• Title/Summary/Keyword: metal ink

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A Study on the Preparation of Ternary Transition Metal Coated-Dimensionally Stable Anode for Electrochemical Oxidation (전기화학적 산화를 위한 삼원 전이 금속 코팅 불용성 산화 전극 제조에 관한 연구)

  • Park, Jong-Hyeok;Choi, Jang-Uk;Park, Jin-Soo
    • Applied Chemistry for Engineering
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    • v.32 no.4
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    • pp.409-416
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    • 2021
  • Dimensionally stable electrodes are one of the important components in electrochemical water treatment processes. In the manufacturing of the dimensionally stable electrodes, the type of metal catalyst coated on the surface of the metal substrate, the coating and sintering methods substantially influence their performance and durability. In this study, using Ir-Ru-Ta ternary metal coating, various electrodes were prepared depending on the coating method under the same pre-treatment and sintering conditions, and its performance and durability were studied. As a coating method, brush and spray coating were used. As a result, the reduction in the amount of catalyst ink was achieved because more amount of metal could be coated for the electrode using spraying with the same amount of catalyst ink. In addition, the spray_2.0_3.0 electrode prepared by a specific spray coating method shows the phenomenon of cracking and the uniform coating of the ternary metal on the surface of the coating layer, and results in a high electrochemically active specific surface area, and the decomposition performance of 4-chlorophenol was superior to the other electrodes. However, it was found that there was no significant difference in durability depending on the coating method.

Information Displays in the Twenty-First Century

  • Miyasaka, Mitsutoshi;Shimoda, Tatsuya
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.61-64
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    • 2003
  • The information display industry this century has to improve our life without increasing energy consumption. Suftla technology together with high-performance silicon thin film transistors (TFTs) and ink-jet technology for forming metal-wiring and organic TFTs will play leading roles for achieving this requirement. In this paper these technologies are reviewed and the concept of the information displays in near future is discussed.

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Status of Research on Selective Laser Sintering of Nanomaterials for Flexible Electronics Fabrication (나노물질의 선택적 레이저소결을 이용한 유연전기소자 구현 연구현황)

  • Ko, Seung-Hwan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.5
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    • pp.533-538
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    • 2011
  • A plastic-compatible low-temperature metal deposition and patterning process is essential for the fabrication of flexible electronics because they are usually built on a heat-sensitive flexible substrate, for example plastic, fabric, paper, or metal foil. There is considerable interest in solution-processible metal nanoparticle ink deposition and patterning by selective laser sintering. It provides flexible electronics fabrication without the use of conventional photolithography or vacuum deposition techniques. We summarize our recent progress on the selective laser sintering of metals and metal oxide nanoparticles on a polymer substrate to realize flexible electronics such as flexible displays and flexible solar cells. Future research directions are also discussed.

10㎛-wide Pattern Engraving using Metal Specimens coated with a heterogeneous metal for Printed Electronics (이종 금속이 코팅된 금속소재를 이용한 인쇄전자소자용 선폭 10㎛급 패턴 가공)

  • Sohn, Hyonkee;Cao, Binh Xuan;Cho, Yong-Kwon;Shin, Dong-Sig;Choi, Jiyeon
    • Laser Solutions
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    • v.17 no.4
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    • pp.20-23
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    • 2014
  • In printed electronics, printing rolls are used to transfer electronic ink onto a flexible substrate. Generally printing rolls are patterned in microscale by the indirect laser method. Since based on the wet etch process, the indirect method is neither environment-friendly nor suitable for making a printing roll with patterns narrower than $20{\mu}m$. In this paper, we have directly engraved micro-patterns into a Zn-coated metal specimens using a picosecond laser in order both to engrave $10{\mu}m$-wide patterns and to improve the pattern profile. Experiments showed that it is possible to engrave $10{\mu}m$-wide patterns with an a rectangular-shaped profile which is necessary for the dimensionally accurate printing.

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Patterning of high resolution metal electrodes using selective surface treatment and dip casting for printed electronics (선택적 표면처리와 딥코팅 방법을 이용한 고해상도 금속 패턴 형성연구)

  • Kim, Yong-Hoon;Eom, You-Hyun;Park, Sung-Kyu;Oh, Min-Seok;Kang, Jung-Won;Han, Jeong-In
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1340_1341
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    • 2009
  • In this report, high-resolution metal electrode patterning is demonstrated by using selective surface treatment and dip casting for low-cost printed electronic applications. On hydrophobic octadecyltrichlorosilane treated $SiO_2$ surface, deep UV irradiation was performed through a patterned quartz photomask to selectively control the surface energy of the $SiO_2$ layer. The deep UV irradiated region becomes hydrophilic and by dipping into Ag nano-ink, Ag patterns were formed on the surface. Using this patterning technique, line patterns and dot arrays having less than $10{\mu}m$ pitch were fabricated.

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Development of Transparent Conductive Patterned Film with Hybrid Ag Ink

  • Choe, Ju-Hwan;Baek, Su-Jin;Lee, Beom-Ju;Sin, Jin-Guk
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.05a
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    • pp.2.3-2.3
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    • 2011
  • With increased interest in printed devices, various metal nano inks have been investigated as candidates materials for printed electrodes and wiring as well as conductive film substituting photo-lithography process. Recent advances in organic conductive polymer allow us to fabricate high performance printed device. Meanwhile, there was several attempts to fabricate conductive films by mixing conductive polymer with metal nano-particle or nano-wires. The presence of Ag nanowires in conductive polymer mixture have shown good potential in organic photovoltaic devices.

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Trends on Technology of Eco-friendly Metal and Ceramic Nanoparticle Inks for Direct Printing (다이렉트 프린팅용 청정 금속 및 세라믹 나노 입자 잉크 기술 동향)

  • Hong, Sung-Jei;Kim, Jong-Woong;Han, Chul-Jong;Kim, Young-Sung;Hong, Tae-Whan
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.2
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    • pp.1-9
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    • 2010
  • In this paper, trends on technology of metal and ceramic nanoparticle inks using eco-friendly process were reviewed. There are two types of eco-friendly processes, dry and wet. In case of dry process, gas evaporation process was being used to synthesize the ultrafine nanoparticles. Also, in case of wet process, low temperature process excluding harmful elements such as $Cl^-$ and ${NO_3}^-$ was being used to synthesize the ultrafine nanoparticles. Sizes of nanoparticles were less than 10 nm using the eco-friendly processes, and the nanoparticles were well dispersed into ink solvent. The ink was successfully applied to fabricate directly printed pattern.

Effect of Polar Organic Substance on Cutting Mechanism (極性有機物質이 切削機構에 미치는 影響)

  • 서남섭;양균의
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.10 no.1
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    • pp.131-137
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    • 1986
  • Cutting oil cools the chip and a tool as well as lubricates the chip-tool interface, the flank and machined surface. Rehbinder effect has been known as a phenomenon, the reduction of mechanical strength, when the metal is exposed to a polar organic environment or the surface of metal is coated with some polar organic substances. About the cause of Rehbinder effect there have been many different ideas by Rehbinder, Shaw, Barlow, Sakida and etc. In this report, the efect of polar organic substance( $C_{6}$ $H_{5}$C $H_{3}$+ $C_{6}$ $H_{4}$(C $H_{3}$)$_{2}$+ $C_{4}$ $H_{9}$OH+ $C_{6}$ $H_{12}$ $O_{2}$) (magic ink) upon the mechanism of chip formation on the orthogonal cutting of copper and mechanical properties of the work material are experimentally discussed with various rake angles. As expected no lubrication action could be noticed, but the shear angle increased and the cutting force and shear strain on the shear plane decreased, therefore the work material must be embrittled under polar organic substance.substance.

Inorganic Printable Materials for Printed Electronics: TFT and Photovoltaic Application

  • Jeong, Seon-Ho;Lee, Byeong-Seok;Lee, Ji-Yun;Seo, Yeong-Hui;Kim, Ye-Na;More, Priyesh V.;Lee, Jae-Su;Jo, Ye-Jin;Choe, Yeong-Min;Ryu, Byeong-Hwan
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.05a
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    • pp.1.1-1.1
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    • 2011
  • Printed electronics based on the direct writing of solution processable functional materials have been of paramount interest and importance. In this talk, the synthesis of printable inorganic functional materials (conductors and semiconductors) for thin-film transistors (TFTs) and photovoltaic devices, device fabrication based on a printing technique, and specific characteristics of devices are presented. For printable conductor materials, Ag ink is designed to achieve the long-term dispersion stability and good adhesion property on a glass substrate, and Cu ink is sophisticatedly formulated to endow the oxidation stability in air and even aqueous solvent system. The both inks were successfully printed onto either polymer or glass substrate, exhibiting the superior conductivity comparable to that of bulk one. In addition, the organic thin-film transistor based on the printed metal source/drain electrode exhibits the electrical performance comparable to that of a transistor based on a vacuum deposited Au electrode. For printable amorphous oxide semiconductors (AOSs), I introduce the noble ways to resolve the critical problems, a high processing temperature above $400^{\circ}C$ and low mobility of AOSs annealed at a low temperature below $400^{\circ}C$. The dependency of TFT performances on the chemical structure of AOSs is compared and contrasted to clarify which factor should be considered to realize the low temperature annealed, high performance AOSs. For photovoltaic application, CI(G)S nanoparticle ink for solution processable high performance solar cells is presented. By overcoming the critical drawbacks of conventional solution processed CI(G)S absorber layers, the device quality dense CI(G)S layer is obtained, affording 7.3% efficiency CI(G)S photovoltaic device.

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