• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.1-7
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• 2023

The ability of 3D/4D printing technology to create arbitrary 3D structures provides a greater degree of freedom in the design of printed structures. This capability has influenced the field of electronics and biomedical applications by enabling the trends of device miniaturization, customization, and personalization. Here, the current state-of-the-art knowledge of 3D printed electronics and biomedical applications with the unique and unusual properties enabled by 3D/4D printing is reviewed. Specifically, the review encompasses emerging areas involving recyclable and degradable electronics, metamaterial-based pressure sensor, fully printed portable photodetector, biocompatible and high-strength teeth, bioinspired microneedle, and transformable tube array for 3D cell culture and histology.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.23 no.5
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• pp.131-138
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• 2023

In this paper, a free space optical communication device that can be used in a mobile base station of several km or less was fabricated and its characteristics were investigated. To overcome the loss due to atmospheric transmission, an optical fiber amplifier (EDFA) with an output of 23 dBm or more was used. In order to increase the focusing speed and miniaturization of the laser beam, an optical lens was manufactured, and a transmission lens was designed to have beam divergence within the range of 1.5 to 1.8 [mrad]. A PT module that controls PAN/TILT was fabricated in order to reduce pointing errors and effective automatic alignment between transceiver devices. In this study, Reed-Solomon (RS) code was used to maintain the transmission quality above a certain level. It was manufactured to be able to communicate at a wireless distance of 300m in a weather situation with visibility of 300m. For performance measurement, it was measured using BERT and eye pattern analyzer, and it was confirmed that BER can be maintained at 2.5Gbps.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.130-135
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• 2023

Plasma-resistant ceramic (PRC) is a material used to prevent internal damage in plasma processing equipment for semiconductors and displays. The challenge is to suppress particles falling off from damaged surfaces and increase retention time in order to improve productivity and introduce the latest miniaturization process. Here, we confirmed the effect of suppressing plasma deterioration and reducing the etch rate through surface treatment of existing PRC with an initial illumination level of 200 nm. In particular, quartz glass showed a decrease in etch rate of up to 10%. Furthermore, it is believed that micro-scale secondary particles formed on the microstructure of each material grow as crystals during the fluoridation process. This is a factor that can act as a killer defect when dropped, and is an essential consideration when analyzing plasma resistance. The plasma etching suppression effect of the initial illumination is thought to be due to partial over etching at the dihedral angle of the material due to the sputtering of re-emission of Ar+-based cations. This means that plasma damage due to densification can also be interpreted in existing PRC studies. The research results are significant in that they present surface treatment conditions that can be directly applied to existing PRC for mass production and a new perspective to analyze plasma resistance in addition to simple etching rates.

• The Journal of the Korea institute of electronic communication sciences
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• v.18 no.6
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• pp.1023-1030
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• 2023

FMCW LiDAR system with robust target detection capabilities even under adverse operating conditions such as snow, rain, and fog is addressed in this paper. Our focus is primarily on enhancing the performance of FMCW LiDAR by improving the characteristics of the frequency-modulated laser, which directly influence range resolution, coherence length, and maximum measurement range etc. of LiDAR. We describe the utilization of an unbalanced Mach-Zehnder laser interferometer to measure real-time changes of the lasing frequency and to correct frequency modulation errors through an optical phase-locked loop technique. To extend the coherence length of laser, we employ an extended-cavity laser diode as the laser source and implement a laser interferometer with an photonic integrated circuit for miniaturization of optical system. The developed FMCW LiDAR system exhibits a bandwidth of 10.045GHz and a remarkable distance resolution of 0.84mm.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.24 no.1
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• pp.23-30
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• 2024

This paper dedcribes the design. verification, and analysis techniques for an advanced phased array antenna. When applying an active phased array antenna to an aircraft or missile, miniaturization of the array antenna and wide-angle beam steering characteristics can be unavoidable antenna design considerations. In particular, the active reflection coefficient characteristics when electronically steering a wide-angle beam is a design parameter that must be minimized in terms of system survival and system performance. As a radiator suitable for broadband characteristics and wide-angle beam steering, this paper designed an array structure using SFN and minimized the active reflection coefficient according to beam steering of up to 40° based on the spherical coordivate system angle. The bandwidth of the radiator was confirmed to be 3GHz based on active reflection in the Ka-band. In addition, the performance of the actually manufactured 8by8 array antenna wsa analyzed by measuring the single pattern of the radiator through a near-field test, mathematically synthesizing it, and predicting the Tx/TRx beam used in the seeker system.

• Journal of Advanced Navigation Technology
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• v.27 no.6
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• pp.815-820
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• 2023

In this paper, the design method of a miniaturized chipless RFID tag using a modified bent H-shaped slot was proposed. The proposed modified bent H-shaped slot was appended on the rectangular conductor plate printed on one side of a 20 mm × 50 mm FR4 substrate with a thickness of 0.8 mm. The resonant dip frequency of the bistatic RCS for the proposed modified bent H-shaped slot was compared with the cases when the H-shaped, U-shaped slot, and bent H-shaped slots were added, respectively, on the conductor plate. The simulated resonant dip frequencies for H-shaped, U-shaped, and bent H-shaped slots were 5.907 GHz, 4.918 GHz, and 4.364 GHz, respectively. When the proposed modified bent H-shaped slot was added, the resonant dip frequency was decreased to 3.741 GHz, and, therefore, the slot length was reduced by 36.7% compared to the H-shaped slot case. Experiment results show that the resonant dip frequency of the fabricated modified bent H-shaped slot was 3.9 GHz.

• The Journal of the Korea institute of electronic communication sciences
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• v.19 no.1
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• pp.19-24
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• 2024

In this paper, in order to realize lower cut-off frequency of the waveguide, the folded Ridge waveguide (FRWG) is suggested by alternating T-shape structure in the conventional folded waveguide with Y-shape structure. Suggested FRWG can be equivalent by the reverse Ridge waveguide. As the height of side of the FRWG is lower, the width of side is increased. Therefore, the cut-off frequency of the FRWG can be decreased more than half compared with conventional waveguide. The FRWG is designed with the length, height, and width of Y-shape structure of 40mm, 20mm, and 2mm, respectively. Designed FRWG has the cut-off frequency of the 1.996GHz. Also, the transition between the FRWG and SMA connector is designed. The transition is optimized by the capacitance of the signal line of the connector. Its result shows the VSWR under 2:1 in the band of 2.064 ~ 3.050 GHz. Suggested FRWG can be applied with miniaturization of various waveguide devices.

• Journal of Advanced Navigation Technology
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• v.28 no.3
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• pp.356-361
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• 2024

This paper deals with the design and fabrication of a coplanar waveguide (CPW)-fed super-wideband semicircular-disk-shaped dipole antenna operating in a frequency band of 2.4 GHz or higher. To feed the antenna, a CPW feed line was appended to the center of the lower arm of the semicircular-disk-shaped dipole antenna. For miniaturization, square patches were added to the ends of the two arms of the semicircular-disk-shaped dipole, whereas the slot width of the CPW feed line at the center of the dipole antenna was increased to improve impedance matching in the 5.4-6.3 GHz band. The simulated frequency band of the proposed antenna for a voltage standing wave ratio (VSWR) less than 2 was 2.369-30 GHz(170.7%), whereas the fabricated antenna was maintained VSWR less than 2 in the frequency range of 2.378-20 GHz when measured using a network analyzer operating up to 20 GHz so it can be applied as a super-wideband antenna for next-generation mobile communications.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.7-15
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• 2024

In the trend of the multi-functionalization, miniaturization, and increased power output trends of flexible and stretchable electronic devices, the development of materials or structures with superior heat transfer characteristics has become a pressing issue. Traditional thermal interface materials (TIM) fail to meet the heat dissipation requirements of flexible and stretchable electronic devices, which must endure rapid bending, twisting, and stretching. To address this challenge, there is a demand for the development of TIM that simultaneously possesses high thermal conductivity and stretchability. This paper examines the research trends of liquid metal, carbon, and ceramic-based stretchable thermal interface materials and explores effective strategies for enhancing their thermal and mechanical properties.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.35-42
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• 2024

Recently, with the miniaturization and high integration of semiconductor chips, the bump bridge phenomenon caused by fine pitches is drawing attention as a problem. Accordingly, Cu pillar bump, which can minimize the bump bridge phenomenon, is widely applied in the semiconductor package industry for fine pitch applications. When exposed to a high-temperature environment, the thickness of the intermetallic compound (IMC) formed at the joint interface increases, and at the same time, Kirkendall void is formed and grown inside some IMC/Cu and IMC interfaces. Therefore, it is important to control the excessive growth of IMC and the formation and growth of Kirkendall voids because they weaken the mechanical reliability of the joints. Therefore, in this study, isothermal aging evaluation of Cu pillar bump joints with a CS (Cu+ Sn-1.8Ag Solder) structure was performed and the corresponding results was reported.