• Proceedings of the Korean Operations and Management Science Society Conference
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• 2000.10a
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• pp.141-147
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• 2000

For miniaturization of electronic parts and higher productivity, part arrangement job of PCB(printed Circuit Board) has been replaced with complete automated facilities, and contribution which is concerned about this will be expanded continuously. Such part arrangement job of PCB could have lots of influences to entire productivity In this paper, effective grouping method of parts is suggested for the effective insertion path job of PCB concerning the constraints to the size of parts.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2014.04a
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• pp.392-393
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• 2014

Multilayer ceramic capacitors (MLCCs) have become one kind of the most widely used electrical components in recent decades. And the technology of MLCCs is developing continuously towards a direction of high capacitance and miniaturization. While the tiny thickness and the large quantity of the layers often make it very troublesome to do analysis with the full model MLCCs. In order to solve this problem, reduced model with fewer layers of MLCC was designed and verified in this paper.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2007.05a
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• pp.64-69
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• 2007

실내조명의 조도 기준을 만족하는 LED Bulb를 개발하기 위하여 LED 개수를 선정하고, 실내 전반 조명에 적합한 배광을 실현하기 위한 렌즈설계를 하였다. 그리고 LED로부터 발산되는 열을 최적화하기 위한 방열설계를 행하여 주위온도 $50^{circ}C$ 이내에서 동작 가능하도록 하였다. 또한 시제품의 외함에 내장되어 질 수 있는 소형의 20[W]급 전원회로를 설계하고, 시제품을 직접 제작하였다. 시제품의 전기적, 광학적 성능은 CFL의 성능과 거의 동일하다.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.141.3-141
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• 2001

Since 1990´s, there has been many researches for the development of the Unmanned Aerial Vehicle (UAV). Especially, for the development of digital electronics, the technologies of UAV toward to the miniaturization low-cost, and high reliability. Therefore, recent trends for the development of UAV are focused on the development modern Flight Control System (FCS). In this paper, focusing on the FCS, the development process for Sejong Unmanned Research Vehicle -1 (SURV-1) from design to flight test is presented.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2000.11a
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• pp.319-323
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• 2000

A method for miniaturization of microstrip patch antenna without degrading its radiation characteristics is investigated. The ring geometry introduces additional parameters to the antenna that can be used to control its resonance frequency and bandwidth. For a single square ring increasing the size of patch decreases the resonance frequency and bandwidth. To match the antenna to a transmission line and also enhance its bandwidth. the square ring patch is stacked by a square ring patch. The computed results are compared with experiment and good agreement is obtained.

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2005.11a
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• pp.63-64
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• 2005

This paper proposed a miniaturization passive element employing the multiple microstrip line. As a result of this method, we realized the transmission line miniaturized. The applying structure designed and evaluated a power divider on GaAS MMIC circuit. It draws a plan in a center Frequency as the observation could do good characteristic.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.279-282
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• 1999

Acceleration in integration density and speed performance of ULSI circuits require miniaturization of CMOS and interconnections as well as higher current density capabilities for transistors. A leading candidate to substitute A1-alloy is Cu, which has lower resistivity and higher melting point. So we can expect much higher electromigration resistance. In this paper, we are going to explain the major features of EM for MOCVD Cu according to variant conditions. We compared the life time and activation energy of MOCVD Cu with those of E-beam Cu and Al in The same conditions.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.491-492
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• 2009

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2005.06a
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• pp.401-405
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• 2005

This paper proposed a miniaturization passive element employing the multiple microstrip line. As a result of this method, we realized the transmission line miniaturized. The applying structure designed and evaluated a power divider on GaAS MMIC circuit. It draws a plan in a center Frequency as the observation could do good characteristic.

• Proceedings of the KIPE Conference
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• 1998.10a
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• pp.564-568
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• 1998

All elements and systems of electronics have optimum temperature conditions. A using of the thermoelectric method of cooling is the most approach for the thermal management of power electronics. An analysis of using the thermoelectric cooling and the temperature control is given as an efficient method of ensuring a work of power electronic devices in conditions of micro-miniaturization.