• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05b
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• pp.119-123
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• 2002

A new modular Lateral Information Propagation Networks(LIPN) has been designed. The LIPN has shown to be useful for reconstruction of information[3]. The problem is the fact that only the small number of nodes can be implemented in a IC chip with the circuit VLSI technology. The proposed modular architecture is propagated the neural network through inter module connections. For such inter module connections, the host (computer or logic) mediates the exchange of information among modules. Also border nodes in each module have capacitors for temporarily retaining the information from outer modules. The LIPN with $4{\times}4$ modules has been designed and simulation of interpolation with the designed LIPN has been done.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04c
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• pp.54-57
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• 2008

A new modular Lateral Information Propagation Networks can be implemented in a IC chip with the circuit VLSI technology for detection of bad materials. The proposed modular architecture is propagated the neural network through inter module connections. For such inter module connections, the host(computer or logic) mediates the exchange of information among modules. Also border nodes in each module have capacitors for temporarily retaining the information from outer modules. For detecting of Faulty Insulator, $4\;{\times}\;4$ neural network modules has been designed and simulation of interpolation with the designed networks has been done.

• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2206-2208
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• 1998

The modular Lateral Information Propagation Networks(LIPN) has been designed. The LIPN has shown to be useful for interpolation of information[3]. The problem is the fact that only the small number of nodes can be implemented in a IC chip with the circuit VLSI technology. The proposed modular architecture is for enlarging the neural network through inter module connections. For such inter module connections, the host(computer or logic) mediates the exchange of information among modules. Also border nodes in each module have capacitors for temporarily retaining the information from outer modules. The LIPN with $4{\times}4$ modules has been designed and simulation of interpolation with the designed LIPN has been done.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11b
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• pp.7-12
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• 2004

New modular Lateral Information Propagation Networks(LIPN) has been designed. The LIPN has shown to be useful for interpolation of information[3]. The problem is the fact that only the small number of nodes can be implemented in a IC chip with the circuit VLSI technology. The proposed modular architecture is for enlarging the neural network through inter module connections. For such inter module connections, the host(computer or logic) mediates the exchange of information among modules. Also border nodes in each module have capacitors for temporarily retaining the information from outer modules. Simulation of interpolation with the designed LIPN has been done through various experiments.