• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 센서 박막재료 반도체재료 기술교육
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• pp.119-123
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• 2002

A new modular Lateral Information Propagation Networks(LIPN) has been designed. The LIPN has shown to be useful for reconstruction of information[3]. The problem is the fact that only the small number of nodes can be implemented in a IC chip with the circuit VLSI technology. The proposed modular architecture is propagated the neural network through inter module connections. For such inter module connections, the host (computer or logic) mediates the exchange of information among modules. Also border nodes in each module have capacitors for temporarily retaining the information from outer modules. The LIPN with $4{\times}4$ modules has been designed and simulation of interpolation with the designed LIPN has been done.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 춘계학술대회 논문집 센서 박막재료연구회 및 광주 전남지부
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• pp.54-57
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• 2008

A new modular Lateral Information Propagation Networks can be implemented in a IC chip with the circuit VLSI technology for detection of bad materials. The proposed modular architecture is propagated the neural network through inter module connections. For such inter module connections, the host(computer or logic) mediates the exchange of information among modules. Also border nodes in each module have capacitors for temporarily retaining the information from outer modules. For detecting of Faulty Insulator, $4\;{\times}\;4$ neural network modules has been designed and simulation of interpolation with the designed networks has been done.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 G
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• pp.2206-2208
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• 1998

The modular Lateral Information Propagation Networks(LIPN) has been designed. The LIPN has shown to be useful for interpolation of information[3]. The problem is the fact that only the small number of nodes can be implemented in a IC chip with the circuit VLSI technology. The proposed modular architecture is for enlarging the neural network through inter module connections. For such inter module connections, the host(computer or logic) mediates the exchange of information among modules. Also border nodes in each module have capacitors for temporarily retaining the information from outer modules. The LIPN with $4{\times}4$ modules has been designed and simulation of interpolation with the designed LIPN has been done.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집
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• pp.7-12
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• 2004

New modular Lateral Information Propagation Networks(LIPN) has been designed. The LIPN has shown to be useful for interpolation of information[3]. The problem is the fact that only the small number of nodes can be implemented in a IC chip with the circuit VLSI technology. The proposed modular architecture is for enlarging the neural network through inter module connections. For such inter module connections, the host(computer or logic) mediates the exchange of information among modules. Also border nodes in each module have capacitors for temporarily retaining the information from outer modules. Simulation of interpolation with the designed LIPN has been done through various experiments.