• Journal of Astronomy and Space Sciences
• /
• v.32 no.1
• /
• pp.73-80
• /
• 2015

The Yang-gyeong-gyu-il-ui (兩景揆日儀) is a kind of elevation sundial using three wooden plates. Sang-hyeok Lee (李尙爀, 1810~?) and Byeong-cheol Nam (南秉哲, 1817~1863) gave descriptions of this sundial and explained how to use it in their Gyu-il-go (揆日考) and Ui-gi-jip-seol (儀器輯說), respectively. According to Gyu-il-go (揆日考) there are two horizontal plates and two vertical plates that have lines of season and time. Subseasonal (節候) lines are engraved between seasonal (節氣) lines, subdividing the interval into three equal lines of Cho-hu (初候, early subseason), Jung-hu (中候, mid subseason) and Mal-hu (末候, late subseason); there are 13 seasonal lines for a year, thus resulting in 37 subseasonal lines; also, there are 12 double-hour (時辰) lines for a day engraved on these plates. The only remaining artifact of Yang-gyeong-gyu-il-ui was made in 1849 (the $15^{th}$ year of Heon-jong) and is kept at the Korea University Museum. We have compared and analyzed Yang-gyeong-gyu-il-ui and similar western sundials. Also, we have reviewed the scientific aspect of this artifact and built a replica. Yang-gyeong-gyu-il-ui is a new model enhanced from the miniaturization development in the early Joseon Dynasty and can be applied to the southern part of the tropic line through a structure change.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.12 no.12
• /
• pp.5412-5419
• /
• 2011

The need is growing for high-speed spindle because various equipment are becoming more precise, miniaturization and high speed with the development of industries. Air-lubricated dynamic bearings are widely used in the optical lithographic manufacturing of wafers to realize nearly zero friction for the motion of the stage. Air-lubricated dynamic bearing can be used in high-speed, high-precision spindle system and hard disk drive(HDD) because of its advantages such as low frictional loss, low heat generation, averaging effect leading better running accuracy. In the paper, numerical analysis is undertaken to calculate the performance of air-lubricated dynamic bearing with herringbone groove. The static performances of herringbone groove bearings which can be used to support the thrust load are calculated. Electrochemical micro machining($EC{\mu}M$) which is non-contact ultra precision machining method has been developed to fabricate the air-lubricated dynamic bearing and optimum parameters which are inter electrode gap size, concentration of electrolyte, machining time are simulated using numerical analysis program.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.19 no.11
• /
• pp.2656-2664
• /
• 2015

IoT management hub has to request the WLAN AP list of the accessible areas in a place that is installed, or choose a specific WLAN AP you want to connect in order to be connected to the Internet. the specific method also is required to input the password when the security key was set. As that way, IoT management hub needs both the display device and the input device to see the list of WLAN AP and to input the security key. If the IoT management hub is consist of them, It is difficult to achieve the objective of the miniaturization and cost reduction. In this paper, we propose a method to connect to a WLAN AP network using a smart-phone without the display device and the input device.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.16 no.6
• /
• pp.3692-3697
• /
• 2015

A screw is a type of fastener characterized by a helical ridge known as thread. The demands for screws with the miniaturization and weight reduction are increasing for the trend of small size of mobile devices. The successful designs of mold and process are very important to obtain screws with good mechanical properties and high precision. In this study, the design of cold forging process of micro screw was carried out by using finite element method. In particular, in order to investigate the effects of die geometries and friction, design of experiment method was adopted and it was revealed that the friction was the dominant factor of folding defects. From these results, the design of die was modified and experiments were carried out with the modified die. From the experimental results, it was found that the folding defects disappeared.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.242-242
• /
• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

• Korean Journal of Materials Research
• /
• v.22 no.7
• /
• pp.335-341
• /
• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.10a
• /
• pp.763-768
• /
• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF In bonding process, the bonding forte and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding test was performed fur two types of flip-chips with different chip size and lead pitch. The bonding temperatures are chosen between $25^{\circ}C\;to\;300^{\circ}C$. The bonding forces are chosen between 5N and 300N. The bonding strength is checked using bonding force tester. After the bonding force test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.9 no.3
• /
• pp.621-627
• /
• 2008

This paper presents a compact and miniaturized power detector utilizing low temperature co-fired ceramics(LTCC) technology for the application in wireless handset system to monitor the transmitting power at the frequency of 824-849MHz. The proposed power detector is composed of detector diode, lumped components for matching network, and LTCC stripline coupler based on LTCC substrate technology. A 20dB LTCC stripline direction coupler is designed and implemented with many bending section in order to reduce the practically occupied area for miniaturization. A zero bias schottky diode is adopted for detector design because of its high speed operation with minimized loss. The measured performances of fabricated detector agree well with the predicted results with a good linearity within the effective input RF power range.

• Journal of KIISE:Databases
• /
• v.33 no.1
• /
• pp.1-11
• /
• 2006

It is possible to track the moving vehicle as well as to develop the location based services actively according to the progress of wireless telecommunication and GPS, to the spread of network, and to the miniaturization of cellular phone. To provide these location based services, it is necessary for an index technique to store and search too much moving object data rapidly. However the existing indices require a lot of costs to insert the data because they store every position data into the index directly. To solve this problem in this paper, we propose a buffer node operation and design a GU-tree(Group Update tree). The proposed buffer node method reduces the input cost effectively since the operation stores the moving object location data in a group, the buffer node as the unit of a non-leaf node. hnd then we confirm the effect of the buffer node operation which reduces the insert cost and increase the search performance in a time slice query from the experiment to compare the operation with some existing indices. The proposed tufter node operation would be useful in the environment to update locations frequently such as a transportation vehicle management and a tour-guide system.

• Journal of the Korean Institute of Intelligent Systems
• /
• v.15 no.5
• /
• pp.567-572
• /
• 2005

Recently, owing to miniaturization of computer and popularization of internet, ubiquitous computing is attracting considerable attention. In ubiquitous environment, user can receive desired information service anywhere, any time. With the advent of ubiquitous age through popularization of internet, it becomes important how to provide user with ubiquitous environment, and what and how to provide to user. In this paper, method to automatically select device most suitable for user in ubiquitous environment is offered. search agents search peripherals, make a list by function, and transmit to serve. Serve learn the transmitted information through intelligent system. If user input information in the form of linguistic according to the list, serve select device suitable for work environment, and compose the system through IP address. This was realize through practical example, experimented and confirmed.