의 효율을 얻을 수 있었다. 본 연구를 통하여 높은 효율의 박막태양전지 설계 시에 도움이 될 수 있을 것이다.

• 한국재료학회지
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• 제27권12호
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• pp.699-704
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• 2017

Recently, the use of an aluminum nitride(AlN) buffer layer has been actively studied for fabricating a high quality gallium nitride(GaN) template for high efficiency Light Emitting Diode(LED) production. We confirmed that AlN deposition after $N_2$ plasma treatment of the substrate has a positive influence on GaN epitaxial growth. In this study, $N_2$ plasma treatment was performed on a commercial patterned sapphire substrate by RF magnetron sputtering equipment. GaN was grown by metal organic chemical vapor deposition(MOCVD). The surface treated with $N_2$ plasma was analyzed by x-ray photoelectron spectroscopy(XPS) to determine the binding energy. The XPS results indicated the surface was changed from $Al_2O_3$ to AlN and AlON, and we confirmed that the thickness of the pretreated layer was about 1 nm using high resolution transmission electron microscopy(HR-TEM). The AlN buffer layer deposited on the grown pretreated layer had lower crystallinity than the as-treated PSS. Therefore, the surface $N_2$ plasma treatment on PSS resulted in a reduction in the crystallinity of the AlN buffer layer, which can improve the epitaxial growth quality of the GaN template.

• 한국결정성장학회지
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• 제8권3호
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• pp.377-382
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• 1998

기존보다 낮은 온도에서 buffer layer를 도입하지 않고 직접 사파이어{1120} 기판위에 GaN 박막을 OMVPE방식으로 증착시킨 결과 양호한 계면상태를 가지는 양질의 GaN epilayer를 얻을 수 있었다. GaN epilayer의 주된 성장 방향은 <0002>로 밝혀졌고, 적어도 4개 종류 이상의 epilayer들이 서로 경쟁적으로 성장하는 것으로 판단되어진다. Buffer layer의 부재에도 불구하고 계면의 adhesion이 우수하였고 다만 계면으로부터 2~3nm이내의 lattice들에서 기판과의 lattice mismatch에 의한 distortion이 발견되어졌다. 따라서 일반적으로 GaN 박막 증착시에 가장 많이 사용되는 사파이어 basal plane 외에 {1120} plane 위에도 양질의 GaN epilayer가 buffer layer 없이 증착된다는 사실을 TEM 관찰을 통하여 알 수 있었다.

• 한국지반환경공학회 논문집
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• 제12권10호
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• pp.13-22
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• 2011

본 연구는 충청 지역에서 측정된 전단파 속도를 지층별로 점성토층, 사질토층, 자갈층, 풍화토층, 풍화암층으로 분류하여 표준관입시험 N값과 전단파 속도의 상관관계식을 제안하였으며, 참고적으로 풍화암층을 제외한 전체토층의 상관관계식을 도출하였다. 제안된 상관관계식은 국내외 기존 제안식을 고려하여 모두 멱함수로 산정하였으며 지반강도의 경우 N값이 50 이상일 경우에는 선형으로 환산하여 적용하였다. 금번 연구에서 제안한 관계식을 국내외 사례와 지층별로 비교 분석한 결과 점성토층, 사질토층, 자갈층, 풍화토층의 경우에는 유사한 특성을 보이고 있음을 알 수 있었다. 다만, 풍화암층에 대한 상관관계식의 경우 국내 관계식과 다소 낮은 결과치를 나타내는 차이가 있음을 확인하였다. 풍화암층의 경우 상관관계식 산정에 있어 N값이 50 이상일 경우는 선형으로 환산하여 적용함에 따라 지반 강도가 높은 지층인 풍화암층에서 차이가 발생한 것으로 파악된다.

• 열처리공학회지
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• 제1권1호
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• pp.8-12
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• 1988

This study has been carried out to evaluate gaseous nitrocarburizing treatment undertaken for pure iron at $570^{\circ}C$ in an atmosphere containing 50% endothermic gas, generated from natural gas, and 50% ammonia. The results obtained from the experiment are as follows ; 1) The microstructure of gaseous nitrocarburized pure iron consists of the compound layer on the surface and the diffusion zone beneath it. The compound layer progresses uniformly into ferrite with a thickness of $20{\mu}$ obtained after treating for 3 hours. 2) Chemical analysis has shown that the compound layer has a C/N ratio of 0.19 and that the average combined interstitial content of the compound layer is about 30 atomic percent, which is close to the lower limit of the ${\varepsilon}$-carbonitride phase field in Fe-C-N phase diagram. 3) X-ray diffraction analysis has revealed that the compound layer consists mainly of the c.p.h. phase, ${\varepsilon}-Fe_3$(C.N) and a small amount of $Fe_4N$ and traces of ferrite are also present in the compound layer. 4) The microhardness of the compound layer is about 600 V.H.N and shows a relatively sharp fall-off at the compound layer/diffusion zome interface. 5) The average actual degree of ammonia dissociation is calculated to be 27% for a gaseous nitrocarburizing treatment carried out at $570^{\circ}C$.

• 한국표면공학회지
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• 제34권2호
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• pp.105-114
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• 2001

$Al_2$$O_3$ coatings were deposited on M2 high speed steels by the plasma enhanced chemical vapor deposition (PECVD) process, using a gas mixture of AlC1$_3$, $H_2$, $CO_2$ and Ar $Al_2$$O_3$ coatings had interference color and showed amorphous phase. $A1_2$X$A1_3$/($Ti_{0.5}$ /$Al_{0.5}$ )N double layer coatings were produced in the sequence of substrate $NH_3$ plasma pretreatment, ($Ti_{0.5}$$Al_{0.5}$)N depoition process, $Al_2$$O_3$ deposition process. $Al_2$ $O_3$/( $Ti_{0.5}$A $l_{0.5}$)N double layer coatings showed NaCl structure in ( $Ti_{0.5}$A $l_{0.5}$)N layer and amorphous phase in A1$_2$ $O_3$ layer. It was shown that $Al_2$ $O_3$ columns continuously grew onto ( $Ti_{0.5}$A $l_{0.5}$)N columns. ( $Ti_{0.5}$A $l_{0.5}$)N single coating and $Al_2$ $O_3$/( $Ti_{0.5}$A $l_{0.5}$)N double layer coating were oxidized at $700^{\circ}C$, 80$0^{\circ}C$, 90$0^{\circ}C$ for 1hr, 3hr in atmosphere. At 80$0^{\circ}C$, single layer coatings were oxidized, which were examined substrate oxide particle. But $Al_2$ $O_3$/ ( $Ti_{0.5}$A $l_{0.5}$)N double layer coatings maintained the asdeposited state. Therefore, $Al_2$ $O_3$/ ( $Ti_{0.5}$A $l_{0.5}$)N double layer coatings have moreexcellent oxidation resistance than ( $Ti_{0.5}$A $l_{0.5}$)N single layer coatings.X> 0.5/)N single layer coatings.s.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.437-437
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• 2009

현재 상용화되어 있는 결정질 태양전지의 경우 높은 실리콘 가격으로 인해 저가화에 어려움을 격고 있다. 따라서 태양전지 저가화의 한 방법으로 박막태양전지가 주목을 받고 있다. P-I-N 구조의 박막태양전지에서 I-layer 각 층의 thickness, activation energy, energy bandgap은 고효율 달성을 위한 중요한 요소이다. 본 논문에서는 박막태양전지 P-I-N layer의 가변을 통하여 고효율을 달성하기 위한 simulation을 수행하였다. 가변 조건으로는 p-layer의 thickness, activation energy 그리고 energy bandgap을 단계별로 변화시켰고 i-layer는 thickness를 n-layer는 thickness와 activation energy를 가변하여 최적의 조건을 찾아 분석하였다. 최종 simulation 결과 p-layer의 thickness 5nm, activation energy 0.3eV 그리고 energy bandgap 1.8eV에서, i-layer thickness 400nm, n-layer thickness 30nm, activation energy 0.2eV에서 최고 효율 11.08%를 달성하였다.

• 한국초전도ㆍ저온공학회논문지
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• 제18권1호
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• pp.33-36
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• 2016

Suppression of the superconducting transition temperature ($T_c$) of NbN thin films in superconductor/ferromagnet multilayers has been investigated. Both superconducting NbN and ferromagnetic FeN layers were deposited on thermally oxidized Si substrate at room temperature by using reactive magnetron sputtering in an $Ar-N_2$ gas mixture. The thickness of FeN films was fixed at 20 nm, while the thickness of NbN films was varied from 3 nm to 90 nm. $T_c$ suppression was clearly observed in NbN layers up to 70 nm thickness when NbN layer was in proximity with FeN layer. For a given thickness of NbN layer, the magnitude of $T_c$ suppression was increased in the order of Si/FeN/NbN, Si/NbN/FeN, and Si/FeN/NbN/FeN structure. This result can be used to design a spin switch whose operation is based on the proximity effect between superconducting and ferromagnetic layers.

• 한국세라믹학회지
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• 제34권5호
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• pp.512-518
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• 1997

The high temperature oxidation behaviors of titanium nitride films prepared by PACVD technique were studied in the temperature range of from 50$0^{\circ}C$ to 80$0^{\circ}C$ under air atmosphere. Ti0.88Al0.12N film, which showed the excellent microhardness from the previous work, was investigated on its oxidation resistance compared with pure TiN film. Ti-Al-N film showed superior oxidation resistance up to $700^{\circ}C$, whereas TiN film was fast oxidized into rutile TiO2 crystallites from at 50$0^{\circ}C$. It was found that an amorphous layer having AlxTiyOz formula was formed on the surface region due to outward diffusion of Al ions at the initial stage of oxidation. The amorphous oxide layer played a role as a barrier against oxygen diffusion, protected the remained nitride layer from further oxidation, and thus, resulted in the high oxidation resistive characteristics of Ti-Al-N film.

• 한국전기전자재료학회논문지
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• 제17권7호
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• pp.764-769
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• 2004

In order to reduce operating voltage of the GaN based blue-violet laser diodes, the effect of highly Mg doped GaN layer, which was grown below ohmic contact metals, on contact resistivity as well as operating voltage has been investigated. The addition of the highly Mg doped GaN layer greatly reduced contact resistivity of Pd/Pt/Au ohmic contacts from $5.2 \times {10}^-2 \Omegaㆍ$\textrm{cm}^2$ to 7.5 \times {10}^-4 \Omegaㆍ$\textrm{cm}^2$$. In addition, it also decreased device voltage at 20 mA by more than 3 V. Temperature- dependent sheet resistivity of the highly Mg doped GaN layer suggested that the reduction of the contact resistivity could be attributed to predominant current flow at the interface between the Pd/Pt/Au contacts and p-GaN through a deep level defect band, rather than the valence band.