• The Journal of the Korea Contents Association
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• v.6 no.4
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• pp.1-10
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• 2006

In this paper, a broadband RF module is designed and tested for 2.4GHz band applications. The RF module is composed of a low noise amplifier (LNA) with a three stage amplifier, a single ended gate mixer, matching circuits, a hairpin line band pass filter and a Chebyshev low pass filter to convert the radio frequency (RF) into the intermediate frequency (IF). The LNA has a high gain and stability, and the single ended gate mixer has a high conversion gain and wide dynamic range. In the analysis of the broadband RF module, the composite harmonic balance technique is used to analyze the operating characteristics of an RF module circuit. The RF module has a 55.2dB conversion gain with a 1.54dB low noise figure, $-120{\sim}-60dBm$ wide RF power dynamic range, -60dBm low harmonic spectrum and a good isolation factor among the RF, IF, and local oscillator (LO) ports.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.12
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• pp.815-819
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• 2014

Aluminum nitride (AlN) thin film and TiN film as a buffer layer were deposited on INCONEL 600 substrate by reactive RF magnetron sputtering at room temperature(R.T.) under 25~75% $N_2/Ar$ atmosphere. The as-deposited AlN films at 25~50% $N_2/Ar$ showed a polycrystalline phase of hexagonal AlN, and an amorphous phase. The peak of AlN (002) plane, which was determinant on a performance of piezoelectric transducer, became strong with increasing the $N_2/Ar$ ratio. Any change in the preferential orientation of the as-deposited AlN films was not observed within our $N_2$ concentration range. The piezoelectric sensing properties of AlN module were performed using pressure-voltage measurement system. The output signal voltage of AlN module showed a linear behavior between 20~80 mV in 1~10 MPa range, and the pressure-sensing sensitivity was calculated as 3.6 mV/MPa.

• Journal of the Korean Society of Safety
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• v.32 no.3
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• pp.15-20
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• 2017

This study presented the strength of the materials and parts for smart distribution board fabrication, and developed a work operation process chart for smart distribution board fabrication. This work operation process chart for smart distribution board fabrication complied with SPS-KEMC regulations, and the applicable range and object are less than 1,000 V and 1,000 Hz for the AC distribution board and less than 1,500 V for the DC distribution board. The power supply is 3 phase 4 wires ($3{\Phi}$ 4W), divided into a single phase circuit and a 3 phase circuit. In addition, the circuit was configured so that the leakage current flowing through the distribution line of the load could be monitored in real time by using the sensor module installed at the rear end of the circuit breaker. Therefore, the administrator can easily find the risk factor of the load since engineer can check the leakage current of each distribution line. In addition, if a leakage current greater than standard value flows, it is possible to generate an alarm against a short circuit and cut off the leakage current. The work operation process chart for the smart distribution board fabrication consists of the following steps: raw and subsidiary materials, sheet metal work, tube making, welding, painting, busbar fabrication, assembly and wiring, product inspection, shipment, etc. Moreover, symbols, ${\Delta}$, ${\nabla}$, ${\bigcirc}$, ${\Rightarrow}$, etc. were used according to the type of work and work progress so that workers can easily understand the progress of the work.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.83-89
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• 2004

NTC thermistor embedded miniature thermoelectric module was fabricated for the precise temperature control of optical communication device such as laser diode (LD). The miniature thermoelectric module ($7.2 mm{\times}9 mm{\times}2.2 mm$) consists of 21 BiTe thermoelectric couples, the operating temperature is precisely controlled by embedded thermistor with quick response. The figure-of-merit (Z), maximum temperature difference (${\Delta}T_{max}$), maximum cooling capacity ($Q_{max}$) of the miniature thermoelectric module were $2.5{\times}10^{-3}$/K, 72 K, 2.2 W respectively and temperature could be controlled in range of ${\pm}0.1^{\circ}C$ accuracy in air. The fabricated miniature thermoelectric module is suitable for applications of the optical communication packaging.

• Korean Journal of Optics and Photonics
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• v.14 no.2
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• pp.135-141
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• 2003

In arrayed waveguide grating (AWG) devices whose waveguides were composed of polymer with negative thermo-optic coefficient as overcladding, and silica with positive thermo-optic coefficient as both core and undercladding, we investigated the temperature dependence of the central wavelength using two-dimensional SFDM. From these results, it was confirmed that the temperature dependence can be nearly eliminated by adjusting the refractive index of the cladding and the thickness of the silica thin film upper-loaded on the core. Based on the numerical calculations, the AWG device with polymer overcladding was fabricated. and its optical characteristics were compared with those of the orginal silica AWG device. The introduction of polymer overcladding decreased the temperature dependence of the central wavelength from 0.0130 nm/$^{\circ}C$ to 0.0028 nm/$^{\circ}C$ without deteriorating the insertion loss and crosstalk characteristics.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.3
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• pp.264-272
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• 2009

In this paper, a Ka-band 10 W power amplifier module is designed and fabricated using MIC(Microwave Integrated Circuit) module technology which combines multiple power MMIC(Monolithic Microwave Integrated Circuit) chips on a thin film substrate. Modified Wilkinson power dividers/combiners are used for millimeter wave modules and CBFGC-PW-Microstrip transitions are utilized for reducing connection loss and suppressing resonance in the high-gain and high-power modules. The power amplifier module consists of seven MMIC chips and operates in a pulsed mode. for the pulsed mode operation, a gate pulse control circuit supplying the control voltage pulses to MMIC chips is designed and applied. The fabricated power amplifier module shows a power gain of about 58 dB and a saturated output power of 39.6 dBm at a center frequency of the interested frequency band.

• The Journal of the Korea institute of electronic communication sciences
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• v.13 no.5
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• pp.943-948
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• 2018

In this paper, SSPA Module for X-band radar was designed and fabricated by using GaN MMIC. For the purpose of configuring the high power SSPA module, the drive steamers are composed of 2-layers of GaN MMIC with considering Gain Loss. In addition, the power divider and power combiner used a 4way approach by designing a 4-stage power amplifier. The power divider has a loss of -3.0dB or more, and the I/O has a loss of -0.2dB in the power combiner and the phase difference between the ports are good at $2^{\circ}$ on average. The fabricated SSPA module got the measurement results that satisfy a Gain 48dB, P(sat)=88.3W(49.46 dBm), PAE=30.3% or more efficiency in condition of frequency range 9~10GHz. The fabricated X-Band SSPA module can be applied in RF performance improvement for SSPA module whit improvement of power divider/combiner.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.3
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• pp.223-228
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• 2023

Sustainable energy supplies without the recharging and replacement of the charge storage device have become increasingly important. Among various energy harvesters, the triboelectric nanogenerator (TENG) has attracted considerable attention due to its high instantaneous output power, broad selection of available materials, eco-friendly and inexpensive fabrication process, and various working modes customized for target applications. In this study, the amount of voltage and current generated was measured by applying the PSD profile random vibration test of the electronic vibration tester and ISTA 3A according to the time of Anodized Aluminum Oxide (AAO) pore widening of the manufactured TENG device Teflon and AAO. The discharge and charging tests of the integrated module during the random simulated transport environment and the recognition distance of RFID were measured while agricultural products (onion) were loaded into the returnable folding plastic box. As a result, it was found that AAO alumina etching processing time to maximize TENG performance was optimal at 31 min in terms of voltage and current generation, and the integrated module applied with the TENG module showed a charging effect even during the continuous use of RFID, so the voltage was kept constant without discharge. In addition, the RFID recognition distance of the integrated module was measured as a maximum of 1.4 m. Therefore, it was found that the surface condition of AAO, a TENG element, has a great influence on the power generation of the integrated module, and due to the characteristics of TENG, the power generation increases as the surface dries, so it is judged that the power generation can be increased if the surface drying treatment (ozone treatment, etc.) of AAO is applied in the future.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• Korean Journal of Optics and Photonics
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• v.5 no.3
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• pp.423-430
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• 1994

We designed and fabricated the single mode fiber pigtailed DFB-LD module for 2.5 Gbps optical communication system. In the design of the DFB-LD module, we made the module divided into two parts of inner sub-module and outer 14-pin butterfly package and cylindrical shaped sub-module contain quasi confocal 2 lens system including optical isolator and electrical connection between these parts via hybrid substrate of bias T circuit. Laser welding was used to assemble the sub-module which requires accurate fixing between optical elements. The fabricated DFB-LD module showed optical coupling efficiency of 20% and - 3 dB small signal response of more than 2.6 GHz. We confirmed mechanical reliability of the module by temperature cycle test where the tested module exhibit optical power fluctuation of less than 10%. Finally we evaluated the performance of the fabricated DFB-LD module as light source of 2.5 Gbps optical communication system, sensitivity of - 30.2 dBm was obtained through 47 km optical fiber transmission under the criterion of $1\times10^{-10}$ BER and transmission penalties were 1.5 dB caused by extinction ratio and 1.0 dB caused by chromatic dispersion of normal single mode fiber. fiber.