• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1524-1525
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• 2007

A flexible tactile sensor module based on polyimide matrix integrated with sensing elements and pluggable terminals connector was fabricated by polymer micromachining technology for robotic applications. The tactile sensor arrays are composed of $4{\times}4$, $8{\times}8$ and $16{\times}16$ sensing elements connected with pluggable terminals connector, respectively. Especially, both the tactile sensor array and the pluggable terminals are formed in the sensor module during the fabrication process. The fabricated tactile sensor module is measured continuously in the normal force range of $0{\sim}1N$ with tactile sensor auto-evaluation system. The value of resistance is relatively increased linearly with normal force in the overall range. The variation rate of resistance is about 2.0%/N in the range of $0{\sim}0.6N$ and 1.5%/N in the range of $0.6{\sim}1N$. Also, the flexibility of the sensing module is adequate to be placed on any curved surface as cylinder because the matrix consists of polymer and metal thin film.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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• pp.411-414
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• 2004

This paper introduces a modulation method for digital wireless communication based on general DS-QPSK. The design and fabrication is for home networking application to a typical RF transmitter with DS-QPSK modulator. This modulator implemented using VHDL hardware programming language, the fabrication of IC chip $5{\times}5 mm^2$ was carried by 27th IDEC MPW(Multi Project Wafer) process in 0.35${\mu}m$ rule at Samsung Inc. This paper presented the important of this technology for the future application in wireless sensor. This module can be efficient usage for home network to transmit the RF wireless sensor system.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.996-999
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• 2008

Aspheric polymer lens fabrication using isothermal compression molding is presented in this paper. Due to increasing definition of an image sensor, higher precision is required by a lens which can be used as a part of an imageforming optical module. Injection molding is a factory standard method for a polymer optical lens. But achievable precision using injection molding has a formidable limitation due to the machining of complex mold structure and melting and cooling down a polymer melt under high pressure condition during forming process. To overcome the precision requirement and limitation using injection molding method, isothermal compression molding is applied to fabrication of a polymer optical lens. The fabrication condition is determined by numerical simulations of temperature distribution and given material properties. Under the found condition, the lens having a high precision can successfully be reproduced and does not show birefringence which results often in optical degradation.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2006년도 춘계학술대회
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• pp.130-133
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• 2006

Solar Photovoltaics (SPV) In India has become an important renewable source of energy particularly for rural and remote areas. The vastness of the country and the requirements of electricity in far-flung villages makes SPV very attractive, with inherent technological advantages providing additional boost. This has been recognized very early by Govt. Of India and Ministry of Non-Conventional Sources of Energy (MNES) has been entrusted with promoting SPV usage in the country. Rural electrification through SPV systems is one of the programmes which is expected to provide fillip to PV industry in the country. PV Industry in India is very well established with capability of solar cell fabrication and module fabrication as well as Balance of System design and fabrication. There several R&D groups in the academic institutions who are involved in improving solar cells efficiency, thin film solar cells and PV instrumentation. Thus, India provides a ready market for large scale utilization of solar energy through SPV technology.

• 한국통신학회:학술대회논문집
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• 한국통신학회 2004년도 하계종합학술발표회논문초록집
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• pp.330-330
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• 2004

• 한국광학회:학술대회논문집
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• 한국광학회 1996년도 Advance Program of 13th optics andquantum Electronics conference, 1996제13 회 광학 및 양자전자 학술 발표회 논문 요약집
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• pp.92-92
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• 1996

• 한국광학회:학술대회논문집
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• 한국광학회 2006년도 하계학술발표회 논문집
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• pp.329-330
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• 2006

• 한국고분자학회지:고분자과학과기술
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• 제21권1호
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• pp.24-32
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• 2010

• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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• pp.72.1-72
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• 1998

• 한국통신학회논문지
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• 제25권10B호
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• pp.1701-1706
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• 2000

본 연구에서 GaAs pHEMT와 도파관-마이크로스트립 변환구조를 이용하여 38 GHz 대역 하이브리드 전력증폭기 모듈이 개발되었다. 10 mil duroid 기판이 전력증폭가와 도파관-마이크로스트립 변환구조 제작에 사용되었다. 제작된 도파관-마이크로스트립 변환구조는 32 - 40 GHz 대역까지 약 I dB 삽입손실(back to back)의 측정 결과를 보였다. 전력증폭기 모듈의 측정 결과, 36.8 - 38.5 GHz에서 대략 출력 전력 29 dBm(P1.5 dB), 전력 이득은 7.2 dB, PAE 는 11.2 % 였다.