• 한국정밀공학회지
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• 제18권10호
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• pp.178-183
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• 2001

Abrasive jet machining(AJM) process is similar to the sand blasting and effectively removes hard and brittle materials. AJM has applied to rough working such as debarring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM is developed, and has become the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro grooving of glass. Diameter of hole and width of line in grooving is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro grooving of glass, but the size of machined groove increased about 2~4${\mu}{\textrm}{m}$. With the fine tuning of masking process and compensation of film wear. this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.231-232
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• 2010

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1202-1205
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• 2005

Micro hole is one of basic elements for micro device or micro parts. By micro ECM, micro holes less than $50\mu{m}$ in diameter can be machined easily. Machining characteristics of micro ECM were investigated according to machining conditions such as electrolyte concentration and pulse conditions. From the investigation, optimal machining conditions were suggested for micro ECM of stainless steel. For the micro machining with high resolution, the change of machining gap should be predicted. By using electrochemical principle equations, the change of machining gap was simulated.

• 한국생산제조학회지
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• 제8권1호
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• pp.15-20
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• 1999

• 한국정밀공학회지
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• 제27권7호
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• pp.87-93
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• 2010

This paper presents an evaluation of efficiency on glass precision machining by using abrasive water-jet machine. In this study, problems of conventional water-jet machining are examined experimentally and are analysized numerically. Especially, the reason of whitening on the machined surface of biochip glass is determined. It is found that the mass flow rate of abrasive input and transverse speed of water-jet are key parameters to control the direct machining of micro hole and channel on a glass substrate. Based on results of experimental analysis, possibility of direct fabrication of micro holes and channels on a glass substrate is successfully confirmed.

• 반도체디스플레이기술학회지
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• 제21권1호
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• pp.91-94
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• 2022

Top emission organic light-emitting diode is commonly used because of high efficiency and good color purity than bottom - emission organic light-emitting device. Unlike BEOLED, TEOLED contain semi-transparent metal cathode. Because of semi-transparent cathode, micro cavity effect occurs in TEOLED. We optimized this effect by changing the thickness of hole injection layer. Device consists of is indium-tin-oxide / N,N'-Di-[(1-naphthyl)-N,N'-diphenyl]-1,1'-biphenyl-4,4'-diamine (x nm) / tris-(8-hydroxyquinoline) aluminum (50nm) / LiF(0.5nm) / Mg:Ag (1:9), and we changed NPB thickness which is used as HTL in our device in order to study how micro cavity effects are changed by optical path. As the results, NPB thickness at 35nm showed the current efficiency of 8.55Cd/A.

• 한국정밀공학회지
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• 제21권4호
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• pp.186-193
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• 2004

Porous anodic alumina has been used widely for corrosion protection of aluminum surfaces or as dielectric material in micro-electronics applications. It exhibits a homogeneous morphology of parallel pores which can easily be controlled between 10 and 400nm. It has been applied as a template for fabrication of the nanometer-scale composite. In this study, mechanical properties of the AAO structures are measured by the nano indentation method. Nano indentation technique is one of the most effective methods to measure the mechanical properties of nano-structures. Basically, hardness and elastic modulus can be obtained by the nano-indentation. Using the nano-indentation method, we investigated the mechanical properties of the AAO structure with different size of nano-holes. In results, we find the hole effect that changes the mechanical properties as size of nano hole.

• 한국농업기계학회:학술대회논문집
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• 한국농업기계학회 1993년도 Proceedings of International Conference for Agricultural Machinery and Process Engineering
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• pp.761-767
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• 1993

A precision planting system using computer controlled technology for mulching cultivation was developed and tested . The system consisting of a micro-computer, several optical fiber sensors and control actuators realized the mechanization of the precision planting operation. The film hole positions, existences of a seed on shutter were detected and the planting speed was measured. The shutter opening mechanism and a seed metering device driven by a stepping motor were controlled, automatically . The planting timing of the shutter opening mechanism were analyzed from a video camera motion analysis, theoretically. The results showed a sufficient accuracy of a seed planted into the center a film hole with a variety of planting speeded. The gravity point positions in film hole of seeds planted by the system just were within the area of +-5mm of the hole center when the hole diameter was 40mm.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.963-966
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• 2000

Abrasive jet machining(AJM) process is similar to the sand blasting, and effectively removes hard and brittle materials. AJM has applied to rough working such as deburring and rough finishing. As the needs for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro groove cutting of glass. Diameter of hole and width of line in this groove cutting is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro groove cutting in glass, but the size of machined groove was increased about 2~4${\mu}{\textrm}{m}$. therefore, this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD parts.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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• pp.219-220
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• 2000

We propose a new method for the formation of an aluminum parting layer in the fabrication of field emitter arrays, in which we used a reflow property of aluminum at a lower temperature than the deformation point of glass. After the sputtered aluminum layer on the gate metal was etched for the formation of gate holes, we carried out a rapid thermal annealing process, by which the aluminum slightly diffused into the gate hole. This reflowed aluminum could be used as a parting layer and emitter arrays were easily fabricated using this method.