• The Journal of the Korea institute of electronic communication sciences
• /
• v.15 no.6
• /
• pp.1031-1036
• /
• 2020

Untact marketing emerged as one of the top 10 marketing in 2018. Since then, the scale of the mobile payment market has expanded, and the ratio of payment through mobile is melting into life even offline. Various mobile apps such as Samsung Pay and Smart Order are already popular systems, and various other mobile payment systems are increasing. For such mobile payments, this paper aims to comprehensively design a general-purpose untouched offline payment system by designing a mobile payment system that applies a short-range wireless communication method along with a study on the currently available mobile payment-linked API. We propose an offline payment system with an untouch method to prevent the spread of infectious diseases and contribute to a healthy society by solving the problem and minimizing contact with others in the current situation like the Corona 19 Incident.

• Design & Manufacturing
• /
• v.14 no.4
• /
• pp.71-77
• /
• 2020

Various manufacturing technologies, including over-molding and insert-injection molding, are used to produce hybrid plastics and metals. However, there are disadvantages to these technologies, as they require several steps in manufacturing and are limited to what can be reasonably achieved within the complexities of part geometry. This study aims to determine a practical approach for producing metal/plastic hybrid components by combining plastic injection molding and metal die casting to create a new hybrid metal/plastic molding process. The integrated metal/plastic hybrid injection molding process developed in this study uses the proven method of multi-component technology as a basis to combine plastic injection molding with metal die casting into one integrated process. In this study, the electrical conductivity and ampacity were verified to qualify the new process for the production of parts used in electronic devices. The electrical conductivity was measured, contacting both sides of the test sample with constant pressure, and the resistivity was measured using a micro ohmmeter. Also, the specific conductivity was subsequently calculated from the resistivity and contact surface of the conductor path. The ampacity defines the maximum amount of current a conductive path can carry before sustaining immediate or progressive deterioration. The manufactured hybrid multi-components were loaded with increasing currents, while the temperature was recorded with an infrared camera. To compare the measured infrared images, an electro-thermal simulation was conducted using commercial CAE software to predict the maximum temperature of the power loaded parts. Overall, during the injection molding process, it was demonstrated that multifunctional parts can be produced for electric and electronic applications.

• Journal of Daesoon Thought and the Religions of East Asia
• /
• v.3 no.2
• /
• pp.71-92
• /
• 2024

The world we live in is becoming more convenient thanks to the inventions of science and technology. Still, the world is also becoming more and more unpredictable with the current situation of VUCA (Volatility, Uncertainty, Complexity, Ambiguity). The Covid-19 pandemic brought the biggest global disaster ever with 774,631,444 infected people and 7,031,216 deaths (WHO on February 11, 2024) but it seems that humanity is gradually forgetting this disaster. Meanwhile the economic stimulus packages worth trillions of dollars from governments after the pandemic have further caused the world debt bubble to swell. The bubble burst scenario is something that many economic experts fear. Apparently, in the transitional period of the early decades of the 21st century, the world's economic, cultural, political, social, natural, and environmental aspects have undergone profound transformations: from the real estate and finance crises in the United States since 2008; through the melting of the Arctic ice over the past several decades; to the double disaster of the earthquake and tsunami in Japan in 2011. Especially, in the context of the world economic crisis after the COVID-19 pandemic, the human achievements of the past thousands of years are in jeopardy of being wiped out in an instant. Many people are predicting a bad scenario for a chain collapse. Facing the signals of an imminent economic catastrophe based on the appearance of "the Gray Rhino, Black Swan and White Elephant," many drawn in by Eschatological thought declare that Doomsday will occur shortly. This is the time for many other people to hope for the incoming Messiah. The Messiah is said to appear when people feel despair or suffer a great disaster because faith in the Savior can help them overcome adversity mentally. This research will find out how adherents of Buddhism view and deal with civilizational crises by examining history via symbols associated with Maitreya as based upon the Buddhist Messiah, Maitreya.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.08a
• /
• pp.348-348
• /
• 2011

Carbon nanotube (CNT) field effect transistors and sensors use CNT as a current channel, of which the resistance varies with the gate voltage or upon molecule adsorption. Since the performance of CNT devices depends very much on the CNT/metal contact resistance, the CNT/electrode contact must be stable and the contact resistance must be small. Depending on the geometry of CNT/electrode contact, it can be categorized into the end-contact, embedded-contact (top-contact), and side-contact (bottom-contact). Because of difficulties in the sample preparation, the end-contact CNT device is seldom practiced. The embedded-contact in which CNT is embedded inside the electrode is desirable due to its rigidness and the low contact resistance. Fabrication of this structure is complicated, however, because each CNT has to be located under a high-resolution microscope and then the electrode is patterned by electron beam lithography. The side-contact is done by depositing CNT electrophoretically or by precipitating on the patterned electrode. Although this contact is fragile and the contact resistance is relatively high, the side-contact by far has been widely practiced because of its simple fabrication process. Here we introduce a simple method to embed CNT inside the electrode while taking advantage of the bottom-contact process. The idea is to utilize a eutectic material as an electrode, which melts at low temperature so that CNT is not damaged while annealing to melt the electrode to embed CNT. The lowering of CNT/Au contact resistance upon annealing at mild temperature has been reported, but the electrode in these studies did not melt and CNT laid on the surface of electrode even after annealing. In our experiment, we used a eutectic Au/Al film that melts at 250$^{\circ}C$. After depositing CNT on the electrode made of an Au/Al thin film, we annealed the sample at 250$^{\circ}C$ in air to induce eutectic melting. As a result, Au-Al alloy grains formed, under which the CNT was embedded to produce a rigid and low resistance contact. The embedded CNT contact was as strong as to tolerate the ultrasonic agitation for 90 s and the current-voltage measurement indicated that the contact resistance was lowered by a factor of 4. By performing standard fabrication process on this CNT-deposited substrate to add another pair of electrodes bridged by CNT in perpendicular direction, we could fabricate a CNT cross junction. Finally, we could conclude that the eutectic alloy electrode is valid for CNT sensors by examine the detection of Au ion which is spontaneously reduced to CNT surface. The device sustatined strong washing process and maintained its detection ability.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2018.06a
• /
• pp.102-102
• /
• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Journal of The Korean Association For Science Education
• /
• v.43 no.2
• /
• pp.125-137
• /
• 2023

This study analyzed the types of knowledge building discourse and knowledge building processes in small group learning using augmented reality. Eight 8th grade students took classes using augmented reality in solubility, boiling and melting points. These classes were carried out twice and all the classes were videotaped and recorded. Every student participated in a semi-structured interview. In the types of knowledge building discourse, the proportion of knowledge sharing and knowledge construction was similar. Beneath the knowledge sharing, the proportion of introductory level discussion was higher than identifying key elements of augmented reality. Recalling existing knowledge rarely appeared. Under the knowledge construction, the proportion of advanced level discussion was the highest and the proportion of sharing and critiquing ideas at a different level and efforts to rise above current levels of explanation was similar. The introductory level discussion and identifying key elements of augmented reality were developed into efforts to rise above current levels of explanation and sharing and critiquing ideas at a different level. Visualized results of knowledge building processes showed all the students' graph drew an upward curve, though cumulative number of impact value was different by each student. As a result of the study, effective ways of improving small group learning using augmented reality are discussed.

• Economic and Environmental Geology
• /
• v.57 no.1
• /
• pp.1-15
• /
• 2024

The Melanesian region in the western Pacific is dominated by complex plate tectonics, with the largest oceanic plateau, the OntongJava plateau, and a hotspot, the Caroline Islands. To better understand the complex geodynamics of the region, we estimate P- and S-velocity models and 𝛿 (V_P/V_S) model by using relative teleseismic travel times measured at seismometers on land and the seafloor. Our results show high-velocity anomalies in the subduction zones of the Melanesian region to a depth of about 400 km, which is thought to be subducting Solomon Sea, Bismarck, and Australian plates along plate boundaries. Along subduction zones, positive 𝛿 (V_P/V_S) anomalies are found, which may be caused by partial melting due to dehydration. A broad high-velocity anomaly is observed at 600 km depth below the Ontong-Java plateau, with a negative 𝛿 (V_P/V_S) anomaly. This is thought to be a viscous and dry remnant of the Pacific plate that subducted at 45-25 Ma, with a low volume of fluids due to dehydration for a long period in the mantle transition zone. Beneath the Caroline Islands, a strong low-velocity anomaly is obseved to a depth of 800 km and appears to be connected to the underside of the remnant Pacific plate in the mantle transition zone. This suggests that the mantle plume originating in the lower mantle has been redirected due to the interaction with the remnant Pacific plate and has reached its current location. The mantle plume also has a positive 𝛿 (V_P/V_S) anomaly, which is thought to be due to the influence of embedded fluids or partial melting. A high-velocity anomaly, interpreted as an effect of the thick lithosphere beneath the Ontong-Java plateau, is observed down to 300 km depth with a negative 𝛿 (V_P/V_S) anomaly, which likely indicate that little fluid remains in the melt residue accumulated in the lithosphere.

• The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
• /
• v.5 no.4
• /
• pp.295-304
• /
• 2000

Vertical measurement of CTDT at about 30 min intervals and spatial surface temperature, salinity, and concentration of suspended particulate matters were conducted to elucidate the character of water column and the dispersal pattern in a floating ice-dominated fjord, Marian Cove, West Antarctica. Marian Cove showed two distinct water layers in terms of turbidity; 1) cold, fresh, and turbid surface plume in the upper 2 m,2) warm, saline, and relatively clean Maxwell Bay inflow between 15-45 m in water depth. Thermal melting of Maxwell Bay inflow and tidewater glacier/floating ices developed the surface mixed layer and the activity of floating ices cause Maxwell Bay inflow to be unstable. Due to the unstable water column, the development of Maxwell Bay inflow and subsequent surface plume are not influenced by tidal frequency. Coastal current generated by strong northwesterly wind may extend warm, saline, and turbid surface plume into the central part of the cove along the northern coast via the western coast of Weaver Peninsula. Terrigenous sediments of meltwaters from the glaciated ice cliffs near the corner of tidewater glacier and some coasts enter into the cove and their dispersion depends upon the hydrographic regimes (tide, wind, wave etc.). At the period of spring tide, the strong wind stress with the northwesterly wind direction reserve suspended sediment-fed surface plume and so allow the possibility of deposition of terrigenous sediments within the basin of cove.

• Journal of the Korean Recycled Construction Resources Institute
• /
• v.7 no.1
• /
• pp.60-68
• /
• 2012

In this study, the manufacturing process of micro capsulized PCM (phase changing material) for thermal storage performance of latent heat was investigated to save energy during the use of buildings: i.e. use of melamine-type resin as the micro-capsule material and paraffin wax as the inner material that are together used in concrete walls. For the manufacturing process of the micro-capsulized PCM, the amount of SDS addition as surfactant was the key variable and the resulting thermal storage performance depended on the SDS amount. With increasing amount of SDS, the micro capsulation became much easier while the capsule surface became harder. The micro capsules became uniform at an optimum SDS addition. The addition of SDS also affected the thermal capacity: with increasing SDS amount, the heat storage and release tendency at melting point was more clearly manifested. The current investigation is part of a study under progress to explore the use of PCM in concrete walls to save building maintenance cost and energy.

• Fire Science and Engineering
• /
• v.31 no.2
• /
• pp.1-8
• /
• 2017

A sandwich panel is a composite material composed of a double-sided noncombustible material and insulation core which is used in the inner, outer walls, and roof structure of a building. Despite its excellent insulation performance, light weight and excellent constructability, a flame is brought into the inside of the panel through the joint between the panels, melting the core easily and causing casualties and property damage due to the rapid spread of flame. The current Building Law provides that the combustion performance of finishing materials for buildings should be determined using a fire test on a small amount of specimen and only a product that passes the stipulated performance standard should be used. This law also provides that in the case of finishing materials used for the outer walls of buildings, only materials that secured noncombustible or quasi-noncombustible performance should be used or flame spread prevention (FSP) should be installed. The purpose of this study was to confirm the difference between the dangers of horizontal and vertical fire spread by applying FSP, which is applied to finishing materials used for the outer walls of buildings limitedly to a sandwich panel building. Therefore, the combustion behavior and effects on the sandwich panel according to the application of FSP were measured through the construction to block the spread of flame between the panels using a full scale fire according to the test method specified in ISO 13784-1 and a metallic structure. The construction of FSP on the joint between the panels delayed the spread of flame inside the panels and the flash over time was also delayed, indicating that it could become an important factor for securing the fire safety of a building constructed using complex materials.