• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.1
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• pp.35-41
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• 2013

In injection molding, the mold temperature is one of most important process parameters that affect the flow characteristics and part deformation. The mold temperature usually varies periodically owing to the effects of the hot polymer melt and the cold coolant as the molding cycle repeats. In this study, a pulsed mold temperature control was proposed to improve the part quality as well as the productivity by alternatively circulating hot water and cold water before and after the molding stage, respectively. Transient thermal-fluid coupled analyses were performed to investigate the heat transfer characteristics of the proposed pulsed mold heating and cooling system. The simulation results were then compared with those of the conventional mold cooling system in terms of the heating and cooling efficiencies of the proposed pulsed mold temperature control system.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.4
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• pp.1581-1588
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• 2011

In this study, flow characteristics in a multi-cavity injection molding process were investigated. One of main problems occurred in the multi-cavity molding is a flow imbalance among cavities since it affects physical properties and quality of products. Charge imbalance is caused by the uneven shear stress. Therefore, changes in viscosity affect the physical properties of resin and injection conditions differ in the filling imbalance phenomenon. Through, this study focus on experimental studies of flow imbalance for PC and PP resin occurring in a balanced delivery system. Experimental results were compared with CAE results. By experimental and CAE analysis, main cause for the flow imbalance is temperature distribution in cross section of runner. New runner system with a simple change of runner shape was suggested to avoid the flow imbalance. A series of simulation to confirm feasibility of Volume Runner's effects was conducted using injection molding CAE.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.5
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• pp.2587-2593
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• 2014

Ceramic Injection Molding (CIM) is one of wide used processes in industry field and the applications are gradually being expanded to parts of medical and electric devices. In this study, the CIM process were analyzed with FEM and process parameters were studied and analyzed the effect on product quality. The shape of simple flat plate was compared to the shapes with the hole, with the round corner portion or with the side wall portion. If there are holes then the hole around the uneven density distribution and the defects such as weld lines could be occurred. The Large radius of the corners of the product give good formability and fluidity. Not only the shape parameters of product but also the process parameters during CIM are studied. The simulation results showed that the process parameters of temperature, initial fractions and velocity are important design parameters to improve the quality of products.

• Polymer(Korea)
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• v.33 no.6
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• pp.561-568
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• 2009

Small injection molded articles are generally molded by multi-cavity injection molding. The most important thing in multi-cavity molding is flow imbalance among the cavities because it affects the physical property and the quality of products. The cavity filling balance can be achieved by flow balance in the runner through the thermal balance. In this study, novel screw type runner or helical type runner has been developed for the flow balance in the runner and performed experiment and computer simulation. Flow balance has been observed using various screw type runners for several resins such as amorphous and crystalline polymers including low and high viscosities grades. Flow balance experiments have been performed for various injection speeds since the flow balance can be affected by injection speed among the injection conditions. Experimental results have been compared with computational results and they showed good agreement. The cavity filling balance can be achieved by the screw runner where the temperature distribution is uniform through the circulation flow along the screw channel in the screw runner. It has been verified that the novel screw runner is very effective device in flow balance in the multi-cavity injection molding. cavity filling imbalance, multi-cavity injection molding, runner design, screw runner, thermal balance.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2012.04a
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• pp.132-137
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• 2012

To enhance the CAE accuracy, the definition of material behavior is one of key influence on the result. In case of plastic material with fiber reinforcement, the anisotropic material behavior should be taken into account to increase of CAE accuracy. BASF has developed an innovative CAE tool, ULTRASIM$^R$, which is capable of generating material models of thermoplastic materials for structural simulation. ULTRASIM$^R$, not only the glass fiber orientation effect, but also the weld line effect, tensile-compression anisotropy, strain rate effect are combined in a non-linear material law, which will be evaluated in a unique failure criterion, thus resulting in an highly accurate CAE approach.

• Polymer(Korea)
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• v.36 no.6
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• pp.685-692
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• 2012

Injection molding operation consists of phases of filling, packing, and cooling. The highest cavity pressure is involved in the packing phase among the operation phases. Thus the cavity pressure largely depends upon velocity to pressure (v/p) switchover timing and magnitude of packing pressure. Developed cavity pressure is directly related to stress concentration in the cavity of mold and it may cause a crack in the mold. Consequently control of cavity pressure is considered very important. In this study, cavity pressure was analyzed in terms of v/p switchover timing and packing pressure through computer simulation and experiment. Cavity pressure was increased as the v/p switchover timing was delayed. Residual pressure after cooling phase was observed when the v/p switchover timing was late, which was due to increased pressurizing time for long filling phase. Cavity pressure was increased proportionally with the packing pressure. Residual pressure after cooling phase was also observed, and it was increased with increasing packing pressure. High cavity pressure and residual pressure have been observed at late v/p switchover and high packing pressure. Compared with simulation and experimental results, the profiles of pressures were very similar however simulation could not predict residual pressure. Packing condition was important for the control of cavity pressure and the optimum condition could be set up using CAE analysis.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.49-60
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• 2010

Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.

• Korean Chemical Engineering Research
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• v.49 no.1
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• pp.47-55
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• 2011

The optimum mold design and the optimum process condition were constructed upon executing process simulation of rubber injection molding with the commercial CAE program of MOLDFLOW (Ver. 5.2) in order to solve the process-problems of K company relating to cracks, which occurs at the inner cavity wall of C. V. joint boots. As a result it was confirmed that the real cracks occurs at the exactly same position of the cavity as exhibits the defects of weld and meld line and unsatisfactory curing according to the result of simulation. In order to prevent the occurrence of weld and meld line at the defect-position, the location of gate was altered to the optimum position of the cavity. Consequently the filling pattern was established to minimize the degree of the melt-fronts confronting or the melt-flows melding to prevent the occurrence of weld and meld line at the defect-position. It was observed that both gate-positions to maximize the degree of the formation of weld and meld line and air traps are located, respectively, in opposite direction each other with reference to the optimum gate position. In addition, the temperature of mold was raised by $10^{\circ}C$ and maintained at $170^{\circ}C$ for satisfactory curing.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.9
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• pp.3815-3821
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• 2012

The LCD frame is an important part which supports the BLU of medium/large sized TFT-LCD. To produce it efficiently, it is necessary to achieve the molding process improvement from 1 cavity to 2 cavity system. Because 2 cavity mold is compact and its hot-runner zone is broadened, it is difficult to control the temperature on the mold. In this study, injection molding analysis on the frame in 2 cavity process with FEA(Finite Element Analysis) software is carried out to estimate its quality. The calculated injection molding pressures and maximum deflection in 1 and 2 cavity processes are 41.13 MPa and 1.62 mm, 40.49 MPa and 1.66 mm respectively. The measured maximum flexure load and surface roughness of the left and right frame of 2 cavities are 209 N and 0.08 ${\mu}m$, 193 N and 0.10 ${\mu}m$ while those in 1 cavity are 140 N and 0.13 ${\mu}m$. Thermal image shows that the maximum standard deviation of the temperature on left and right side of 2 cavity mold is $1.23^{\circ}C$. The simulation and measurement results show that the quality of the frame in 2 cavity injection molding process as a whole is not worse than that of 1 cavity system. But maximum flexure loads of the frame in 2 cavity process are far greater than that in 1 cavity process.

• Polymer(Korea)
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• v.36 no.5
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• pp.555-563
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• 2012

Warpage of injection molded product is caused by non-uniform shrinkage during shaping operation and relaxation of residual stress. Robust part design and glass fiber reinforced reins have been adopted to prevent warpage of part. Warpages for part designs have been investigated in this study according to the injection molding conditions. Part design contains flat specimen and two different rib designs in the flat part. Resins used in this study were glass fiber reinforced amorphous plastics, PC and ABS. Different rib designs showed significant differences of warpages in the parts. Various warpages have been observed in the three regions of the part, near gate region, opposite region to the gate, and flow direction region. Results of computer simulation revealed that the warpages were strongly related to glass fiber orientation. Flat specimen showed the smallest warpage and the specimen with ribs to the flow direction showed a high resistance to warpage. Warpage highly depended upon part design rather than molding condition. It was concluded that the rib design and selection of gate location in injection molding would be the most important factors for the control of warpage since those are directly related to the fiber orientation during molding.