• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.216.1-216.1
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• 2013

PZT 박막은 강유전 특성과 압전소자 특성을 나타내는 물질로 DRAM (dynamic random acess memory)과 FRAM (ferroelectric RAM) 등의 기억소자용 capacitor와 MEMS (micro electro mechanical system) 소자의 압전 물질로 사용하기 위한 연구가 진행중에 있다. 하지만 이러한 연구에서는 PZT 박막의 전기적 특성 향상을 주목적으로 연구가 진행되어 왔다. 특히, 박막 공정중 발생하는 plasma에 의한 PZT의 전기적 특성 변화가 박막 표면의 물리적 변화에 기인할 것으로 추정하고 있지만 이에 대한 구체적인 연구는 미비하다. 이 연구에서는 plasma에 의한 PZT 박막 표면의 물리적 특성 변화를 연구하기 위하여 PZT 박막을 sol-gel을 이용하여 Si 기판위에 약 100 nm의 두께로 증착하였으며, 이후 최대 300 W의 Ar plasma로 plasma power을 증가시켜 각각 10분간 plasma처리를 실시하였다. PZT 박막 표면의 nano-mechanics 특성을 분석하기 위하여 Nano-indenter와 Kelvin Probe Force Microscopy (KPFM)을 사용하여 surface hardness, surface morphology를 확인하였고 특히, surface potential 분석을 통하여 PZT 박막 표면의 plasma에 의한 박막 극 표면의 전기적 특성 변화를 연구하였다. 이 연구로 plasma에 의한 PZT 박막은 표면으로부터 최대 43 nm 깊이에서의 hardness는 최대 5.1 GPa에서 최소 4.3 GPa의 분포로 plasma power 변화에 의한 특성은 측정 불가능하였다. 이는 plasma에 의한 영향이 시료 극 표면에 국한되어 나타나기 때문으로 추정되며 이를 보완하기 위하여 surface potential을 분석하였다. 결과에 의하면 plasma power가 0 W에서 300 W로 증가함에 따라 potential이 30 mV에서 -20 mV로 감소하였으나 potential의 분산은 100 W에서 최대인 17 mV로 측정되었으며, 이때 RMS roughness역시 가장 높은 20.145 nm로 측정되었다. 특히, 100 W에서 potential에서는 물결 모양과 같은 일정한 패턴의 potential 무늬가 확인되었다.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.27-33
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• 2014

This paper presents a brief summary on a relatively new plasma aided electrolytic surface treatment process for light metals. A brief discussion regarding the advantages, principle, process parameters and applications of this process is discussed. The process owes its origin to Sluginov who discovered an arc discharge phenomenon in electrolysis in 1880. A similar process was studied and developed by Markov and coworkers in 1970s who successfully deposited an oxide film on aluminium. Several investigation thereafter lead to the establishment of suitable process parameters for deposition of a crystalline oxide film of more than $100{\mu}m$ thickness on the surface of light metals such as aluminium, titanium and magnesium. This process nowadays goes by several names such as plasma electrolytic oxidation (PEO), micro-arc oxidation (MOA), anodic spark deposition (ASD) etc. Several startups and surface treatment companies have taken up the process and deployed it successfully in a range of products, from military grade rifles to common off road sprockets. However, there are certain limitations to this technology such as the formation of an outer porous oxide layer, especially in case of magnesium which displays a Piling Bedworth ratio of less than one and thus an inherent non protective oxide. This can be treated further but adds to the cost of the process. Overall, it can be said the PEO process offers a better solution than the conventional coating processes. It offers advantages considering the fact that he electrolyte used in PEO process is environmental friendly and the temperature control is not as strict as in case of other surface treatment processes.

• Journal of Powder Materials
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• v.14 no.6
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• pp.372-379
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• 2007

The microstructure, mechanical and electrochemical properties of plasma electrolytic coatings (PEO) coatings on Mg-4.3 wt%Zn-1.0 wt%Y and Mg-1.0 wt%Zn-2.0 wt%Y alloys prepared by gas atomization, followed by compaction at 320 for 10 min under the pressure of 700 MPa and sintering at 380 and 420 respectively for 24 h, were investigated, which was compared with the cast Mg-1.0 wt%Zn alloy. All coatings consisting of MgO and $Mg_2SiO_4$ oxides showed porous and coarse surface features with some volcano top-like pores distributed disorderly and cracks between pores. In particular, the surface of coatings on Mg-1.0 wt%Zn-2.0 wt%Y alloy showed smaller area of pores and cracks compared to the Mg-4.3 wt%Zn-1.0 wt%Y and Mg-1.0 wt%Zn alloys. The cross section micro-hardness of coatings on the gas atomized Mg-Zn-Y alloys was higher than that on the cast Mg-1.0 wt%Zn alloy. Additionally, the coated Mg-1.0 wt%Zn-2.0 wt%Y alloy exhibited the best corrosion resistance in 3.5%NaCl solution. It could be concluded that the addition of Y has a beneficial effect on the formation of protective and hard coatings on Mg alloys by plasma electrolytic oxidation treatment.

• Journal of the Speleological Society of Korea
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• no.76
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• pp.37-42
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• 2006

The Dielectric Barrier Discharge (DBD) is a nonequilibrium gas discharge that is generated in the space between two electrodes, which are separated by an insulating dielectric layer. The dielectric layer can be put on either of the two electrodes or be inserted in the space between two electrodes. If an AC or pulse high voltage is applied to the electrodes that is operated at applied frequency from 50Hz to several MHz and applied voltages from a few to a few tens of kilovolts rms, the breakdown can occur in working gas, resulting in large numbers of micro-discharges across the gap, the gas discharge is the so called DBD. Compared with most other means for nonequilibrium discharges, the main advantage of the DBD is that active species for chemical reaction can be produced at low temperature and atmospheric pressure without the vacuum set up, it also presents many unique physical and chemical process including light, heat, sound and electricity. This has led to a number of important applications such as ozone synthesizing, UV lamp house, CO2 lasers, et al. In recent years, due to its potential applications in plasma chemistry, semiconductor etching, pollution control, nanometer material and large area flat plasma display panels, DBD has received intensive attention from many researchers and is becoming a hot topic in the field of non-thermal plasma.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.498-498
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• 2013

Atmospheric Pressure Plasmas have pioneered a new field of plasma for biomedical application bridging plasma physics and biology. Biological and medical applications of plasmas have attracted considerable attention due to promising applications in medicine such as electro-surgery, dentistry, skin care and sterilization of heat-sensitive medical instruments [1]. Traditional approaches using electronic devices have limits in heating, high voltage shock, and high current shock for patients. It is a great demand for plasma medical industrial acceptance that the plasma generation device should be compact, inexpensive, and safe for patients. Microwave-excited micro-plasma has the highest feasibility compared with other types of plasma sources since it has the advantages of low power, low voltage, safety from high-voltage shock, electromagnetic compatibility, and long lifetime due to the low energy of striking ions [2]. Recent experiment [2] shows three-log reduction within 180-s treatment of S. mutans with a low-power palm-size microwave power module for biomedical application. Experiments using microwave plasma are discussed. This low-power palm-size microwave power module board includes a power amplifier (PA) chip, a phase locked loop (PLL) chip, and an impedance matching network. As it has been a success, more compact-size module is needed for the portability of microwave devices and for the various medical applications of microwave plasma source. For the plasma generator, a 1.35-GHz coaxial transmission line resonator (CTLR) [3] is used. The way of reducing the size and enhancing the performances of the module is examined.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.130-135
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• 2023

Plasma-resistant ceramic (PRC) is a material used to prevent internal damage in plasma processing equipment for semiconductors and displays. The challenge is to suppress particles falling off from damaged surfaces and increase retention time in order to improve productivity and introduce the latest miniaturization process. Here, we confirmed the effect of suppressing plasma deterioration and reducing the etch rate through surface treatment of existing PRC with an initial illumination level of 200 nm. In particular, quartz glass showed a decrease in etch rate of up to 10%. Furthermore, it is believed that micro-scale secondary particles formed on the microstructure of each material grow as crystals during the fluoridation process. This is a factor that can act as a killer defect when dropped, and is an essential consideration when analyzing plasma resistance. The plasma etching suppression effect of the initial illumination is thought to be due to partial over etching at the dihedral angle of the material due to the sputtering of re-emission of Ar+-based cations. This means that plasma damage due to densification can also be interpreted in existing PRC studies. The research results are significant in that they present surface treatment conditions that can be directly applied to existing PRC for mass production and a new perspective to analyze plasma resistance in addition to simple etching rates.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1244-1247
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• 2005

The material removal mechanism of Electrical Discharge Machining (EDM) process has been studied for several decades. However, understanding of the material removal mechanism is still a difficult problem because the mechanism involves complicated physical phenomena including plasma. Especially, for a micro-EDM process, due to the influence of the debris that is generated during the machining process, quantitative modeling of EDM becomes more complex. To understand better the effects of the debris in the micro-EDM process experimentally, a new approach has been introduced in this study. Using a specially designed workpiece holder, the debris generated during the EDM with various process conditions has been collected. Then, using a simulated environment using micro-sized metal powders, the influence of the debris during the single EDM discharge has been observed. The effects of EDM process parameters on the debris size and product quality are discussed.

• Journal of Korean Society on Water Environment
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• v.28 no.3
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• pp.367-374
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• 2012

A flotation process has a shorter processing time and needs less space than a sedimentation process. Dissolved air flotation process (DAF) is an efficient flotation method and used in a conventional wastewater treatment process. However, DAF requires the circulation of water containing compressed air and requires expensive installation and operation cost. Plasma Air Flotation (PAF) process is able to float flocs by micro bubbles generated from underwater plasma without the circulation of bubbly water and additional saturators. Therefore, PAF can be an alternative solution overcoming economic barriers. In this study, Humic acid removal efficiency by PAF process was compared with that of sedimentation process. 44.67% and 87.3% reduction rate based on UV 254 absorbance has been measured in sedimentation and PAF respectively. In particular, PAF in the flocculation zone can dramatically remove humic acid from water. In flocculation zone, PAF can separate organic matters but sedimentation cannot.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.509-509
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• 2011

Superhydrophobic surfaces on alloyed steels were fabricated with a non-conventional method of plasma etching and subsequent water immersion procedure. High aspect ratio nanopatterns of nanoflake or nano-needle were created on the steels with various Cr content in its composition. With CF4 plasma treatment in radio-frequence chemical vapor deposition (r.-f. CVD) method, steel surfaces were etched and fluorinated by CF4 plasma, which induced the nanopattern evolution through the water immersion process. It was found that fluorine ion played a role as a catalyst to form nanopatterns in water elucidated with XPS and TEM analysis. The hierarchical patterns in micro- and nano scale leads to superhydrophobic properties on the surfaces by deposition of a hydrophobic coating with a-C:H:Si:O film deposited with a gas precursor of hexamethlydisiloxane (HMDSO) with its lower surface energy of 24.2 mN/m, similar to that of curticular wax covering lotus surfaces. Since this method is based on plasma dry etching & coating, precise patterning of surface texturing would be potential on steel or metal surfaces. Patterned hydrophobic steel surfaces were demonstrated by mimicking the Robinia pseudoacacia or acacia leaf, on which water was collected from the humid air using a patterned hydrophobicity on the steels. It is expected that this facile, non-toxic and fast technique would accelerate the large-scale production of superhydrophobic engineering materials with industrial applications.

• Textile Coloration and Finishing
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• v.24 no.2
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• pp.131-137
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• 2012

para-Aramid fibers were treated by low-temperature plasma to improve the adhesion. The surface of para-aramid fibers were treated with gaseous plasma of several discharge power and treatment time in oxygen gas at 1Torr pressure. The treated fibers at low-temperature plasma were taken oxygen-containing functional groups and micro-crator on the surface. The modified fibers were measured by dynamic contact angle analyzer and XPS(X-ray photoelectron spectroscopy). The Interfacial adhesion properties of aramid fabric and polyurethane resin were determined by T-peel test. The surface of aramid fibers were observed by FE-SEM photographs. It was found that surface modification and chemical component ratio of the aramid fibers were improved wettability and adhesion characterization.