Thermal Fatigue Life Prediction of ${\mu}BGA$ Solder Joint Using Sn-37mass%Pb Solder and Sn-3.5mass%Ag Lead-free Solder
(Sn-37mass%Pb 솔더 및 Sn-3.5mass%Ag 무연솔더를 이용한 ${\mu}BGA$ 솔더접합부의 열피로수명 예측)
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- Journal of Welding and Joining
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- v.19 no.4
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- pp.406-412
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- 2001