• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.1
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• pp.143-152
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• 2001

A method for miniaturization of microstrip patch antenna without degrading its radiation characteristics is investigated in this paper. It involves perforating the patch to form a microstrip square-ring antenna, and it's BW enhancement is investigated numerically and experimentally. A ring geometry introduces additional parameters to the antenna, and those are used to control impedances, resonance frequencies, and bandwidths. For a single square ring antenna, an increase of the size of perforation increases its input impedance, decreases the resonance frequency, and bandwidths. But it affects little on directivity of the antenna. To match the antenna to a transmission line and also enhance its bandwidth, the ring is stacked by a square patch or another square ring. Also numerically simulated results by the IE3D, and experimental data are compared for proof.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.5 s.120
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• pp.503-510
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• 2007

This paper proposes the design scheme of internal triple band antenna intended for using in GSM900, DCS1800, and PCS1900 bands. The suggested folding metal plates of the two branches are mounted on a dielectric coated ground plane for size miniaturization and durability. Return losses are overlapped when length of metal branches are controlled. This is important technique for wide band operation. For the suggested antenna geometry its return loss was calculated by HFSS 9 simulator, and was shown to be -10 [dB] less within the required band. Also, gain and radiation pattern of antenna were measured using far field measurement system in an anechoic chamber. The measured peak gain is more than 3.0 [dBi], and the average gain is over -1.0 [dBi] for the triple band, which is regarded as satisfactory for the internal antenna application. Also, the radiation pattern for two frequencies shows a similar shape each other within the required band.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.7
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• pp.768-773
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• 2012

A branch-line hybrid using microstrip artificial transmission lines(ATLs) with slotted-triangular patches is proposed. The proposed artificial transmission line is compact in structure as well as easy to adjust the characteristic impedance and electrical length of equivalent transmission line by changing the slot's parameters; hence, it is useful for miniaturizing conventional transmission lines. The designed branch-line hybrid, because of the use of the right angled isosceles triangular shaped artificial transmission lines as building blocks, has no useless empty space, and hence optimally miniaturized. A fabricated 3 dB branch-line hybrid shows the coupling variation of ${\pm}0.5$ dB and the phase difference between two output ports of $91^{\circ}{\pm}4^{\circ}$ within 15 % bandwidth at 2.45 GHz center frequency. The size of proposed branch-line hybrid is only 38% of the conventional branch-line hybrid.

• The Journal of the Korea institute of electronic communication sciences
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• v.13 no.5
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• pp.1093-1100
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• 2018

Fast progress in miniaturization and reducing power consumption of semiconductors for wearable devices makes it possible to develop extremely small wearable systems for various application services. This results recent wearable applications to be powered from extremely low-power energy harvesters based on solar, piezo, and TENG sources. In most cases, the harvesters generate power in non-linear manner. Therefore, we implemented and experimented the device platforms to utilize natural frequency of around 3Hz. We also designed two-stage power storages and high efficiency conversion platform to consider such non-linear power harvesting sources. The experiment showed power generation of about 4.67mW/min from these non-linear sources with provision of stable energy storages.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• Journal of Electrical Engineering and Technology
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• v.13 no.5
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• pp.2045-2049
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• 2018

An antenna arrays for a satellite navigation systems require more antenna elements to mitigate multiple jamming signals. In order to maintain the small array size while increasing the number of antenna elements, miniaturization technique is essential for antenna design. In this work, an electrically small circular microstrip patch antenna with a 3 dB hybrid coupler is designed as an element antenna, where the 3 dB hybrid coupler can yield the circularly polarized radiation characteristic. The miniaturized element antenna typically has too large capacitance in GPS L1 and GLONASS G1 bands, making it difficult to match with a single stand-alone non-Foster matching circuit (NFMC) in a stable state. Therefore, we propose a new matching technique, referred to as the hybrid matching method, which consists of a NFMC and a passive circuit. This passive tuning circuit manages reactance of antenna elements at an appropriate capacitance without a pole in the operating frequency range. The antenna array is fabricated, and the measured results show a reflection coefficient of less than -10 dB and an isolation of greater than 50 dB. In addition, peak gain of the proposed antenna is increased by 22.3 dB compared to the antenna without the hybrid matching network.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2005.10a
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• pp.283-288
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• 2005

Application of semiconductor sensors has widely spreaded into various industries because those have several merits like easy miniaturization and batch production comparison with previous mechanical sensors. But external conditions such as thermal and repetitive load have a bad effect on sensors's lifetime. Especially, this paper was focused on fatigue life of a interconnect made by various materials. Firstly we implemented the stress analysis for interconnect under thermal load and wording pressure. And the fatigue lifetime of each material was induced by Manson & Coffin Equation using the plastic stress-strain curve obtained by the plastic-elastic Finite Element Analysis.

• The Transactions of the Korean Institute of Power Electronics
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• v.8 no.6
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• pp.504-511
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• 2003

In this paper, inverter type neon power supply using a piezoelectric transformer is fabricated and its characteristic is investigated. Developed neon power supply is composed of basic circuit and blocks, such as rectifier part, frequency oscillation part and piezoelectric transformer and resonant half bridge inverters. In this paper for complement the low power limitation, piezoelectric transformer at parallel connected driving by inverter is studied for noon tubes system of high power. When piezoelectric transformer is connected with parallel, LC filter connection method with parallel and selection of inductance L and capacitor C of primary side is suggested for reduce unbalanced current at the terminal of each transformer. Piezoelectric transformers use piezoelectric ceramic devices. Thus it is wireless therefore it has high power density, high Isolation level, low loss, more light, and miniaturization. In addition, high voltage transfer ratio is expected because there is no leakage inductance. Also, it has economic merit that the electrical loss Is low because structure is simple, small and tighter weight.

• Journal of Power Electronics
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• v.7 no.3
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• pp.181-190
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• 2007

This paper presents a novel circuit topology of a DC bus line series switch and parallel snubbing capacitor-assisted soft-switching PWM full-bridge inverter type DC-DC power converter with a high frequency planar transformer link, which is newly developed for high performance arc welding machines in industry. The proposed DC-DC power converter circuit is based upon a voltage source-fed H type full-bridge soft-switching PWM inverter with a high frequency transformer. This DC-DC power converter has a single power semiconductor switching device in series with an input DC low side rail and loss less snubbing capacitor in parallel with the inverter bridge legs. All the active power switches in the full-bridge arms and DC bus line can achieve ZCS turn-on and ZVS turn-off transition commutation. Consequently, the total switching power losses occurred at turn-off switching transition of these power semiconductor devices; IGBTs can be reduced even in higher switching frequency bands ranging from 20 kHz to 100 kHz. The switching frequency of this DC-DC power converter using IGBT power modules can be realized at 60 kHz. It is proved experimentally by power loss analysis that the more the switching frequency increases, the more the proposed DC-DC power converter can achieve a higher control response performance and size miniaturization. The practical and inherent effectiveness of the new DC-DC converter topology proposed here is actually confirmed for low voltage and large current DC-DC power supplies (32V, 300A) for TIG arc welding applications in industry.

• Proceedings of the KOSOMBE Conference
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• v.1996 no.11
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• pp.273-276
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• 1996

In the Total Artificial Heart (TAH) and Ventricular Assist Device (VAD), the size implanting the internal controller into human body is very serious problem. Hence, we need the size reduction of that controller for safe implantation. Using PSD302 chip for microcontroller-based applications, we could decrease the number of components in the digital control board and miniaturize the digital control board. We could replace a ROM, RAM, and a latch with that single chip, so the size of the newly developed board could be half the previous board.