• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.4
• /
• pp.593-600
• /
• 2012

Thixomolding of Mg-alloy is a semi-solid injection molding process utilizing thixotropic phenomenon. Using this process, higher strength, thinner wall section and tighter tolerance without porosity are obtained. It has been applied for production of near-net-shape magnesium component. To design optimal thixomolding process of Mg-alloy part, molding conditions such as slurry temperature, mold temperature and injection time should be determined properly. Selection of these parameters has been dependent upon engineers' experience and intuitiveness. In this paper, to improve mechanical properties of the thixomolded product, optimal selection of process variables such as injection velocity, barrel temperature and die temperature in the process has been studied through microstructural analysis and Taguchi method. Performance of the process is verified through experiments.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.11 no.6
• /
• pp.1026-1035
• /
• 1987

The injection molding process is used in the fabrication of a large variety of plastic articles. A numerical simulation of the filling stage along the thickness direction is proposed by combining the free surface boundary condition with the relevant governing equations. The mathematical model is based on the equations of continuity, momentum and energy along with inelastic power-law model and relevant boundary conditions. Due to the significant implications for microstructure development in the pro duct, the fountain effect at the advancing free surface is explicitly taken into consideration in the simulation. The model yields data on free surface shape as well as velocity, pressure, temperature and shear stress distributions within the mold cavity. The rearrangement of the velocity and temperature profiles in the vicinity of the melt front is considered in detail.

• Transactions of Materials Processing
• /
• v.20 no.1
• /
• pp.73-78
• /
• 2011

The flashing reduces the part quality and the productivity of the molding process. We developed a contact pressure sensor to detect the flashing immediately. The performance of the sensor was analyzed in a simple 2D simulation. The sensor was applied to an automotive bumper mold with cavity pressure sensors. It showed sensitive output signal for the mold response by the cavity pressure change. It was confirmed that the flashing at the gate area occurred in the filling stage by the pressure increase due to growth of the melt flow length. The sensor output was correlated with the cavity pressure sensor output.

• Transactions of Materials Processing
• /
• v.20 no.1
• /
• pp.54-59
• /
• 2011

Optical properties in injection molded plastic lenses for mobile phone camera have been simulated using commercial program, 3D TIMON. Four plastic lenses are being used in mobile phone camera. The quality of photographs taken by mobile phone camera is strongly depends upon optical characteristics of lenses. The variety of optical properties has been investigated according to the injection conditions through the computer simulation. Consequently optimal injection conditions for four lenses have been determined and simulation results of birefringence have been compared with experiments.

• Transactions on Electrical and Electronic Materials
• /
• v.15 no.6
• /
• pp.344-347
• /
• 2014

This study was carried out on DLC thin film deposition technology used in infrared optical system production as a method of reducing the shape changes of the molding core and the consequent loss of life. Experiments on the deposition on silicon wafer and tungsten carbide used as a substrate for molding core were conducted at each processing condition using a filtered arc system, and it was found that the surface and mechanical properties were of the greatest quality when the substrate bias voltage of -150 V was used. In addition, it was confirmed that the PV and Ra characteristics were improved by the deposition of the DLC thin film.

• Proceedings of the KSME Conference
• /
• 2007.05a
• /
• pp.1792-1797
• /
• 2007

This paper try to find root-cause of failure in a connector used in transmitting signals for throttle body control in automotives by analyzing possible failure causes and performing experiments to simulate the cable failure in field. The connector comprises fins, wires, and case moldings. The failure is due to degradation of initial clamping force required fixing fins and wires in the connector. Expansion and compression of the case molding material surrounding fins would cause the degradation. Investigations of strict initial claming force and control of thermal expansion property of the molding are required to prevent the failure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1995.11a
• /
• pp.289-292
• /
• 1995

In this experiment the specimen is selected for epoxy resin used in the molding compound materials for the power semiconductors. The specimen was divided into the two parts. one is a specimen without irradiation, the other is irradiated with electron beam, of which dose is 1[Mrad], 2[Mrad], 4[Mrad], 8[Mrad] and 24[Mrad], respectively. From the analysis for the physical properties of the specimen, the carbonyl group which is asffact the electrical properties is decreased according to increase the dose of the electron beam. In the measurement of dielectric characteristics among the electrical properties, the frequency dependance of the dielectric characteristics is confirmed that its ${\beta}$-peak is represented by one peak due to attribute to the main chain below 50[$^{\circ}C$], and two peak above the temperature 100[$^{\circ}C$].

• Transactions of Materials Processing
• /
• v.15 no.9 s.90
• /
• pp.641-647
• /
• 2006

During the injection molding process an excessive packing can occur in the smaller volume cavity because of volumetric difference of the family-mold. It causes warpage by increased residual stress in the product and flesh by over packing. In this study, we used a variable-runner system for the filling balance of the cavities by changing the cross-sectional area of a runner, and confirmed the filling imbalance by temperature and pressure sensors. We carried out experiments to examine the influence of types of resins such as LDPE/ABS/PA6,6 on the filling balancing of the system, in order to help mold designers, who can easily adopt the variable-runner system to their design. We also examined filling imbalance in the system with CAE analysis.

• Transactions of Materials Processing
• /
• v.22 no.3
• /
• pp.171-177
• /
• 2013

Vacuum-assisted thermoforming is one of the critical steps for successful application of film insert molding (FIM) to make parts of complex shape. If the thickness distribution of the formed film is non-uniform, then cracking, deformation, warpage, and wrinkling can easily occur at the injection molding stage. In this study, the simulation of thermoforming was performed to predict the film thickness distribution, and the results were compared with experiments. Uniaxial tensile tests with a constant crosshead speed for various high temperatures were conducted to investigate the stress-strain behavior. An instance of yielding occurred at the film temperature of $90^{\circ}C$, and the film stiffness increased with increasing crosshead speed. Two types of viscoelastic models, G'Sell model, K-BKZ model, were used to describe the measured stress-strain relationship. The predicted film thickness distributions were in good agreement with the experimental results.

• Proceedings of the KSME Conference
• /
• 2003.04a
• /
• pp.940-944
• /
• 2003

With the increasing demand for plastic micro components, micro-/nano-molding using the mother stamper has received much attention. If the replication temperature is too high, the adhesion between the stamper and the polymer melt may deteriorate the surface quality of the replicated part, excessively wearing down the stamper. In this paper, an experimental method analyzes the temperature dependency of the anti-adhesion property between the actual stamper with patterns of sub-micrometer and the polymer melt. As a practical example, a correlation between the contact angle of the stamper and the surface quality of the molded substrates as a function of the replication temperature, respectively, was obtained quantitatively.