Technologies Toward Ultra Thin Embedded System in Package

• Wakabayashi Shin-ichi
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2005.09a
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  • pp.173-199
  • /
  • 2005
• PDF

Wafer Level Package Technology Applied to System Packaging

• Wakabayashi Takeshi
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2005.09a
  • /
  • pp.213-230
  • /
  • 2005
• PDF

Novel Packaging Technologies for System in Package Devices

• Denda Sei-ichi
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2005.09a
  • /
  • pp.1-22
  • /
  • 2005
• PDF

Development of 3D-SiP Including Components in SiP Consortium

• Fujitsu Takao
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2005.09a
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  • pp.35-49
  • /
  • 2005
• PDF

Lead-free Solders on the Electronics (전자부품에서의 무연솔더)

• 김미진;김문일;신규식;정재필
• • Journal of the Microelectronics and Packaging Society
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  • v.7 no.4
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  • pp.49-56
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  • 2000
• PDF

A Wafer Level CSP Technology, Wafer Process Packaging-WPP

• Miyamoto, Toshio
• • Proceedings of the International Microelectronics And Packaging Society Conference
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  • 2000.10a
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  • pp.177-193
  • /
  • 2000
• PDF

Au-Au Flip Chip Mounting Technology by NEC

• Hino, Shigekazu
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2000.10a
  • /
  • pp.105-129
  • /
  • 2000
• PDF

Wire Bonding Technology for Recent Trend Packaging

• Chung, J.Y.
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2000.10a
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  • pp.47-75
  • /
  • 2000
• PDF

Recent Trend in Japanese Packaging Technology

• Denda, Sei-ichi
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2000.10a
  • /
  • pp.1-6
  • /
  • 2000
• PDF

국내외 HIC 개발제품 및 기술현황 조사

• 신원석
• • Journal of the Microelectronics and Packaging Society
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  • v.1 no.1
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  • pp.9-24
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  • 1994

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