• 비파괴검사학회지
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• 제28권2호
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• pp.199-204
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• 2008

The generation of axisymmetric Lamb waves and interaction with wall thinning (corrosion) defects in hollow cylinders are simulated using the finite element method. Guided wave interaction with defects in cylinders is challenged by the multi-mode dispersion and the mode conversion. In this paper, two longitudinal, axisymmetric modes are generated using the concept of a time-delay periodic ring arrays (TDPRA), which makes use of the constructive/destructive interference concept to achieve the unidirectional emission and reception of guided waves. The axisymmetric scattering by the wall thinning extending in full circumference of a cylinder is studied with a two-dimensional FE simulation. The effect of wall thinning depth, axial extension, and the edge shape on the reflections of guided waves is discussed.

• 전자공학회논문지C
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• 제34C권8호
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• pp.49-63
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• 1997

This paper presents a current sensor that detects defects in CMOS integrated circuits using the current testing technique. The current sensor is built in a CMOS integrated circuit to test an abnormal current. The proposed circuit has a very small impact on the performance of the circuit under test during the normal mode. In the testing mode, the proposed circuit detects the abnormal current caused by permanent manufacturing defects and determines whether the circuit under test is defect-free or not. The proposed current sensor is simple and requires no external voltage and current sources. Hence, the circuit has less area and performance degradation, and is more efficient than any previous works. The validity and effectiveness are verified through the HSPICE simulation on circuits with defects.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 춘계학술대회 논문집
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• pp.128-133
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• 1999

In recent years, LSI devices have become more powerful and lower-priced, caused by a development of various wafer materials and an increase in the diameter of wafers. On the other hand, these have created some serious problems in manufacturing of wafers because materials used as semiconductor substrate are very brittle. In view of this fact, there are some trials to apply shear-mode(or ductile-mode) grinding for efficient manufacturing of semiconductor wafers instead of conventional lapping process. In fact grinding process that has not only more excellent degree of accuracy but also more adaptable to fully automated manufacturing than lapping, is already used in Si machining field. This paper described the elementary studies to establish the grinding technology of wafers. First, we investigated the variation of grinding force and the transition of grinding mode as various grinding conditions. Then, it was inspected that the change of grinding force affected the integrity such as the topography and the roughness of ground surfaces, and led to the chemical defects generation and distribution in damaged layer. The degree of defects was estimated by FT-IR(Fourier Transformed Infrared) Spectroscopy and Auger Electron Spectroscopy

• 한국소음진동공학회논문집
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• 제24권8호
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• pp.636-642
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• 2014

The sensor configuration of the magnetostrictive guided wave system can be described as a single continuous transducing element which makes it difficult to separate the individual modes from the reflected signal. In this work we develop the mode decomposition technique employing chirplet transform, which is able to separate the individual modes from dispersive and multimodal waveform measured with the magnetostrictive sensor, and to estimate the time-frequency centers and individual energies of the reflection, which would be used to locate and characterize defects. The reflection coefficients are calculated using the modal energies of the separated mode. Results from experimental results on a carbon steel pipe are presented, which show that the accurate and quantitative defect characterization could become enabled using the proposed technique.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.1254-1257
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• 2004

This paper presents a built-in current sensor(BICS) that can detect defects in CMOS integrated circuits through current testing technique - Iddq test. Current test has recently been known to a complementary testing method because traditional voltage test cannot cover all kinds of bridging defects. So BICS is widely used for current testing. but there are some critical issues - a performance degradation, low speed test, area overhead, etc. The proposed BICS has a two operating mode- normal mode and test mode. Those methods minimize the performance degradation in normal mode. We also used a current-mode differential amplifier that has a input as a current, so we can realize higher speed current testing. Furthermore, only using 10 MOSFETS and 3 inverters, area overhead can be reduced by 6.9%. The circuit is verified by HSPICE simulation with 0.25 urn CMOS process parameter.

• 한국압력기기공학회 논문집
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• 제15권1호
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• pp.40-45
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• 2019

Unlike the welded pipes in the primary system of light water nuclear power plants being periodically inspected with in-Service inspection program, relatively small pipes with the outer diameter less than 2 inch have not been regularly inspected to date. However, after several failure reports on the occurrence of critical crack-like defects in small pipes, inspection for the small pipes has been more demanded because it could cause the provisional outage of nuclear power plants. Nevertheless, there's no particular method to examine the small pipes having access limitations for inspection due to various reasons; inaccessible area, excessive radiation exposure, hazardous surrounding, and etc. This study is to develop a reliable inspection technique using torsional and flexural modes of guided wave to detect defects that could occur in inaccessible area. The attribute of guided wave that can travel a long distance enables to inspect even isolated range of the pipe from accessible location. This paper presents a case study of the evaluation test on 3/4" small-bore pipes with guide wave method. The test result demonstrates the crack signal behavior and assures possibility to detect the crack signal in a flexural mode, which is clearly distinguishable from the symmetric structure signal in a torsional mode.

• 소성∙가공
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• 제12권6호
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• pp.566-571
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• 2003

The metal forming behavior and defect formation in Ti-6Al-4V tube during hot backward extrusion were investigated. Dynamic material model(DMM) including Ziegler's instability criterion was employed to predict the forming defects such as shear band, inner and/or surface cracks. This approach was coupled to the internal variables generated from FE analysis. The simulation results fur the backward extrusion were compared with the experimental observation. The chilling effect and friction indicated a great influence on the deformation mode of the tube and the formation of surface cracks. The formation of forming defects in the extruded tube was attributed to non-uniform distribution of strain, strain rate and temperatures in the extruded tubes for the given test conditions.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.194-196
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• 2005

Ultrasonic guided waves are gaining increasing attention for the inspection of platelike and rodlike structures. At the same time, inspection methods that do not require contact with the test piece are being developed for advanced applications. This paper capitalizes on recent advances in the areas of guided wave ultrasonics and noncontact ultrasonics to demonstrate a superior method for the nondestructive detection of thinning defects simulating hidden corrosion in thin aluminum plates. The proposed approach uses EMAT(electro-magnetic acoustic transducer) for the noncontact generation and detection of guided plate waves. Interesting features in the dispersive behavior of selected guided modes are used for the detection of plate thinning. It is shown that mode cutoff measurements provide a qualitative detection of thinning defects. Measurement of the mode group velocity can be also used to quantify of thinning depth.

• International Journal of Precision Engineering and Manufacturing
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• 제7권3호
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• pp.18-23
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• 2006

The formation degree of sustain (ITO pattern) determines the quality of a PDP (Plasma Display Panel). Thus, in the present study, we attempt to detect 100% of the defects that are larger than $30{\mu}m$. Currently, the inspection method in the PDP manufacturing process is dependent upon the naked eye or a microscope in off-line mode. In this study, a prototype inspection system for PDP ITO patterned glass is developed. The developed system, which is based on a line-scan mechanism, obtains information on the defects and sorts the defects by type automatically. The developed inspection system adopts a multi-vision method using slit-beam formation for minimum inspection time and the detection algorithm is embodied in the detection ability. Characteristic defects such as pin holes, substances, and protrusions are extracted using the blob analysis method. Defects such as open, short, spots and others are distinguished by the line type inspection algorithm. It was experimentally verified that the developed inspection system can detect defects with reliability of up to 95% in about 60 seconds for the 42-inch PDP panel.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2009년도 춘계학술대회 논문집 특별세미나,특별/일반세션
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• pp.387-392
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• 2009

Measurement of dynamic characteristics are widely used to detect defects in mechanical or civil structures. The most common approach is to measure changes in frequency spectrum or mode shapes using accelerometers. An alternative to using mode shapes is using stain modes. Strain is more sensitive to local defects than displacement, and hence stain modes measurement is an efficient in structural health monitoring. This paper deals with dynamic monitoring of a beam structure using strain sensors. Resistive strain gages and FBG strain gages are used and their characteristics are compared. It has been known that resistive strain gages are week to EMI environment and suffers from noise at high frequency range. It has been shown that the FBG sensor is a good alternative that overcomes such difficulties.