• Corrosion Science and Technology
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• v.22 no.1
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• pp.64-72
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• 2023

Ni-Ti shape memory alloy for dental nerve treatment devices was prepared by adding Mo to Ni-Ti alloy to improve flexibility and fatigue fracture characteristics and simultaneously increase corrosion resistance. Surface properties of the alloy were evaluated. Microstructure analysis of the Ni-Ti-xMo alloy revealed that the amount of needle-like structure increased with increasing Mo content. The shape of the precipitate showed a pattern in which a long needle-like structure gradually disappeared and changed into a small spherical shape. As a result of XRD analysis of the Ni-Ti-xMo alloy, R-phase structure appeared as Mo was added. R-phase and B2 structure were mainly observed. As a result of DSC analysis, phase transformation of the Ti-Ni-Mo alloy showed a two-step phase change of B2-R-B19' transformation with two exothermic peaks and one endothermic peak. As Mo content increased, R-phase formation temperature gradually decreased. As a result of measuring surface hardness of the Ti-Ni-Mo alloy, change in hardness value due to the phase change tended to decrease with increasing Mo content. As a result of the corrosion test, the corrosion potential and pitting potential increased while the current density tended to decrease with increasing Mo content.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.258-258
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• 2009

• Smart Structures and Systems
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• v.3 no.1
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• pp.89-114
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• 2007

Two aspects of the design of a small-scale smart wing are addressed in this work, related to the ability of the wing to modify its cross section assuming the shape of two different airfoils and to the possibility of deflecting the profiles near the trailing edge in order to obtain hingeless control surfaces. The actuation is provided by one-way shape memory alloy wires eventually coupled to springs, Shape Memory Alloys (SMAs) being among the most promising materials for this kind of applications. The points to be actuated along the profiles and the displacements to be imposed are selecetd so that they satisfactorily approximate the change from an airfoil to the other and to result in an adequate deflection of the control surface; the actuators and their performances are designed so that an adequate wing stiffness is guaranteed, in order to prevent excessive deformations and undesired airfoil shape variations due to aerodynamic loads. The effect of the pressure distributions, calculated by way of the XFOIL software, and of the actuators loads, is estimated by FE analyses of the loaded wing. Two prototypes are then realised incorporating the variable airfoil and the hingeless aileron features respectively, and the verification of their shapes in both the actuated and non-actuated states, supported by image analysis techniques, confirms that interesting results are achievable with the proposed lay out and design considerations.

• Journal of Korea Foundry Society
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• v.9 no.1
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• pp.58-66
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• 1989

The effect of heat treating temperature and ${\alpha}$ phase In the ${\beta}$ phase matrix were investigated for ${\beta}-CuZnAl$ shape memory alloys by tension test, fatigue test, and shape memory effect test. After heat treatment at $677^{\circ}C$, $750^{\circ}C$, $800^{\circ}C$ and $850^{\circ}C$ for 10 min. respectively, static fracture stress(${\sigma}_f$), fatigue fracture stress(${\tau}_{max}$) at $10^6$ cycle, and elongation(${\epsilon}_f$) was $24.2kg/mm^2$, $17.21kg/mm^2$ and 11.8%, respectively. As heat treating temperature decreased, fracture surfaces of the specimens were changed from the intergranular to the transgranular fracture mode. Especially, the a phase precipitated in the ${\beta}$ phase matrix had an effect on crack propagation and the fracture surface was characterized by dimple-like pattern when crack propagated in transgranular cracking mode. Precipitation of the ${\alpha}$ phase in the ${\beta}$ phase matrix lowered the transformation temperature by $10^{\circ}C$, and about 2.5 vol.% ${\alpha}$ phase did not affect the shape memory effect examined by the bending test.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.1
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• pp.46-50
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• 2008

The effect of physicochemical properties of solvents on the microstructure of polyvinyl carbazole (PVK) film for non-volatile polymer memory was investigated. For the solubilization of PVK molecules and the preparation of PVK films, four solvents with different physicochemical properties of the Hildebrand solubility parameter and vapor pressure were considered: chloroform, tetrahydrofuran (THF), 1,1,2,2-tetrachloroethane (TCE), and N,N-dimehtylformamide (DMF). The solubility of PVK molecules in the solvents was observed by ultravioletvisible spectroscopy. PVK molecules were observed to be more soluble in chloroform, with a low Hildebrand solubility parameter, than solvents with higher values. The aggregated size and micro-/nano-topographical properties of PVK films were characterized using optical and atomic force microscopes. The PVK film cast from chloroform exhibited enhanced surface roughness compared to that from TCE and DMF. It was also confirmed that the microstructure of PVK film has an effect on the performance of non-volatile polymer memory.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.440-440
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• 2011

We report on the non-volatile memory characteristics of a bistable organic memory (BOM) device with Au nanoparticles (NPs) embedded in a conducting poly N-vinylcarbazole (PVK) colloids hybrid layer deposited on flexible polyethylene terephthalate (PET) substrates. Transmission electron microscopy (TEM) images show the Au nanoparticles distributed isotropically around the surface of a PVK colloid. The average induced charge on Au nanoparticles, estimated using the C-V hysteresis curve, was large, as much as 5 holes/NP at a sweeping voltage of ${\pm}3$ V. The maximum ON/OFF ratio of the current bistability in the BOM devices was as large as $1{\times}105$. The cycling endurance tests of the ON/OFF switching exhibited a high endurance of above $1.5{\times}105$ cycles and a high ON/OFF ratio of ~105 could be achieved consistently even after quite a long retention time of more than $1{\times}106$ s.

• Journal of Korea Foundry Society
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• v.29 no.5
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• pp.187-191
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• 2009

Microstructures and shape memory characteristics of $Ti_{50}Ni_{20}Cu_{30}$ alloy strips fabricated by arc melt overflow have been investigated by means of XRD, optical microscopy and DSC. The microstructure of as-cast strips exhibited columnar grains normal to the strip surface. X-ray diffraction analysis showed that one-step martensitic transformation of B2-B19 occurred in the alloy strips. According to the DSC analysis, it was known that the martensitic transformation temperature ($M_s$) of B2 $\rightarrow$ B19 in $Ti_{50}Ni_{20}Cu_{30}$ strip is $57^{\circ}C$. During thermal cyclic deformation with the applied stress of 60 MPa, transformation hysteresis and elongation associated with the B2-B19 transformation were observed to be $3.7^{\circ}C$ and 1.6%, respectively. The as-cast strip of $Ti_{50}Ni_{20}Cu_{30}$ alloy also showed a superelasticity and its stress hysteresis was as small as 14 MPa. These mechanical properties and shape memory characteristics of the alloy strips were ascribed to B2-B19 transformation and the controlled microstructures produced by rapid solidification of the arc melt overflow process.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.45-49
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• 2022

Through Silicon Via (TSV) is a technology that interconnects chips through silicon vias. TSV technology can achieve shorter distance compared to wire bonding technology with excellent electrical characteristics. Due to this characteristic, it is currently being used in many fields that needs faster communication speed such as memory field. However, there is performance degradation issue on TSV technology due to the parasitic capacitance. To deal with this problem, in this study, the parasitic capacitance with TSV design factors is analyzed using commercial tool. TSV design factors were set in three categories: size, aspect ratio, pitch. Each factor was set by dividing the range with TSV used for memory and package. Ansys electronics desktop 2021 R2.2 Q3D was used for the simulation to acquire parasitic capacitance data. DOE analysis was performed based on the reaction surface method. As a result of the simulation, the most affected factors by the parasitic capacitance appeared in the order of size, pitch and aspect ratio. In the case of memory, each element interacted, and in the case of package, it was confirmed that size * pitch and size * aspect ratio interact, but pitch * aspect ratio does not interact.

• Journal of the Korean Society of Marine Environment & Safety
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• v.29 no.6
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• pp.543-551
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• 2023

As climate change continues to prompt an increasing demand for advancements in disaster and safety management technologies to address abnormal high water temperatures, typhoons, floods, and droughts, sea surface temperature has emerged as a pivotal factor for swiftly assessing the impacts of summer harmful algal blooms in the seas surrounding Korean Peninsula and the formation and dissipation of cold water along the East Coast of Korea. Therefore, this study sought to gauge predictive performance by leveraging statistical methods and deep learning algorithms to harness sea surface temperature data effectively for marine anomaly research. The sea surface temperature data employed in the predictions spans from 2018 to 2022 and originates from the Heuksando Tidal Observatory. Both traditional statistical ARIMA methods and advanced deep learning models, including long short-term memory (LSTM) and gated recurrent unit (GRU), were employed. Furthermore, prediction performance was evaluated using the attention LSTM technique. The technique integrated an attention mechanism into the sequence-to-sequence (s2s), further augmenting the performance of LSTM. The results showed that the attention LSTM model outperformed the other models, signifying its superior predictive performance. Additionally, fine-tuning hyperparameters can improve sea surface temperature performance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.4-4
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• 2009

Surface analysis on defective wire-bonding pads are performed in flash memory assembly. Week wire bonding may cause a significant effect on the final product reliability, and the surface condition of the aluminum bond pads is critical in terms of product reliability. To find out possible week bonding on semiconductor interconnects, ball sheer test (BST) has been performed. On some defective or week bonded pads, we have investigated the surface contents, assuming that the week bonding is induced from the surface conditions. AES and XPS are employed for the quantitative surface analysis on defective dies.