• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.203-208
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• 2007

Drying characteristics are confirmed by experiment to a printing machine which use Gravure ink or metal ink for an optimum design of direct radiation drying system room using NIR. As a result, Drying is easily accomplished in short distance and low moving speed in Gravure ink, but drying is dropped in metal ink because of oil. This confirmed that the development of water metal ink had to be proceeded to accomplish a perfect drying condition.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.799-802
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• 2008

The metal films ink-jetted using the conductive ink based on a mixture of copper and silver nanoparticles were investigated. The porosity and resistivity of films were minimized by adjusting the mixing ratio of Cu and Ag nanoparticles. We demonstrated that the printed tracks with good conductivity could be obtained at sufficiently lower annealing temperatures where plastic substrates could be used.

• Korean Journal of Materials Research
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• v.17 no.9
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• pp.453-457
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• 2007

Interest in use of ink-jet printing for pattern-on-demand fabrication of metal interconnects without complicated and wasteful etching process has been on rapid increase. However, ink-jet printing is a wet process and needs an additional thermal treatment such as an annealing process. Since a metal ink is a suspension containing metal nanoparticles and organic capping molecules to prevent aggregation of them, the microstructure of an ink-jet printed metal interconnect 'as dried' can be characterized as a stack of loosely packed nanoparticles. Therefore, during being treated thermally, an inkjet-printed interconnect is likely to evolve a characteristic microstructure, different from that of the conventionally vacuum-deposited metal films. Microstructure characteristics can significantly affect the corresponding electrical and mechanical properties. The characteristics of change in microstructure and electrical resistivity of inkjet-printed silver (Ag) films when annealed isothermally at a temperature between 170 and $240^{\circ}C$ were analyzed. The change in electrical resistivity was described using the first-order exponential decay kinetics. The corresponding activation energy of 0.44 eV was explained in terms of a thermally-activated mechanism, i.e., migration of point defects such as vacancy-oxygen pairs, rather than microstructure evolution such as grain growth or change in porosity.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1623-1624
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• 2006

It is a paper for design, manufacture and estimation of industry inkjet head. Simulations for Actuator, Ink flow and Ejection are executed for securing design ability. Relations between droplet and properties of ink are explained closely through simulation for nozzle. Actually, two silicon plates are made by dry and wet etching and directly bonded. PZT materials is attached on the bended ink flow part and cut to $540{\mu}m$ interval by dicing saw. Actuator was seen variation within 10% between simulation and actual head. Through the ejection estimation, it is shown that stabilized driving voltages change according to viscosity and surface tension of metal ink. Using the metal ink of viscosity of 4.8 cps and surface tension of 0.025 N/m, it is possible to eject the stable droplets with 5m/s, 20 pl, 5 kHz.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1806-1809
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• 2008

Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.329-329
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• 2008

Silver nanoparticles were synthesized by polyol process and its particle size observed with TEM is about 20nm. Silver nanoparticle ink with metal content of 30wt% was prepared using solvent of ethanol and has low viscosity of 5cps (10rpm). This ink was printed by as ink-jet printer on Al2O3 and Silicone substrate. The resistivity and morphology of the printed film was investigated as a function of sintering termperature.

• Journal of Powder Materials
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• v.20 no.2
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• pp.120-124
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• 2013

This study is carried out to develop the new process for the fabrication of ultra-fine electrodes on the flexible substrates using superhydrophobic effect. A facile method was developed to form the ultra-fine trenches on the flexible substrates treated by plasma etching and to print the fine metal electrodes using conductive nano-ink. Various plasma etching conditions were investigated for the hydrophobic surface treatment of flexible polyimide (PI) films. The micro-trench on the hydrophobic PI film fabricated under optimized conditions was obtained by mechanical scratching, which gave the hydrophilic property only to the trench area. Finally, the patterning by selective deposition of ink materials was performed using the conductive silver nano-ink. The interface between the conductive nanoparticles and the flexible substrates were characterized by scanning electron microscope. The increase of the sintering temperature and metal concentration of ink caused the reduction of electrical resistance. The sintering temperature lower than $200^{\circ}C$ resulted in good interfacial bonding between Ag electrode and PI film substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.559-560
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• 2006

Inkjet Printing is very attractive method for direct patterns with no masks, In order to Achieve direct printing with nano metal, It is often necessary to print them with highly concentrated Ink We research the High Concentrated silver nano ink. Formulation which has a good thermal stability and storage stability and jet stability using a ethylene glycol ether. Normally Alcohol-based inks can be sensitive But High boiling point ethylene glycol ether base Ink is creating a stable meniscus and minimum maintenance issues. We are reaching a 50~60wt% high Silver Ink using a Hydrophilic Ag Nano powder. (30~50nm)

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1466-1468
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• 2009

The preparation method of copper nanopowder by dry process for conductive ink was investigated. Inert gas condensation method was used to synthesize copper nanopowder. The produced powders was spherical and sized 10~100nm flowing the conditions. The results showed that input voltage and evaporation rate is critical variables for nano-sized copper powder.