• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1587-1588
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• 2006

Tn this paper, PCB (Printed Circuit Board) embedded $BaTiO_3$ MIM capacitors were designed, fabricated, and characterized for low cost organic SOP applications by using 3-D EM simulator and low temperature processes. Size of electrodes and thickness of high dielectric films are optimized for improving the performance characteristics of the proposed embedded MIM capacitors at high frequency regime. The selected thicknesses of the $BaTiO_3$ film are $12{\mu}m$, $16{\mu}m$, and $20{\mu}m$. The fabricated MIM capacitor with dielectric constant of 30 and thickness of $12{\mu}m$ has capacitance density of $21.5p\;F/mm^2$ at 100MHz, maximum quality factor of 37.4 at 300 MHz, a quality factor of 30.9 at 1GHz, self resonant frequency of 5.4 GHz, respectively. The measured capacitances and quality factors are well matched with 3-D EM simulated ones. These embedded capacitors are promising for SOP based advanced electronic systems with various functionality, low cost, small size and volume.

• 분석과학
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• 제36권2호
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• pp.99-104
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• 2023

Trace elements (TEs) have significant effects on both dental health and human health. Toxic effects are caused by deficiency or excess of TEs. This study was performed to determine levels of toxic and trace elements in incisor and molar teeth sampled from male and female participants residing in the north and south regions of Sudan. The tooth enamel of 18 extracted human teeth was analyzed using particle-induced x-ray emission (µ-PIXE) to determine its elemental profile and distribution. GeoPIXEII software package was used for the analysis of µ-PIXE data. The main elements determined were Na, Mg, P, S, Cl, K, Ca, Mn, Fe, Zn, Co, and Sr which were homogeneously distributed in the areas of the tooth enamel mapped with micro-PIXE.

• 마이크로전자및패키징학회지
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• 제21권4호
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• pp.1-13
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• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

• 구강회복응용과학지
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• 제19권1호
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• pp.7-15
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• 2003

This study used FEM(Finite Element method) based on micro-CT images to see the effects of occlusal force distribution with varying bone density and structure. the mandibular premolar region from human cadaver, thickness of 10mm was imaged using micro-CT. the cross sectional images were taken every $10{\mu}m$. these were reconstructed and the longitudinal image at the mid point of mesiodistal of the speciman was obtained for the specimen for the FEM. The stress disribution produced by a vertical force at 100N and 100N horizontal were analyzed by MSC Nastran FEM Package. according to the result of this study the occlusal force distribution depends on the structure of cancellus bone and for further information on the occlusal force distribution on the tooth and the surrounding structure requires further studies on cancellus bone structure. CEJ of all model show the highest peak and region whice meet teeth and bone show second high peak. Original model and cortical bone add model show different stress distribution. Stress distribution changed according to bone structures and densities.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2010년도 춘계학술발표대회 초록집
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• pp.74-74
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• 2010

모바일 정보통신기기를 중심으로 전자패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있는 추세이다. 플립칩 패키징 접합소재로는 솔더, ICA(Isotropic Conductive Adhesive), ACA(Anisotropic Conductive Adhesive), NCA(Non Conductive Adhesive) 등과 같은 다양한 접합소재가 사용되고 있다. 최근에는 언더필을 사용하는 플립칩 공법보다 미세피치 대응성을 위해 NCP를 이용한 플립칩 공법에 대한 요구가 증가되고 있는데, NCP의 상용화를 위해서는 공정성과 함께 신뢰성 확보가 필요하다. 본 연구에서는 LDI(LCD drive IC) 모듈을 위한 COF(Chip-on-Film) 플립칩 패키징용 NCP 포뮬레이션을 개발하고 이를 적용한 COF 패키지의 신뢰성을 조사하였다. 테스트베드는 면적 $1.2{\times}0.9mm$, 두께 $470{\mu}m$, 접속피치 $25{\mu}m$의 Au범프가 형성된 플리칩 실리콘다이와 접속패드가 Sn으로 finish된 폴리이미드 재질의 flexible 기판을 사용하였다. NCP는 에폭시 레진과 산무수물계 경화제, 이미다졸계 촉매제를 사용하여 다양하게 포뮬레이션을 하였다. DSC(Differential Scanning Calorimeter), TGA(Thermogravimetric Analysis), DEA(Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화거동을 확인하였으며, 본딩 후에는 보이드를 평가하고 Peel 강도를 측정하였다. 최적의 공정으로 제작된 COF 패키지에 대한 HTS (High Temperature Stress), TC (Thermal Cycling), PCT (Pressure Cooker Test)등의 신뢰성 시험을 수행한 결과 양산 적용 가능 수준의 신뢰성을 갖는 것을 확인할 수 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1990년도 추계학술대회 논문집 학회본부
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• pp.252-255
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• 1990

Analyzing and simulating of today's complex electrical networks require the use of computer-aided engineering tools. In recent years, the rapid advances in micro-computer hardware technology have increased the availability of power application software on the personal computer, once the domain of mainframes and minicomputers, enabling efficient and cost-effective power system analysis. An interactive simulation and analysis software for a power system is developed and presented in this paper. The software is written in PASCAL and is designed for PC use. This paper presents an integrated software package to run PC-DOS for the analysis of electric power networks. The software is menu driven and controlled by prompts. These programs are intended to help users understand the process of power system analysis and design.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1997년도 추계학술대회 논문집
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• pp.207-212
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• 1997

The purpose of this study is the development of CAM system which can cut and measure any shape by machining center and coordinate measuring machine. The overall goal of the CAM system is to achieve the CNC machining, from digitizing through to final cutting. The hardware of the system comprises PC and machining center, CMM. There are three steps in the CNC machining, (1) workpiece measuring on the CMM, (2) geometric modeling by the CAD system, (3) NC commands generation by the tool path compensated for tool nose radius. It is developed a software package, with which can conduct a micro CAM system in the PC without economical burden.

• 한국산업융합학회 논문집
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• 제3권1호
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• pp.83-90
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• 2000

The purpose of this study is the development of CAM system which can machine and measure any shape by CNC lathe. The overall goal of the CAM system is to achieve the CNC lathe machining, from roughing through to final measuring, The hardware of the system comprises PC, CNC lathe and measuring tools. There are three steps in the CNC lathe machining and measuring, (1) geometric modeling by the shape patterns, (2) NC commands generation by the tool path compensated for tool nose radius, (3) machining and workpiece measuring on the lathe. It is developed a software package, with which we can conduct a micro CAM system in the PC without economical burden.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• 한국세라믹학회지
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• 제33권8호
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• pp.863-870
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• 1996

Fabricated modified PZT system for pyroelectric IR sensor were analyzed and characterized for dielectric piezoelectric and pyroelectric properties. Particle size and distribution of source powders were controlled by attrition milling process. 0.05PSS+yPT+(0.95-y)PZ+0.4 wt%MnO2 system was fabricated and investigated sintering density crystal structure and micro-structure through sintering conditions sintering temperature and sintering atmosphere. The poled sintered system of y=0.11 showed the lowest dielectric constant. The dielectric constants were increased with increasing y-mole ratio. The pyroelectric properties of modified PZT systems which were assembled to TO-5 package were measured by IR measurement system average out-voltage of 0.05PSS+0.1PT+0.84PZ+ wt%MnO2 was 3V.