• Title/Summary/Keyword: microstructural stability

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Phase stability and Sintered Properties of 1.5mol% Yttria-stabilized Zirconia Ceramics Fabricated by Low Temperature Sintering (저온 열처리로 제작된 1.5 mol% 이트리아 안정화 지르코니아 세라믹스의 상 안정성 및 소결물성)

  • Kyung Tae Kim;Han Cheol Choe;Jeong Sik Park;Jong Kook Lee
    • Journal of the Korean Society for Heat Treatment
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    • v.37 no.1
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    • pp.1-8
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    • 2024
  • Phase stability of tetragonal crystals in yttria-stabilized zirconia ceramics is dependent on the content of yttria and the heat-treatment condition, related with mechanical properties. In this study, we fabricated the 1.5 mol% yttria-stabilized zirconia (1.5Y-YSZ) ceramics by cold isostatic pressing (CIP) and post-sintering at temperature range of 1200 to 1350℃ for 2 hours and investigated the sintered properties and microstructural evolution. Sintered and microstructural parameters, i.e, apparent density, grain size and phase composition of 1.5Y-YSZ ceramics were mainly dependent on the sintering temperature. Maximum sintered density of 99.4 % and average grain size of 200-300 nm could be obtained from the heat-treatment condition above sintering temperature at 1300℃ for 2 hours, possessing the superior mechanical hardness with 1200 Hv. However, phase stability of tetragonal grains in 1.5 YSZ ceramics is very low, inducing the phase transformation to monoclinic crystals on specimen surface during cooling after heat-treatment.

Effect of Annealing on Microstructural and Mechanical Property Variation of the Oxide-Dispersion-Strengthened Cu alloy (산화물 분산강화 동합금의 열처리에 따른 미세조직 및 기계적 특성 변화)

  • Kim Yong-Suk
    • Journal of Powder Materials
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    • v.13 no.1 s.54
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    • pp.25-32
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    • 2006
  • The alumina dispersion-strengthened (DS) C15715 Cu alloy fabricated by a powder metallurgy route was annealed at temperatures ranging from $800^{\circ}C\;to\;1000^{\circ}C$ in the air and in vacuum. The effect of the annealing on microstructural stability and room-temperature mechanical properties of the alloy was investigated. The microstructure of the cold rolled OS alloy remained stable until the annealing at $900^{\circ}C$ in the air and in vacuum. No recrystallization of original grains occurred, but the dislocation density decreased and newly formed subgrains were observed. The alloy annealed at $1000^{\circ}C$ in the air experienced recrystallization and grain growth took place, however annealing in vacuum at $1000^{\circ}C$ did not cause the microstructural change. The mechanical property of the alloy was changed slightly with the annealing if the microstructure remained stable. However, the strength of the specimen that was recrystallized decreased drastically.

A Study on Thermal Stability of Unidirectionally Solidified $Al-CuAl_2$ Eutectic Composite (일방향응고시킨 $Al-CuAl_2$공정복합재료의 열적안정성에 관한 연구)

  • Hong, Young-Hwan;Hong, Jong-Hwi
    • Journal of Korea Foundry Society
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    • v.10 no.5
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    • pp.399-407
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    • 1990
  • The effect of thermal cycling and isothermal exposure on the high temperature microstructural stability of unidirectionally solidified $Al-CuAl_2$ eutectic composite has been studied. A coarsening procedures of lamellar eutectic structures were initiated at growth fault region because of diffusion through low angle boundary at this region. It was considered that thermally induced residual stresses produced by thermal cycling were high enough to increase the dislocation density in Al-rich matrix phase. However, it was also considered that dislocations generated by these high thermal stresses were annihilated at high temperature by stress relaxation. Consequently, the thermal cycling up to 1440 cycles between 20 and $520^{\circ}C$ did not affect the microstructural stability.

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Change in Microstructural Stability of AZ31 Alloy By the Addition of CaO (CaO 첨가에 의한 AZ31 합금 미세조직의 열적 안정성 변화)

  • Jun, Joong-Hwan
    • Journal of the Korean Society for Heat Treatment
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    • v.26 no.3
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    • pp.113-119
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    • 2013
  • Grain growth behaviors of hot-rolled AZ31 (Mg-3%Al-1%Zn) and AZ31-0.3%CaO alloys at elevated temperatures have been investigated in order to clarify the effect of CaO addition on grain stability of Mg-Al-based wrought alloy. The grain size of CaO-free alloy increased steeply from 673 K with an increase in annealing temperature from 573 to 773 K, whereas the grains of CaO-containing alloy were relatively stable up to 723 K. The activation energies for grain growth ($E_g$) were 12.2 and 18.3 kJ/mole between 573 and 673 K and 119.2 and 126.9 kJ/mole between 673 and 773 K in the AZ31 and AZ31-0.3%CaO alloys, respectively. This result indicates that grains in the CaO-added alloy possess higher thermal stability than CaO-free alloy. SEM observations on the annealed alloy samples revealed that higher grain stability resulting from CaO addition would be associated with the suppression of grain growth by Ca-related precipitate particles distributed in the microstructure.

Microstructural and Piezoelectric Characteristics of PSN-PMN-PZT Ceramics Produced by Attrition Milling

  • Juhyun Yoo;Sukkyu Min;Jaeil Hong;Sungjae Suh;R, Soonchul-U
    • Transactions on Electrical and Electronic Materials
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    • v.2 no.3
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    • pp.18-23
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    • 2001
  • For the piezoelectric transformer application, Pb(Sb$\_$1/2/ Nb$\_$1/2/)O$_3$-Pb(Zr,Ti)O$_3$ ceramics were produced by attrition milling. Microstructural, dielectric and piezoelectric characteristics of the ceramics were investigated as a function of milling time. The particle size and grain size decreased while dielectric constant, density and mechanical quality factor (Q$\_$m/) increased with milling time. Temperature coefficient of resonant frequency (TCf$\_$r/) was shifted to positive side with increasing milling time. The attrition milling process proved to be one of the effective routes to produce transformers for high power application.

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Structure and Properties of Rapidly-Solidified Al-Pb Monotectic Alloys.;I. Characteristics of Rapidly-Solidified Microstructure (급속 응고한 Al-Pb 편정 합금의 조직과 성질;I. 급속 응고 조직 특성)

  • Kim, Myung-Ho;Bae, Cha-Hurn;Lee, Ho-In
    • Journal of Korea Foundry Society
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    • v.9 no.1
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    • pp.73-79
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    • 1989
  • Microstructural characteristics of Al-3.63wt.%Pb hyper-monotectic alloy rapidly-solidified by melt spinning were examined. Possibility of forming a planar liquid -solid interface during rapid solidification of this alloy was also considered with a morphological stability theory, and a mechanism of forming banded structure observed at the bottom parts of melt-spinned specimens was considered as well. Application of the absolute stability criterion predicts the liquid-solid interface of the primary aluminium phase to be able to maintain a planar interface during the early stage of rapid solidification. Formation of banded structure was supposed to be resulted from the release of latent heat during solidification, which affect the stability of a planar liquid-solid interface.

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Thermal Stability of 2.5Y-TZP under Low-Temperature Aging (2.5Y-TZP의 안정성에 관한 연구)

  • 장성도;오경영
    • Journal of the Korean Ceramic Society
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    • v.27 no.2
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    • pp.226-232
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    • 1990
  • The degradation phenomena and thermal stability of 2.5Y-TZP at low-temperature were studied by means of XRD, Raman spectra and microstructural analysis. The degradation of heat-treated 2.5Y-TZP at 20$0^{\circ}C$-20hr in air was observed on the TZP surface, be caused by the cracks generated from tlongrightarrowm transformation, and the cracks was propagated inside the polycrystalline body. The ZrO2 grain boundaries and grains near the crack were revealed as if these were diffused and dissolved. And it was also observed mlongrightarrowt transformation as the degraded TZP was refired at 140$0^{\circ}C$, and it was thought to be the fact that the moisture in atmosphere during the aging process contributed to the degradation. The thermal stability of 2.5Y-TZP was improved dramatically with an addition of 3w/o CeO2 or a provision of high Y2O3 concentration on the TZP surface.

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The relationship between dental implant stability and trabecular bone structure using cone-beam computed tomography

  • Kang, Se-Ryong;Bok, Sung-Chul;Choi, Soon-Chul;Lee, Sam-Sun;Heo, Min-Suk;Huh, Kyung-Hoe;Kim, Tae-Il;Yi, Won-Jin
    • Journal of Periodontal and Implant Science
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    • v.46 no.2
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    • pp.116-127
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    • 2016
  • Purpose: The objective of this study was to investigate the relationships between primary implant stability as measured by impact response frequency and the structural parameters of trabecular bone using cone-beam computed tomography(CBCT), excluding the effect of cortical bone thickness. Methods: We measured the impact response of a dental implant placed into swine bone specimens composed of only trabecular bone without the cortical bone layer using an inductive sensor. The peak frequency of the impact response spectrum was determined as an implant stability criterion (SPF). The 3D microstructural parameters were calculated from CT images of the bone specimens obtained using both micro-CT and CBCT. Results: SPF had significant positive correlations with trabecular bone structural parameters (BV/TV, BV, BS, BSD, Tb.Th, Tb.N, FD, and BS/BV) (P<0.01) while SPF demonstrated significant negative correlations with other microstructural parameters (Tb.Sp, Tb.Pf, and SMI) using micro-CT and CBCT (P<0.01). Conclusions: There was an increase in implant stability prediction by combining BV/TV and SMI in the stepwise forward regression analysis. Bone with high volume density and low surface density shows high implant stability. Well-connected thick bone with small marrow spaces also shows high implant stability. The combination of bone density and architectural parameters measured using CBCT can predict the implant stability more accurately than the density alone in clinical diagnoses.

Thermal Stability of the Interface between TaN Deposited by MOCVD and Electroless-plated Cu Film (MOCVD 방법으로 증착된 TaN와 무전해도금된 Cu박막 계면의 열적 안정성 연구)

  • 이은주;황응림;오재응;김정식
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.12
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    • pp.1091-1098
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    • 1998
  • Thermal stability of the electroless deposited Cu thin film was investigated. Cu/TaN/Si multilayer was fabricated by electroless-depositing Cu thin layer on TaN diffusion barrier layer which was deposited by MOCVD on the Si substrate, and was annealed in $H_2$ ambient to investigate the microstructure of Cu film with a post heat-treatment. Cu thin film with good adhesion was successfully deposited on the surface of the TaN film by electroless deposition with a proper activation treatment and solution control. Microstructural property of the electroless-deposited Cu layer was improved by a post-annealing in the reduced atmosphere of $H_2$ gas up to $600^{\circ}C$. Thermal stability of Cu/TaN/Si system was maintained up to $600^{\circ}C$ annealing temperature, but the intermediate compounds of Cu-Si were formed above $650^{\circ}C$ because Cu element passed through the TaN layer. On the other hand, thermal stability of the Cu/TaN/Si system in Ar ambient was maintained below $550^{\circ}C$ annealing temperature due to the minimal impurity of $O_2$ in Ar gas.

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