• Title/Summary/Keyword: mobile fan

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Study on the energy-saving constant temperature and humidity machine operating characteristics (에너지 절감형 항온항습기 운전 특성에 관한 연구)

  • Cha, Insu;Ha, Minho;Jung, Gyeonghwan
    • Journal of Energy Engineering
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    • v.25 no.3
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    • pp.27-33
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    • 2016
  • The heat recovery system that was applied in this study, is the energy-saving type that can produce the maximum cooling capacity less power in use. In order to have a more precise control function the temperature and humidity of the constant temperature and humidity machine, control algorithm is applied to designed a fuzzy PID controller, and the outside air compensation device (air-cooled) demonstrated excellent ability to dehumidify the moisture, $-20^{\circ}C$ in winter. High efficiency and the low-noise type sirocco fan operate quitely and designed to fit the bottom-up and top-down in accordance with the characteristics of equipment. as a result of experiment data, the conversion efficiency is 95% or more, power recovery time is within 5sec, stop delay time is within 30sec, pump down time is 10sec, pump delay time is 5sec, heating delay time is 5sec, temperature deviation is ${\pm}2^{\circ}C$ (cooling deviation: $2^{\circ}C$, Heating deviation : $2^{\circ}C$), humidity deviation is a ${\pm}5%$ (humidification deviation 3.0%, dehumidification deviation 3.0%). Recently, ubiquitous technology is important. so, the constant temperature and humidity machine designed to be able to remotely control to via the mobile phone, and more scalable to support MMI software and automatic interface. Further, the life of the parts and equipment is extended by the failure.

Copper Interconnection and Flip Chip Packaging Laboratory Activity for Microelectronics Manufacturing Engineers

  • Moon, Dae-Ho;Ha, Tae-Min;Kim, Boom-Soo;Han, Seung-Soo;Hong, Sang-Jeen
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.431-432
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    • 2012
  • In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

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Analysis of the Effects of E-commerce User Ratings and Review Helfulness on Performance Improvement of Product Recommender System (E-커머스 사용자의 평점과 리뷰 유용성이 상품 추천 시스템의 성능 향상에 미치는 영향 분석)

  • FAN, LIU;Lee, Byunghyun;Choi, Ilyoung;Jeong, Jaeho;Kim, Jaekyeong
    • Journal of Intelligence and Information Systems
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    • v.28 no.1
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    • pp.311-328
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    • 2022
  • Because of the spread of smartphones due to the development of information and communication technology, online shopping mall services can be used on computers and mobile devices. As a result, the number of users using the online shopping mall service increases rapidly, and the types of products traded are also growing. Therefore, to maximize profits, companies need to provide information that may interest users. To this end, the recommendation system presents necessary information or products to the user based on the user's past behavioral data or behavioral purchase records. Representative overseas companies that currently provide recommendation services include Netflix, Amazon, and YouTube. These companies support users' purchase decisions by recommending products to users using ratings, purchase records, and clickstream data that users give to the items. In addition, users refer to the ratings left by other users about the product before buying a product. Most users tend to provide ratings only to products they are satisfied with, and the higher the rating, the higher the purchase intention. And recently, e-commerce sites have provided users with the ability to vote on whether product reviews are helpful. Through this, the user makes a purchase decision by referring to reviews and ratings of products judged to be beneficial. Therefore, in this study, the correlation between the product rating and the helpful information of the review is identified. The valuable data of the evaluation is reflected in the recommendation system to check the recommendation performance. In addition, we want to compare the results of skipping all the ratings in the traditional collaborative filtering technique with the recommended performance results that reflect only the 4 and 5 ratings. For this purpose, electronic product data collected from Amazon was used in this study, and the experimental results confirmed a correlation between ratings and review usefulness information. In addition, as a result of comparing the recommendation performance by reflecting all the ratings and only the 4 and 5 points in the recommendation system, the recommendation performance of remembering only the 4 and 5 points in the recommendation system was higher. In addition, as a result of reflecting review usefulness information in the recommendation system, it was confirmed that the more valuable the review, the higher the recommendation performance. Therefore, these experimental results are expected to improve the performance of personalized recommendation services in the future and provide implications for e-commerce sites.