• Title/Summary/Keyword: microwave monolithic integrated circuit(MMIC)

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A 30GHz Band MMIC Low Noise Amplifier for Satellite Communications (위성통신용 30GHz대 MMIC 저잡음증폭기의 설계 및 제작)

  • Lim, Jong-Sik;Yom, In-Bok;Yoo, Young-Geun;Kang, Sung-Choon;Nam, Sang-Wook
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.36D no.9
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    • pp.13-20
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    • 1999
  • A 2-stage MMIC(monolithic Microwave Integrated Circuits) LNA(Low Noise Amplifiers) at 30GHz hand has been designed and fabricated for the Ka-band Satellite Communications. The $0.15 {\mu}m$ with the width of $80 {\mu}m$ pHEMT technology was used for the fabrication of this MMIC LNA. Using the series feedback technique, ultra low noise and excellent S11 could be obtained at the same time without the cost of gain at 30GHz-band. The stability factors(Ks) for each stage and overall stage are greater than 1 at full frequency bands by the bias circuits and stabilization circuit. The measured performances, which agree well with the predicted performances, show this 2-stage MMIC LNA has the gain of more than 15.7dB and noise figure of less than 2.09dB over 29GHz to 33GHz.

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Study on the Ku band Solid-State Power Amplifier(SSPA) through the 40 W-grade High Power MMIC Development and the Combination of High Power Modules (40 W급 고출력 MMIC 개발과 고출력 증폭기 모듈 결합을 통한 Ku 밴드 반도체형 송신기(SSPA) 개발에 관한 연구)

  • Kyoungil Na;Jaewoong Park;Youngwan Lee;Hyeok Kim;Hyunchul Kang;SoSu Kim
    • Journal of the Korea Institute of Military Science and Technology
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    • v.26 no.3
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    • pp.227-233
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    • 2023
  • In this paper, to substitute the existing TWTA(Travailing Wave Tube Amplifier) component in small radar system, we developed the Ku band SSPA(Solid-State Power Amplifier) based on the fabrication of power MMIC (Monolithic Microwave Integrated Circuit) chips. For the development of the 500 W SSPA, the 40 W-grade power MMIC was designed by ADS(Advanced Design System) at Keysight company with UMS GH015 library, and was processed by UMS foundry service. And 70 W main power modules were achieved the 2-way T-junction combiner method by using the 40 W-grade power MMICs. Finally, the 500 W SSPA was fabricated by the wave guide type power divider between the drive power amplifier and power modules, and power combiner with same type between power modules and output port. The electrical properties of this SSPA had 504 W output power, -58.11 dBc spurious, 1.74 °/us phase variation, and -143 dBm/Hz noise level.

Broadband Microwave SPDT Switch Using CPW Impedance Transform Network (CPW 임피던스 변환회로를 이용한 광대역 마이크로파 SPDT 스위치)

  • Lee Kang Ho;Park Hyung Moo;Rhee Jin Koo;Koo Kyung Heon
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.42 no.7 s.337
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    • pp.57-62
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    • 2005
  • This paper describes the design of a high performance microwave single pole double throw (SPDT) monolithic microwave integrated circuit switch using GaAs pHEMT process. The switch design proposes a novel coplanar waveguide (CPW) impedance transform network which results in the low insertion loss and high isolation by compensating for the FET parasitics to get the low on-resistance and low off-capacitance. The proposed switch has the measured isolation of better than 24 dB and insertion loss of less than 2.6 dB from 53 to 61 GHz. The chip is fabricated with the size of 2.2mm $\times$ 1.6 mm.

A Low Power GaAs MMIC Multi-Function Chip for an X-Band Active Phased Array Radar System (X-대역 능동 위상 배열 레이더시스템용 저전력 GaAs MMIC 다기능 칩)

  • Jeong, Jin-Cheol;Shin, Dong-Hwan;Ju, In-Kwon;Yom, In-Bok
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.25 no.5
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    • pp.504-514
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    • 2014
  • An MMIC multi-function chip with a low DC power consumption for an X-band active phased array radar system has been designed and fabricated using a 0.5 ${\mu}m$ GaAs p-HEMT commercial process. The multi-function chip provides several functions: 6-bit phase shifting, 6-bit attenuation, transmit/receive switching, and signal amplification. The fabricated multi-function chip with a compact size of $16mm^2(4mm{\times}4mm)$ exhibits a gain of 10 dB and a P1dB of 14 dBm from 7 GHz to 11 GHz with a DC low power consumption of only 0.6 W. The RMS(Root Mean Square) errors for the 64 states of the 6-bit phase shift and attenuation were measured to $3^{\circ}$ and 0.6 dB, respectively over the frequency.

A Low Loss and Short-wavelength Transmission Line Employing Inverted Periodically Arrayed Capacitive Devices and Its Application to Miniaturized Passive Components on MMIC (저손실·단파장 특성을 가지는 반전된 형태의 주기적 용량성 선로구조와 MMIC상의 초소형 수동소자 개발에의 응용)

  • Yun, Young
    • Journal of Advanced Marine Engineering and Technology
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    • v.36 no.1
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    • pp.149-156
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    • 2012
  • In this study, we propose a novel transmission line employing inverted PACD (Periodically Arrayed Capacitive Devices) for application to a development of miniaturized passive components on MMIC. The novel microstrip line employing Inverted PACD structure showed a loss much lower than conventional microstrip line. Using the inverted PACD structure, we fabricated a miniaturized impedance transformer on MMIC. the size of the impedance transformer was 0.012 $mm^2$, which is only 1.7% of conventional one. The impedance transformer showed good RF performances in a frequency range of 2.25~6.5 GHz.

Basic RF Characteristics of Fishbone-Type Transmission Line Employing Comb-Type Ground Plane (FTLCGP) on PES Substrate for Use in Flexible Passive Circuits

  • Yun, Young;Jeong, Jang-Hyeon;Kim, Hong Seung;Jang, Nakwon
    • ETRI Journal
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    • v.37 no.1
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    • pp.128-137
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    • 2015
  • In this work, a fishbone-type transmission line employing a comb-type ground plane (FTLCGP) was fabricated on polyethersulfone (PES) substrate, and its RF characteristics were thoroughly investigated. According to the results, it was found that the FTLCGP on PES showed periodic capacitance values much higher than other types of transmission lines due to a coupling capacitance between the signal line and ground, which resulted in a reduction of wavelength and line width. Using the theoretical analysis, we also extracted the bandwidth characteristic of the FTLCGP on PES. According to the result, the FTLCGP structure showed a cut-off frequency of 280 GHz.

Technical Trends of Next-Generation GaN Power Amplifier for High-frequency and High-power (차세대 GaN 고주파 고출력 전력증폭기 기술동향)

  • Lee, S.H.;Kim, S.I.;Min, B.G.;Lim, J.W.;Kwon, Y.H.;Nam, E.S.
    • Electronics and Telecommunications Trends
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    • v.29 no.6
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    • pp.1-13
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    • 2014
  • GaN(Gallium Nitride)는 3.4eV의 넓은 에너지 갭으로 인하여 고전압에서 동작이 가능하고, 분극전하를 이용한 캐리어 농도가 높아 높은 전류밀도와 전력밀도를 얻을 수 있으며, 높은 전자 이동도와 포화 속도로부터 고속 동작이 가능하여 고주파 고출력 고효율 소형의 전력증폭기 소자의 재료로 적합하다. 본고에서는 민수 및 군수 겸용 Ku-대역 및 Ka-대역 GaN 고출력 전력증폭기(SSPA: Solid-State Power Amplifier)와 관련된 GaN 전력증폭 소자, GaN 전력증폭기 MMIC(Microwave Monolithic Integrated Circuit), 내부정합 패키지형 GaN 전력증폭기 및 GaN SSPA에 대하여, 국내외 특허 기술동향과 연구개발 기술동향을 중심으로 고찰하고자 한다. 국외의 GaN 고주파 고출력 전력증폭기 기술의 연구동향이나 특허동향을 심층분석하여 연구개발에 활용하고자 한다.

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Design and Fabrication of 2 GHz Double Balanced Star Mixer Using a Novel Balun (새로운 발룬 회로를 이용한 2 GHz 대역 이중 평형 Star 혼합기의 설계 및 제작)

  • Kim, Sun-Sook
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • 2003.11a
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    • pp.630-637
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    • 2003
  • In this paper, a DBM(double balanced mixer) of 2 GHz is implemented on FR4(h=1.6mm, ${\epsilon}_r=4.6$) substrate. The structure of double balanced mixer requires, in general, two talons and a quad diode. For balun, a novel planar balun using microstrip to CPS(Coplanar Strip) is suggested and designed. The suggested balun shows the phase imbalance of $180^{\circ}{\pm}1.5^{\circ}$ and the amplitude imbalance of ${\pm}0.2 dB$ for 1.5 to 2.5 GHz. Using the balun, DBM is successfully implemented, and the measured conversion loss of up/down converter show about 6 dB over the bandwidth. The balun may be applicable for MMIC(Monolithic Microwave Integrated Circuit) DBM with the process supporting backside via though more study.

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Properties of YIG Thick Films Prepared by Screen-Printing (스크린 프린트법에 의해 제조된 YIG계 후막의 특성)

  • 이태경;남중희;오재희;이재춘;최승철
    • Journal of the Korean Ceramic Society
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    • v.37 no.10
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    • pp.1001-1007
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    • 2000
  • 스크린 프린트법으로 MMIC(Monolithic Microwave Integrated Circuit)용 YIG 후막을 제조하였고, YIG의 조성과 프린트 조건의 변화가 다결정 $Y_{3-x}$C $a_{x}$ F $e_{5-x}$Z $r_{x}$ $O_{12}$ (x=0~0.3) 후막의 미세구조 및 자기적 특성에 미치는 영향을 고찰하였다. $Ca^{2+}$와 Z $r^{4+}$ 의 치환 첨가량이 0.2인 $Y_{2.8}$ C $a_{0.2}$F $e_{4.8}$ Z $r_{0.2}$ $O_{12}$ 조성의 paste로 제조된 YIG 후막의 경우, 포화 자화값이 최대를 나타내었으며, 강자성 공명 흡수선 폭은 최소를 나타내었다. 또한, YIG 후막의 두께 및 소결 유지시간 등의 제조조건을 제어함에 따라 치밀화 및 자기 특성이 향상됨을 확인할 수 있었다.다.다.

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Adaptive Calibration Method in Multiport Amplifier for K-Band Payload Applications

  • Moon, Seong-Mo;Shin, Dong-Hwan;Lee, Hong-Yul;Uhm, Man-Seok;Yom, In-Bok;Lee, Moon-Que
    • ETRI Journal
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    • v.35 no.4
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    • pp.718-721
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    • 2013
  • This letter proposes a novel calibration method for a multiport amplifier (MPA) to achieve optimum port-to-port isolation by correcting both the amplitude and phase of the calibration signals. The proposed architecture allows for the detection of the phase error and amplitude error in each RF signal path simultaneously and can enhance the calibrated resolution by controlling the analog phase shifters and attenuators. The designed $2{\times}2$ and $4{\times}4$ MPAs show isolation characteristics of 30 dB and 27 dB over a frequency range of 19.5 GHz to 22.5 GHz, respectively.