• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.06a
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• pp.82-88
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• 2006

• Journal of Welding and Joining
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• v.24 no.1
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• pp.26-32
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• 2006

• Journal of the Korean Society for Precision Engineering
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• v.20 no.3
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• pp.23-28
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• 2003

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.12
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• pp.7-11
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• 2007

In this paper, we proposed the dual-mode stepped impedance ring resonator bandpass filter for MMIC (Microwave Monolithic Integrated Circuit) applications using the dielectric-supported air-gapped microstrip line (DAML). The ring resonator fabricated by surface micromachining technology. This filter consists of a DAML resonator layer and a CPW feed line. The DAML ring resonator is elevated with $10{\mu}m$ height from GaAs substrate surface. This bandpass filter is $1-{\lambda}g$ type stepped impedance ring resonator including dual-mode resonance. From the measurements, we obtained attenuation of over 15 dB and insertion loss of 2.65 dB at the center frequency of 97 GHz. Relative bandwidth is about 12 % at 97 GHz. Furthermore, the proposed bandpass filter is useful to integrate with conventional MMICs.

• Journal of Sensor Science and Technology
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• v.9 no.3
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• pp.233-241
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• 2000

This paper presents comparative results of various commonly used anti-stiction methods for polysilicon surface micromachining using identical test structures. Four different types of cantilevers - single cantilevers, cantilevers with dimples, cantilevers with anti-stiction tip, cantilevers with plate - with different widths and lengths were employed as test structures. The detachment length of cantilevers was examined depending on the anti-stiction methods and test structure types. After sacrificial layer was removed, evaporation and sublimation drying methods were used in the drying step when takes place the stiction between structure and substrate. Various final rinsing liquids such as methanol, IPA, and DI water were employed to compare anti-stiction results depending on surface tension and rinsing temperature. For sublimation drying method, methanol was used as an intermediate rinsing liquid. Also, the influence of a stress gradient of the polysilicon was investigated by performing the identical anti-stiction experiments on identical test structures with a stress gradient. In conclusion, sublimation drying method showed superior results to various evaporation drying methods and hence it is considered the best method for releasing polysilicon microstructure in polysilicon surface micromachining.

• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2518-2520
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• 1998

Silicon can be reactive ion etched (RIE) either isotropically or anisotropically. In this paper, a new micromachining technology combining these two etching characteristics is proposed. In the proposed method, the fabrication steps are as follows. First. a polysilicon layer, which is used as the bottom electrode, is deposited on the silicon wafer and patterned. Then the silicon substrate is etched anisotropically to a few micrometer depth that forms a cavity. Then an PECVD oxide layer is deposited to passivate the cavity side walls. The oxide layers at the top and bottom faces are removed while the passivation layers of the side walls are left. Then the substrate is etched again but in an isotropic etch condition to form a round trench with a larger radius than the anisotropic cavity. Then a sacrificial PECVD oxide layer is deposited and patterned. Then a polysilicon structural layer is deposited and patterned. This polysilicon layer forms a pivot structure of a rocker-arm. Finally, oxide sacrificial layers are etched away. This new micromachining technology is quite simpler than conventional method to fabricate joint structures, and the devices that are fabricated using this technology do not require a flexing structure for motion.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.8
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• pp.543-548
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• 2003

In this paper, we have proposed and fabricated a two-axis rotational micro-mirror with large tilt angle. Such a micro-mirror is a key element for N$\times$N high capacity optical cross-connect switches. The micro-mirror is required to have large tilt angle to increase the capacity of the cross-connect switches. For larger micro-mirror tilt angle between the grounded mirror plate and the bottom electrode is to be large enough to provide space for the tilting of the mirror. For our proposed structure, the gap was produced in such a way that the grounded mirror plate and the bottom electrode were made separately in different substrates by using the bulk micromachining technology, and combined later by employing self-align technique. As a result, a large tilt angle has been achieved without using additional actuators. The measured tilt angles were as large as $\pm$5.5$^{\circ}$ and $\pm$8.4$^{\circ}$ in the x and y direction respectively, and the pull-in voltages for the two directions were 380 V and 275 V respectively. Finally the fabricated mirror was successfully utilized to steer the optical beam. To our knowledge, our micro-mirror has the best performance among the micro-mirrors reported internationally so far.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.8
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• pp.37-44
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• 2004

This paper describes a new GaAs-based surface-micromachined microstrip line supported by dielectric post and air-gapped signal line with ground metal. This new type of dielectric-supported air-gapped microstripline(DAML) structure is developed using surface micromachining techniques to provide easy means of airbridge connection between the signal lines and to archive low losses at millimeter-wave frequency band with wide impedance range. Each DAMLs with the length of 5 mm are fabricated and the measured characteristics are compared with those of the conventional microstrip transmission line. These transmission lines are composed of 10 ${\mu}{\textrm}{m}$ height of signal line, post size of 10 ${\mu}{\textrm}{m}$ ${\times}$ 10 ${\mu}{\textrm}{m}$ and post height of 9 ${\mu}{\textrm}{m}$. By elevating the signal lines from the substrate using the micromachining technology, the substrate dielectric loss can be reduced Compared with of the conventional microstrip transmission line showing 7.5 dB/cm loss at 50 GHz, the loss can be reduced to 1.1 dB/cm loss at 50 GHz.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.571-572
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.139-140
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• 2012