• Corrosion Science and Technology
• /
• 제22권1호
• /
• pp.64-72
• /
• 2023

Ni-Ti shape memory alloy for dental nerve treatment devices was prepared by adding Mo to Ni-Ti alloy to improve flexibility and fatigue fracture characteristics and simultaneously increase corrosion resistance. Surface properties of the alloy were evaluated. Microstructure analysis of the Ni-Ti-xMo alloy revealed that the amount of needle-like structure increased with increasing Mo content. The shape of the precipitate showed a pattern in which a long needle-like structure gradually disappeared and changed into a small spherical shape. As a result of XRD analysis of the Ni-Ti-xMo alloy, R-phase structure appeared as Mo was added. R-phase and B2 structure were mainly observed. As a result of DSC analysis, phase transformation of the Ti-Ni-Mo alloy showed a two-step phase change of B2-R-B19' transformation with two exothermic peaks and one endothermic peak. As Mo content increased, R-phase formation temperature gradually decreased. As a result of measuring surface hardness of the Ti-Ni-Mo alloy, change in hardness value due to the phase change tended to decrease with increasing Mo content. As a result of the corrosion test, the corrosion potential and pitting potential increased while the current density tended to decrease with increasing Mo content.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2009년도 춘계학술대회 논문집
• /
• pp.258-258
• /
• 2009

• Smart Structures and Systems
• /
• 제3권1호
• /
• pp.89-114
• /
• 2007

Two aspects of the design of a small-scale smart wing are addressed in this work, related to the ability of the wing to modify its cross section assuming the shape of two different airfoils and to the possibility of deflecting the profiles near the trailing edge in order to obtain hingeless control surfaces. The actuation is provided by one-way shape memory alloy wires eventually coupled to springs, Shape Memory Alloys (SMAs) being among the most promising materials for this kind of applications. The points to be actuated along the profiles and the displacements to be imposed are selecetd so that they satisfactorily approximate the change from an airfoil to the other and to result in an adequate deflection of the control surface; the actuators and their performances are designed so that an adequate wing stiffness is guaranteed, in order to prevent excessive deformations and undesired airfoil shape variations due to aerodynamic loads. The effect of the pressure distributions, calculated by way of the XFOIL software, and of the actuators loads, is estimated by FE analyses of the loaded wing. Two prototypes are then realised incorporating the variable airfoil and the hingeless aileron features respectively, and the verification of their shapes in both the actuated and non-actuated states, supported by image analysis techniques, confirms that interesting results are achievable with the proposed lay out and design considerations.

• 한국주조공학회지
• /
• 제9권1호
• /
• pp.58-66
• /
• 1989

The effect of heat treating temperature and ${\alpha}$ phase In the ${\beta}$ phase matrix were investigated for ${\beta}-CuZnAl$ shape memory alloys by tension test, fatigue test, and shape memory effect test. After heat treatment at $677^{\circ}C$, $750^{\circ}C$, $800^{\circ}C$ and $850^{\circ}C$ for 10 min. respectively, static fracture stress(${\sigma}_f$), fatigue fracture stress(${\tau}_{max}$) at $10^6$ cycle, and elongation(${\epsilon}_f$) was $24.2kg/mm^2$, $17.21kg/mm^2$ and 11.8%, respectively. As heat treating temperature decreased, fracture surfaces of the specimens were changed from the intergranular to the transgranular fracture mode. Especially, the a phase precipitated in the ${\beta}$ phase matrix had an effect on crack propagation and the fracture surface was characterized by dimple-like pattern when crack propagated in transgranular cracking mode. Precipitation of the ${\alpha}$ phase in the ${\beta}$ phase matrix lowered the transformation temperature by $10^{\circ}C$, and about 2.5 vol.% ${\alpha}$ phase did not affect the shape memory effect examined by the bending test.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제8권1호
• /
• pp.46-50
• /
• 2008

The effect of physicochemical properties of solvents on the microstructure of polyvinyl carbazole (PVK) film for non-volatile polymer memory was investigated. For the solubilization of PVK molecules and the preparation of PVK films, four solvents with different physicochemical properties of the Hildebrand solubility parameter and vapor pressure were considered: chloroform, tetrahydrofuran (THF), 1,1,2,2-tetrachloroethane (TCE), and N,N-dimehtylformamide (DMF). The solubility of PVK molecules in the solvents was observed by ultravioletvisible spectroscopy. PVK molecules were observed to be more soluble in chloroform, with a low Hildebrand solubility parameter, than solvents with higher values. The aggregated size and micro-/nano-topographical properties of PVK films were characterized using optical and atomic force microscopes. The PVK film cast from chloroform exhibited enhanced surface roughness compared to that from TCE and DMF. It was also confirmed that the microstructure of PVK film has an effect on the performance of non-volatile polymer memory.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2011년도 제40회 동계학술대회 초록집
• /
• pp.440-440
• /
• 2011

We report on the non-volatile memory characteristics of a bistable organic memory (BOM) device with Au nanoparticles (NPs) embedded in a conducting poly N-vinylcarbazole (PVK) colloids hybrid layer deposited on flexible polyethylene terephthalate (PET) substrates. Transmission electron microscopy (TEM) images show the Au nanoparticles distributed isotropically around the surface of a PVK colloid. The average induced charge on Au nanoparticles, estimated using the C-V hysteresis curve, was large, as much as 5 holes/NP at a sweeping voltage of ${\pm}3$ V. The maximum ON/OFF ratio of the current bistability in the BOM devices was as large as $1{\times}105$. The cycling endurance tests of the ON/OFF switching exhibited a high endurance of above $1.5{\times}105$ cycles and a high ON/OFF ratio of ~105 could be achieved consistently even after quite a long retention time of more than $1{\times}106$ s.

• 한국주조공학회지
• /
• 제29권5호
• /
• pp.187-191
• /
• 2009

Microstructures and shape memory characteristics of $Ti_{50}Ni_{20}Cu_{30}$ alloy strips fabricated by arc melt overflow have been investigated by means of XRD, optical microscopy and DSC. The microstructure of as-cast strips exhibited columnar grains normal to the strip surface. X-ray diffraction analysis showed that one-step martensitic transformation of B2-B19 occurred in the alloy strips. According to the DSC analysis, it was known that the martensitic transformation temperature ($M_s$) of B2 $\rightarrow$ B19 in $Ti_{50}Ni_{20}Cu_{30}$ strip is $57^{\circ}C$. During thermal cyclic deformation with the applied stress of 60 MPa, transformation hysteresis and elongation associated with the B2-B19 transformation were observed to be $3.7^{\circ}C$ and 1.6%, respectively. The as-cast strip of $Ti_{50}Ni_{20}Cu_{30}$ alloy also showed a superelasticity and its stress hysteresis was as small as 14 MPa. These mechanical properties and shape memory characteristics of the alloy strips were ascribed to B2-B19 transformation and the controlled microstructures produced by rapid solidification of the arc melt overflow process.

• 반도체디스플레이기술학회지
• /
• 제21권4호
• /
• pp.45-49
• /
• 2022

Through Silicon Via (TSV) is a technology that interconnects chips through silicon vias. TSV technology can achieve shorter distance compared to wire bonding technology with excellent electrical characteristics. Due to this characteristic, it is currently being used in many fields that needs faster communication speed such as memory field. However, there is performance degradation issue on TSV technology due to the parasitic capacitance. To deal with this problem, in this study, the parasitic capacitance with TSV design factors is analyzed using commercial tool. TSV design factors were set in three categories: size, aspect ratio, pitch. Each factor was set by dividing the range with TSV used for memory and package. Ansys electronics desktop 2021 R2.2 Q3D was used for the simulation to acquire parasitic capacitance data. DOE analysis was performed based on the reaction surface method. As a result of the simulation, the most affected factors by the parasitic capacitance appeared in the order of size, pitch and aspect ratio. In the case of memory, each element interacted, and in the case of package, it was confirmed that size * pitch and size * aspect ratio interact, but pitch * aspect ratio does not interact.

• 해양환경안전학회지
• /
• 제29권6호
• /
• pp.543-551
• /
• 2023

기후변화 영향으로 이상고수온, 태풍, 홍수, 가뭄 등 재난 및 안전 관리기술은 지속적으로 고도화를 요구받고 있으며, 특히 해수면 온도는 한반도 주변에서 발생되는 여름철 적조 발생과 동해안 냉수대 출현, 소멸 등에 영향을 신속하게 분석할 수 있는 중요한 인자이다. 따라서, 본 연구에서는 해수면 온도 자료를 해양 이상현상 및 연구에 적극 활용되기 위해 통계적 방법과 딥러닝 알고리즘을 적용하여 예측성능을 평가하였다. 예측에 사용된 해수면 수온자료는 흑산도 조위관측소의 2018년부터 2022년까지 자료이며, 기존 통계적 ARIMA 방법과 Long Short-Term Memory(LSTM), Gated Recurrent Unit(GRU)을 사용하였고, LSTM의 성능을 더욱 향상할 수 있는 Sequence-to-Sequence(s2s) 구조에 Attention 기법을 추가한 Attention Long Short-Term Memory (LSTM)기법을 사용하여 예측 성능 평가를 진행하였다. 평가 결과 Attention LSTM 모델이 타 모델과 비교하여 더 좋은 성능을 보였으며, Hyper parameter 튜닝을 통해 해수면 수온 성능을 개선할 수 있었다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 추계학술대회 논문집
• /
• pp.4-4
• /
• 2009

Surface analysis on defective wire-bonding pads are performed in flash memory assembly. Week wire bonding may cause a significant effect on the final product reliability, and the surface condition of the aluminum bond pads is critical in terms of product reliability. To find out possible week bonding on semiconductor interconnects, ball sheer test (BST) has been performed. On some defective or week bonded pads, we have investigated the surface contents, assuming that the week bonding is induced from the surface conditions. AES and XPS are employed for the quantitative surface analysis on defective dies.