• Title/Summary/Keyword: microelectromechanical systems

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Development of a Novel Noncontact ECG Electrode by MEMS Fabrication Process

  • Mathias, Dakurah Naangmenkpeong;Park, Jaesoon;Kim, Eungbo;Joung, Yeun-Ho
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.3
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    • pp.150-154
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    • 2016
  • Contact electrodes pose threats like inflammation, metal poisoning, and allergic reaction to the user during long term ECG procedure. Therefore, we present a novel noncontact electrocardiographic electrode designed through microelectromechanical systems (MEMS) process. The proposed ECG electrode consists of small inner and large outer circular copper plates separated by thin insulator. The inner plate enables capacitive transduction of bio-potential variations on a subject’s chest into a voltage that can be processed by a signal processing board, whereas the outer plate shields the inner plate from environmental electromagnetic noise. The electrode lead wires are also coaxially designed to prevent cables from coupling to ground or electronic devices. A prototype ECG electrode has an area of about 2.324 cm2, is very flexible and does not require power to operate. The prototype ECG electrode could measure ECG at about 500 um distance from the subject’s chest.

Fabrication SiCN micro structures for extreme high temperature systems (초고온 시스템용 SiCN 마이크로 구조물 제작)

  • Thach, Phan Dui;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.216-216
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    • 2009
  • This paper describes a novel processing technique for the fabrication of polymer-derived SiCN (silicone carbonitride) microstructures for extreme microelectromechanical system (MEMS) applications. A polydimethylsiloxane (PDMS) mold was formed on an SU-8 pattern using a standard UV photolithographic process. Next, the liquid precursor, polysilazane, was injected into the PDMS mold to fabricate free-standing SiCN microstructures. Finally, the solid polymer SiCN microstructure was cross-linked using hot isostatic pressure at $400^{\circ}C$ and 205 bar. The optimal pyrolysis and annealing conditions to form a ceramic microstructure capable of withstanding temperatures over $1400^{\circ}C$ were determined. Using the optimal process conditions, the fabricated SiCN ceramic microstructure possessed excellent characteristics includingshear strength (15.2 N), insulation resistance ($2.163{\times}10^{14}\;{\Omega}$, and BDV (1.2 kV, minimum). Since the fabricated ceramic SiCN microstructure has improved electrical and physical characteristics compared to bulk Si wafers, it may be applied to harsh environments and high-power MEMS applications such as heat exchangers and combustion chambers.

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Fabrication of a Silicon Nanostructure Array Embedded in a Polymer Film by using a Transfer Method (전사방법을 이용한 폴리머 필름에 내재된 실리콘 나노구조물 어레이 제작)

  • Shin, Hocheol;Lee, Dong-Ki;Cho, Younghak
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.25 no.1
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    • pp.62-67
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    • 2016
  • This paper presents a silicon nanostructure array embedded in a polymer film. The silicon nanostructure array was fabricated by using basic microelectromechanical systems (MEMS) processes such as photolithography, reactive ion etching, and anisotropic KOH wet etching. The fabricated silicon nanostructure array was transferred into polymer substrates such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and polycarbonate (PC) through the hot-embossing process. In order to determine the transfer conditions under which the silicon nanostructures do not fracture, hot-embossing experiments were performed at various temperatures, pressures, and pressing times. Transfer was successfully achieved with a pressure of 1 MPa and a temperature higher than the transition temperature for the three types of polymer substrates. The transferred silicon nanostructure array was electrically evaluated through measurements with a semiconductor parameter analyzer (SPA).

Fluid-structure coupling of concentric double FGM shells with different lengths

  • Moshkelgosha, Ehsan;Askari, Ehsan;Jeong, Kyeong-Hoon;Shafiee, Ali Akbar
    • Structural Engineering and Mechanics
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    • v.61 no.2
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    • pp.231-244
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    • 2017
  • The aim of this study is to develop a semi-analytical method to investigate fluid-structure coupling of concentric double shells with different lengths and elastic behaviours. Co-axial shells constitute a cylindrical circular container and a baffle submerged inside the stored fluid. The container shell is made of functionally graded materials with mechanical properties changing through its thickness continuously. The baffle made of steel is fixed along its top edge and submerged inside fluid such that its lower edge freely moves. The developed approach is verified using a commercial finite element computer code. Although the model is presented for a specific case in the present work, it can be generalized to investigate coupling of shell-plate structures via fluid. It is shown that the coupling between concentric shells occurs only when they vibrate in a same circumferential mode number, n. It is also revealed that the normalized vibration amplitude of the inner shell is about the same as that of the outer shell, for narrower radial gaps. Moreover, the natural frequencies of the fluid-coupled system gradually decrease and converge to the certain values as the gradient index increases.

The Annealing Effect of Diamond-like Carbon Films for RF MEMS Switch

  • Hwang, Hyun-Suk;Choi, Won-Seok;Cha, Jae-Sang
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.35 no.11A
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    • pp.1091-1096
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    • 2010
  • Stiction in microelectromechanical systems (MEMS) has been a major failure mechanism. Especially, in RF MEMS switches, moving parts often suffered in-use and release related stiction problems. Some materials and methods have been used to prevent this problem. Diamond-like carbon (DLC) has not only been used as a protective material owing to its good mechanical properties but also has been used as a hydrophobic material. Its properties could be controlled by post annealing treatment in various conditions. We synthesized DLC films using a radio frequency plasma enhanced chemical vapor deposition (RF PECVD) method on silicon substrates using methane ($CH_4$) and hydrogen ($H_2$) gas. Then, the change of the hydrophobic property of the films was investigated undervarious annealing temperatures in nitrogen and in oxygen ambient. The films, that were annealed above $700^{\circ}C$ in nitrogen ambient, showed a high contact angle of water (> $90^{\circ}$) even though their mechanical property was sacrificed to some degree. The structural variation and the changes of the hydrophobic and mechanical properties of the DLC films were analyzed by Raman spectrum, contact angle measurement, surface profiler, and a nanoindentation test.

The Effect of Pyrazine on TMAH:IPA Single-crystal Silicon Anisotropic Etching Properties

  • Gwiy-Sang Chung;Tae-Song Kim
    • Transactions on Electrical and Electronic Materials
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    • v.2 no.2
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    • pp.21-25
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    • 2001
  • This paper presents the effect of pyrazine on tetramethylammonium hydroxide (TMAH):isopropyl alcohol (IPA) single-crystal silicon anisotropic etching properties. With the addition of IPA to TMAH solutions, etching characteristics are exhibited an improvement in flatness on the etching front and a reduction in undercutting, but the etch rate on (100) silicon is decreased. The (100) silicon etch rate is improved by the addition of pyrazine. An etch rate on (100) silicon of 0.8 ${\mu}{\textrm}{m}$/min, which is faster by 13% than a 20 wt.% solution of pure TMAH, is obtained using 20 wt.% TMAH: 0.5 g/100 ml pyrazine solutions, but the etch rate on (100) silicon is decreased when more pyrazine is added. With the addition of pyrazine to a 25 wt.% TMAH solution, variations in flatness on the etching front are not observed and the undercutting ratio is reduced by 30~50%. These results indicate that anisotropic etching technology using TMAH:IPA:pyrazine solutions provides a powerful and versatile method for realizing of microelectromechanical systems.

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Study of Manual Spray Coating Method for Fabricating Flexible Cantilever (유연성 높은 캔틸레버 제작을 위한 스프레이 코팅 방법 연구)

  • Kim, Ji-Kwan
    • Journal of Sensor Science and Technology
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    • v.26 no.5
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    • pp.366-369
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    • 2017
  • This work presents a detailed study of several parameters on the spray coating method for fabricating a flexible cantilever. Conventionally, spin coating method have been widely used in the microelectromechanical system (MEMS) fabrication process. However, the major drawback of this method is the difficulties in protecting various topography with photoresist film, particularly when the device is manufactured in high aspect ratio. It is also a challenging process to form a small pattern in the etched area. On the other hand, the commercial spray coating systems are not advantageous from an economic perspective and the technique is also providing less efficient. In order to solve these issues, we have developed a manual spray coating system which can be efficiently used by combining the accessories available in the laboratory. The developed spray coating system consists of a spin-coater, motorized stage, a spray gun with the capable of controlling centrifugal force, injection amount, injection angle, and spray range. The major advantage of the proposed spray coating system is its reasonable fabrication cost. Secondly, the system can be easily disassembled after finishing the coating experiment. Owing to the mentioned advantages, we sincerely believe that the proposed spray coating system can be effectively used in many related applications.

Formation of Thermal Bubble from Particle-Filled Microcavity (미세 입자로 충전된 캐비티에서의 열 기포 형성)

  • Jeong, Kwang-Hun;Lee, Heon-Ju;Chang, Young-Soo;Lee, Yoon-Pyo;Kim, Ho-Young
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.31 no.3 s.258
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    • pp.248-255
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    • 2007
  • Thermal bubble formation is a fundamental process in nucleate boiling heat transfer and many microelectromechanical thermal systems. One of the established facts is that heterogeneous nucleation is originated from vapors trapped inside cavities. Based on this, we performed an experimental study on the formation of thermal bubbles from microcavity fabricated by microfabrication technology on a copper plate. The cavity was filled with aluminum particles to enhance thermal bubble formation. We observed the thermal bubble behaviors, such as bubble incipience, diameter, frequency and coalescence during nucleate boiling. The experimental data showed that the superheat required to trigger the bubble formation was significantly reduced when the cavity was filled with microparticles. We found that the initial increase of superheat led to the increase of both the departure diameter and frequency while the further increase of superheat caused multiple bubbles to coalesce resulting in the decrease of departure frequency.

Flow Characteristics in a Microchannel Fabricated on a Silicon Wafer (실리콘 웨이퍼 상에 제작된 미소 유로에서의 유동특성)

  • Kim, Hyeong-U;Won, Chan-Sik;Jeong, Si-Yeong;Heo, Nam-Geon
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.25 no.12
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    • pp.1844-1852
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    • 2001
  • Recent developments in microfluidic devices based on microelectromechanical systems (MEMS) technique find many practical applications, which include electronic chip cooling devices, power MEMS devices, micro sensors, and bio-medical devices among others. For the design of such micro devices, flows characteristics inside a microchannel have to be clarified which exhibit somewhat different characteristics compared to conventional flows in a macrochannel. In the present study microchannels of various hydraulic diameters are fabricated on a silicon wafer to study the pressure drop characteristics. The effect of abrupt contraction and expansion is also studied. It is found from the results that the friction factor in a straight microchannel is about 15% higher than that in a conventional macrochannel, and the loss coefficients in abrupt expansion and contraction are about 10% higher than that obtained through conventional flow analysis.

RF MEMS Switches and Integrated Switching Circuits

  • Liu, A.Q.;Yu, A.B.;Karim, M.F.;Tang, M.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.7 no.3
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    • pp.166-176
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    • 2007
  • Radio frequency (RF) microelectromechanical systems (MEMS) have been pursued for more than a decade as a solution of high-performance on-chip fixed, tunable and reconfigurable circuits. This paper reviews our research work on RF MEMS switches and switching circuits in the past five years. The research work first concentrates on the development of lateral DC-contact switches and capacitive shunt switches. Low insertion loss, high isolation and wide frequency band have been achieved for the two types of switches; then the switches have been integrated with transmission lines to achieve different switching circuits, such as single-pole-multi-throw (SPMT) switching circuits, tunable band-pass filter, tunable band-stop filter and reconfigurable filter circuits. Substrate transfer process and surface planarization process are used to fabricate the above mentioned devices and circuits. The advantages of these two fabrication processes provide great flexibility in developing different types of RF MEMS switches and circuits. The ultimate target is to produce more powerful and sophisticated wireless appliances operating in handsets, base stations, and satellites with low power consumption and cost.