• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.189-192
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• 2008

A 5.8-inch wide-QQVGA flexible full-color active-matrix OLED display was fabricated on a plastic substrate. Low-voltage-operation organic TFTs and high-efficiency phosphorescent OLEDs were used as the backplane and emissive pixels, respectively. The fabricated display clearly showed color moving images when the driving voltage was below 15 V.

• 제어로봇시스템학회:학술대회논문집
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• 2002.10a
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• pp.109.1-109
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• 2002

This paper presents a macro/micro flip chip mounting head system for precise force control. In the proposed macro/ micro system, the macro actuator is conventional do servomotor with a ball screw mechanism and the micro actuator is a voice coil motor(VCM) that consists of four NdFeB magnets and a winded moving coil. For force control, a sensitive strain-gauge force sensor is mounted in the micro actuator. Through harmonic motion between macro and micro actuator, we would like to get precise contact force control when small sized flip chip is mounted on flexible substrate in high speed. In order to show the effectiveness of the proposed macro/micro flip chip mounting head system, we com...

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1988.11a
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• pp.35-48
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• 1988

상대 접촉하고 있는 물체에 미끄럼 운동이 가해질 경우 마찰에 의해 발생되는 거의 모든 에너지는 열로써 나타나게 된다. 이러한 마찰열은 주로 adhered junctions의 파괴 및 표면돌기(surface asperities)들의 소성 변형에 의한 열역할적 비가역 반응의 결과로 발생된다. 접촉부위의 발생열은 양 접촉제의 접촉면에 전달되어 접촉표면 온도의 급격한 증가를 초래하며 그 결과로 여러가지 surface phenomena, 즉 마찰, 마모, 산화(oxidation), 부식 및 구조적 열화(structural degradation) 금속학적 상변화등에 큰 영향을 미치게 된다. 딸서 볼 및 로울링 엘레먼트 베어링, 기어, 캠과 태핏, 브레이크 등 기계요소의 설계를 위한 주인자로서 근래에 들어 접촉표면의 온도가 주목받고 있다. 표면에 존재하는 layer로서는 금속표면에 응착시킨 coating layers, contaminant films, physisorbed 또는 chemisorbed films, oxide layers 또는 마찰열에 의해 형성되는 경도가 아주 높은 내마모층(hard wear-resistant layers) 등이 고려될수 있다. 낮은 열전도성을 가진 oxide film이 접촉 표면이 온도를 증가시킨다는 것이 Jaeger에 의해 지적되었으며 Ling과 Lai는 moving heat sjource가 가해지는 layered surface의 표면온도분포를 구하면서 substrate와 thermal property가 다른 layer가 존재하게 되면 그 두께가 아주 얇더라도 (1 마이크론 정도) 표면온도는 크게 변화됨을 보였다.

• Applied Science and Convergence Technology
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• v.23 no.4
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• pp.161-168
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• 2014

A real-time monitoring of immersed antenna type inductively coupled plasma (ICP) was done with a homemade 2 dimensional voltage probe array to check the uniformity of the plasma. Measured voltage values with a high impedance voltmeter are close to the floating potential of the plasma. As the substrate carrier was moving into a magnetron sputtering plasma diffusive from a $125mm{\times}625mm$ size cathode, measured results showed reliably separation of plasma into the upper and lower empty space over the carrier. Infra red thermal imaging camera was used to observe the cross corner effect in situ without eroding a target to the end of the usage. 3 dimensional particle trace model was used to analyze the magnetron discharge's behavior.

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.43-48
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• 2007

For exposure systems, very accurate alignment between the mask and the substrate is indispensable. In this paper, an automatic alignment system using machine vision for exposure systems is described. Machine vision algorithms are described in detail including extraction of an alignment mark's center position and camera calibration. Methods for extracting parameters for alignment are also presented with some compensation techniques to reduce alignment time. Our alignment system was implemented with a vision system and motion control stages. The performance of the alignment system has been extensively tested with satisfactory results. The performance evaluation shows alignment accuracy of lum within total alignment time of about $2{\sim}3$ seconds including stage moving time.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1732-1734
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• 2003

An MgO thin film sputtering system for the PDP (Plasma Display Panel) applications has been developed. This system was manufactured with a vertical In-Line type of 42 inch, which has the length of 520 mm and the width of 900 mm. A reactive magnetron discharge for this sputtering was generated using an unipolar pulsed power supply which has functions of constant voltage (Max. 500 V) and current (Max. 15 A) control, frequency of $10{\sim}100$ kHz and duty ratio of $10{\sim}60$ %. The experiment was conducted under various conditions : $3{\sim}10$ mTorr of pressure, the ratio of $O_2$/Ar = $0.1{\sim}0.5$, 50 % of duty and power of $0.5{\sim}1.7$ kW. From the experiment, the deposition rate of a static state and a moving state were measured to be about 45 nm/min and 6 nm m/min at the distance of 50 mm between the target and the substrate, respectively.

• Applied Science and Convergence Technology
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• v.25 no.5
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• pp.98-102
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• 2016

The level set method has recently become popular in the simulation of semiconductor processes such as etching, deposition and photolithography, as it is a highly robust and accurate computational technique for tracking moving interfaces. In this research, full three-dimensional level set simulation has been developed for the investigation of focused ion beam processing. Especially, focused ion beam induced nanodot formation was investigated with the consideration of three-dimensional distribution of redeposition particles which were obtained by Monte-Carlo simulation. Experimental validations were carried out with the nanodots that were fabricated using focused $Ga^+$ beams on Silicon substrate. Detailed description of level set simulation and characteristics of nanodot formation will be discussed in detail as well as surface propagation under focused ion beam bombardment.

• Journal of the Korean Vacuum Society
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• v.18 no.6
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• pp.440-446
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• 2009

Indium tin oxide(ITO) substrate is one of the key components of the touch panel and its sputtering process is dependent on the characteristics of various touch panel, such as driving type, size of panel, and the intended use. In this study, we optimized the sputtering condition of ITO film on polycarbonate(PC) by using in-line sputtering method for the application to resistive type touch panel. We varied the $O_2$/Ar gas ratio, sputtering power, pressure and moving speed of substrate to deposit ITO films at room temperature with the base vacuum of $1{\times}10^{-6}\;torr$. The sheet resistance and its uniformity, the transmittance, the thickness of the ITO film on PC substrate are investigated and analyzed. The optimized process parameters are as follows : the sheet resistance is $500{\pm}50\;{\Omega}$/□, the uniformity of sheet resistance is lower than 10%, the transmittance is higher than 87 % at 550nm, and the thickness is about 120~250. The optimized deposition conditions by in-line sputtering method can be applied to the actual mass production for the ITO film manufacturing technology.

• Korean Chemical Engineering Research
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• v.48 no.3
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• pp.401-404
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• 2010

A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study. In cleaning of electronic and semiconductor equipment, a substrate(IPC-A-36) was used to test the jet forces of the agent. And according to the jet forces time of the cleaning agent, the corresponding moving distances were compared with the spray times, and for the pollutants of iron powder and dust, the cleaning efficiency was tested with the IPC-A-36 by a weight method. The moving distance increased with the spray cleaning time longer. For a spray cleaning time of 3sec, the cleaning efficiency decreased with the amount of dust and the iron powder. It was also observed that the dust was remarkably removed, compared to the iron powder.

• Journal of the Korean Ceramic Society
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• v.42 no.6 s.277
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• pp.425-431
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• 2005

Line Shaped Solid Oxide Fuel Cell (SOFC) with multilayered structure has been fabricated via direct-writing process. The cell is electrolyte of Ni-YSZ cermet anode, YSZ electrolyte and LSM cathode. They were processed into pastes for the direct writing process. Syringe filled with each electrode and electrolyte paste was loaded into the computer-controlled robe-dispensing machine and the paste was dispensed through cylindrical nozzle of 0.21 mm in diameter under the air pressure of 0.1 tow onto a moving plate with 1.22 mm/s. First of all, the anode paste was dispensed on the PSZ porous substrate, and then the electrolyte paste was dispensed. The anode/electrolyte and the PSZ substrate were co-fired at $1350^{\circ}C$ in air atmosphere for 3 h. The cathode layer was similarly dispensed and sintered at $1200^{\circ}C$ for 1 h. All the electrode/electrolyte lines were visually aligned during the direct writing process. The effective reaction area of fabricated SOFC was $0.03 cm^2$, and the thickness of anode, electrolyte and cathode was 20 $\mu$m, 15 $\mu$m, and 10 $\mu$m, respectively. The single line-shaped SOFC fabricated by direct-writing process exhibited OCV of 0.95 V and maximum power density of $0.35W/cm^2$ at $810^{\circ}C$.