• 제목/요약/키워드: melting behavior

검색결과 357건 처리시간 0.026초

전기로 제강분진에 함유된 금속원소의 휘발거동에 대한 속도론적 연구 (A Study on Kinetic of Volatilization Behavior of Metal Elements Contained in Electric Arc Furnace Dust)

  • 윤재홍;윤치현;이명원
    • 자원리싸이클링
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    • 제26권3호
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    • pp.17-25
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    • 2017
  • 전기로 제강분진은 고철을 전기로에서 용해하는 과정에서 발생하는 휘발성분들이 공기 중의 산소와 반응하여 산화물형태로 포집된 미세분말로써 다양한 특성을 가지고 있다. 이러한 전기로 제강분진의 효율적인 자원화를 위해서 반응속도론적 기초실험과 Pilot 규모의 생산실험을 병행하여 실시하였다. 그 결과 전기로 제강분진은 다양한 구성성분과 화합물로 구성되어 있었으며 공통적으로 Cl과 알카리 성분이 다량으로 존재함에 따라 자원화를 위한 실제 조업에 큰 악영향을 미치는 화합물의 형성이 예상된다. 휘발거동은 $1100^{\circ}C$ 영역에서 활발히 진행되고 $1250^{\circ}C$ 영역에서는 용융현상이 나타남을 확인할 수 있었다. 이러한 결과는 Pilot규모의 실증테스트의 결과로 얻은 조산화아연과 환원철의 형성거동에서도 동일한 결과를 얻었다. 이러한 결과는 전기로 제강분진의 자원화 플랜트의 설계 및 조업조건 설정에 유용한 기초자료로 활용이 기대된다.

Peroxide 개질에 따른 Nylon 12 elastomer의 특성 연구 (Peroxide Modification of Nylon 12 Elastomer)

  • 최명찬;정지연;장영욱
    • Elastomers and Composites
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    • 제48권1호
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    • pp.18-23
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    • 2013
  • 용융상태에서 nylon 12 elastomer에 소량의 dicumyl peroxide (DCP) 와 triallyl cyanuate (TAC)를 첨가하여 nylon 12 elastomer를 부분적으로 가교시켰으며, 이에 따른 nylon 12 elastomer의 기계적, 동적기계적 그리고 유변학적 특성을 tensile test, DMA, small amplitude oscillating rheometer를 이용하여 각각 알아보았다. TAC의 함량이 증가함에 따라 인장탄성률과 영률은 증가하고, 파단신율은 감소하였다. DMA 측정결과, DCP로 부분적으로 가교시킨 nylon 12 elastomer의 PTMG상의 유리전이온도는 순수한 nylon 12 elstomer에 비해 증가하였고, storage modulus는 nylon 12상의 용융온도 이상에서도 거의 일정한 값을 나타내었다. 부분적으로 가교시킴에 따른 유변학적 특성의 변화는 TAC의 함량이 증가함에 따라 solid like behavior와 shear thinning behavior가 점점 뚜렷하게 나타남을 알 수 있었다. 이로부터 nylon 12 elastomer를 용융상태에서 부분적으로 가교시킴으로써 용융가공성을 저하시키지 않으면서, 기계적 물성은 효과적으로 향상시킬 수 있었으며, 특히, nylon 12 elastomer의 사용가능 온도범위를 증가시킬 수 있었다.

X-선 투과검사를 이용한 저항 점용접부 품질평가기법 (Weld Quality Evaluation Method for the Resistance Spot Welds using X-ray Transmission Inspection)

  • 이종대;이소정;방정환;윤길상;김목순;김준기
    • Journal of Welding and Joining
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    • 제32권6호
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    • pp.1-7
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    • 2014
  • For the resistance spot welds of CR1180 and GA1180 TRIP steels, the weld quality evaluation method using the digitalized X-ray transmission imaging apparatus was investigated in comparison with the crosssectional examination method. In the case of the resistance spot welding of CR1180, three circular regions, such as WZ(white zone), GZ(grey zone) and DZ(dark zone), appeared on X-ray image and they corresponded to the diameters of indentation mark, nugget and corona bond, respectively. The variation of X-ray transmission thickness due to the thickness variation of the weld seemed to be mainly responsible for the formation of those contrasts. The X-ray image contrast formed from the variation of transmission thickness at the outer border line of DZ could also enable the inspections of the notch shape, nonuniformity of the welding pressure and spatter from its sharpness, concentricity and the normal straight line, respectively. The X-ray image of the resistance spot weld of galvannealed GA1180 TRIP steel was very similar to that of CR1180 TRIP steel except the crown shaped outer border line of DZ which was considered to be due to the melting behavior of zinc having the boiling temperature even lower than the melting temperature of steel.

주철 - 알루미늄 합금의 Hot Dip Aluminizing시 흑연 및 금속간화합물 층의 형성 거동 (Behavior of Graphite and Formation of Intermetallic Compound Layer in Hot Dip Aluminizing of Cast Iron)

  • 한광식;강용주;강문석;강성민;김진수;손광석;김동규
    • 한국주조공학회지
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    • 제31권2호
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    • pp.66-70
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    • 2011
  • Hot dip aluminizing (HDA) is widely used in industry for improving corrosion resistance of material. The formation of intermetallic compound layers during the contact between dissimilar materials at high temperature is common phenomenon. Generally, intermetallic compound layers of $Fe_2Al_5$ and $FeAl_3$ are formed at the Al alloy and Fe substrate interface. In case of cast iron, high contact angle of graphite existed in the matrix inhibits the formation of intermetallic compound layer, which carry with it the disadvantage of a reduced reaction area and mechanical properties. In present work, the process for the removal of graphite existed on the surface of specimen has been investigated. And also HDA was proceeded at $800^{\circ}C$ for 3 minutes in aluminum alloy melt. The efficiency of graphite removal was increased with the reduction of particle size in sanding process. Graphite appears to be present both in the region of melting followed by re-solidification and in the intermetallic compound layer, which could be attributed to the fact that the surface of cast iron is melted down by the formation of low melting point phase with the diffusion of Al and Si to the cast iron. Intermetallic compound layer consisted of $Fe(Al,Si)_3$ and $Fe_2Al_5Si$, the layer formed at cast iron side contained lower amount of Si.

열경화성 분석을 위한 가속열화 된 Chlorosulfonated Polyethylene의 경년특성 연구 (Study of Thermal Ageing Behavior of the Accelerated Thermally Aged Chlorosulfonated Polyethylene for Thermosetting Analysis)

  • 신용덕
    • 전기학회논문지
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    • 제66권5호
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    • pp.800-805
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    • 2017
  • The accelerated thermal ageing of CSPE (chlorosulfonated polyethylene) was carried out for 16.82, 50.45, and 84.09 days at $110^{\circ}C$, equivalent to 20, 60, and 100 years of ageing at $50^{\circ}C$ in nuclear power plants, respectively. As the accelerated thermally aged years increase, the insulation resistance and resistivity of the CSPE decrease, and the capacitance, relative permittivity and dissipation factor of those increase at the measured frequency, respectively. As the accelerated thermally aged years and the measured frequency increase, the phase degree of response voltage vs excitation voltage of the CSPE increase but the phase degree of response current vs excitation voltage decrease, respectively. As the accelerated thermally aged years increase, the apparent density, glass transition temperature and the melting temperature of the CSPE increase but the percent elongation and % crystallinity decrease, respectively. The differential temperatures of those are $0.013-0.037^{\circ}C$ and, $0.034-0.061^{\circ}C$ after the AC and DC voltages are applied to CSPE-0y and CSPE-20y, respectively; the differential temperatures of those are $0.011-0.038^{\circ}C$ and $0.002-0.028^{\circ}C$ after the AC and DC voltages are applied to CSPE-60y and CSPE-100y, respectively. The variations in temperature for the AC voltage are higher than those for the DC voltage when an AC voltage is applied to CSPE. It is found that the dielectric loss owing to the dissipation factor($tan{\delta}$) is related to the electric dipole conduction current. It is ascertained that the ionic (electron or hole) leakage current is increased by the partial separation of the branch chain of CSPE polymer as a result of thermal stress due to accelerated thermal ageing.

생분해성 지방족 폴리에스테르에 관한 연구(V) : Copolyesterethylene/LDPE 블렌드의 열적 성질 및 기계적 성질 (Study on the Biodegradable Aliphatic Polyester(V): Thermal and Mechanical Properties of Copolyesterethylene/LDPE Blend)

  • 박태욱;강혜정;김용주;이치규
    • 공업화학
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    • 제5권6호
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    • pp.1068-1077
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    • 1994
  • 생분해성 고분자의 실용화 검토를 위하여 생분해성 Copolyesterethylene(CPEE)과 LDPE를 0~100%까지 10% 간격으로 전조성에 걸쳐 용융 블렌드하였다. 각 조성에서 블렌드한 시료의 녹는점 변화, 용융 엔탈피, 결정화 온도 및 결정화 엔탈피를 시차주사열량계고 측정하여 miscibility에 관하여 고찰하였으며 만능시험기를 이용하여 인장강도 및 신장률을 측정하였다. 열분석 결과로부터 CPEE의 조성이 30%일 때까지 약간의 miscibility를 보임을 알 수 있었으며, 인장 강도값으로부터는 CPEE조성이 30~80%를 제외한 조성에서 유용한 compatibility를 갖는 것을 알았다. SEM 관찰을 통한 각 조성에서의 형태학적 모습으로부터 이들 상용성의 결과를 확인하였으며, 또한 CPEE/LDPE 블렌드 각 조성에 대한 생분해성을 미생물 접종 4주 후의 중량감소율을 측정하여 확인하였다.

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Synchrotron SAXS Study on the Micro-Phase Separation Kinetics of Segmented Block Copolymer

  • Lee, Han-Sup;Yoo, So-Ra;Seo, Seung-Won
    • Fibers and Polymers
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    • 제2권2호
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    • pp.98-107
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    • 2001
  • The phase transition behavior isothermal micro-phase separation kinetics of polyester-based thermoplastic elastomer were studied using the synchrotron X-ray scattering(SAXS) method. The structural changes occurring during heating period were investigated by determining the changes of the one-dimensional correlation function, interfacial thickness and Porod constant. Based on the abrupt increases of the domain spacing and interfacial thickness, a major structural change occurring well below the melting transition temperature is suggested. Those changes are explained in terms of melting of the thermodynamically unstable hard domains or/and the interdiffusion of the hard and soft segments in the interfacial regions. SAXS profile changes during the micro-phase separation process were also clearly observed at various temperatures and the separation rate was found to be sensitively affected by the temperature. The peak position of maximum scattering intensity stayed constant during the entire course of the phase separation process. The scattering data during the isothermal phase separation process was interpreted with the Cahn-Hilliard diffusion equation. The experimental data obtained during the early stage of the phase separation seems to satisfy the Cahn-Hilliard spinodal mechanism. The transition temperature obtained from the extrapolation of the diffusion coefficient to zero value turned out to be about 147$\pm$$2^{\circ}$, which is close to the order-disorder transition temperature obtained from the Porod analysis. The transition temperature was also estimated from the inveriant growth rate. By extrapolating the inveriant growth rate to zero, a transition temperature of about 145$\pm$$\pm$$2^{\circ}$ was obtained.

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동피복 YBCO 후막에서 $YBa_2Cu_3O_{7-x}$(Y123) 및 CuO상의 형성 기구 (The Formation of $YBa_2Cu_3O_{7-x}$(Y123) and CuO Phases in Cu-sheath YBCO Thick Films)

  • 김경진;한상철;한영희;정년호;윤희중;오제명;최희락;성태현
    • Progress in Superconductivity
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    • 제6권2호
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    • pp.129-132
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    • 2005
  • The formation behavior of $YBa_2Cu_3O_{7-x}$(Y123) and CuO phases in the heat-treated Cu-sheathed YBCO thick films was studied. The thick films were prepared by screen-printing method using $BaCO_3$ and Y211 powders on Cu tapes. The screen-printed thick films were placed at the center of the tube furnace, heated to $930^{\circ}C$ in air atmosphere and then maintained at the temperature for 60 sec - 300 sec. The microstructure and phases formed in the thick films were investigated by using optical microscope, X-ray diffraction (XRD) and SEM image analysis. During the heat treatment, partial melting occurred rapidly in the printed layers by peritectic reaction between CuO and precursor powders, and then YBCO superconducting phases nucleated from the Cu tapes and grew in a form of thick films.

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Reactive blends of poly(butylene terephthalate)/polyamide-6 with ethylene glycidyl methacrylate

  • Han, M.S.;Lim, B.H.;Jung, H. C.;Hyun, J.C.;Kim, S.R.;Kim, W.N.
    • Korea-Australia Rheology Journal
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    • 제13권4호
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    • pp.169-177
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    • 2001
  • Morphological, thermal, rheological, and mechanical properties of reactive compatabilized blends of poly(butylene terephthalate) (PBT) and Polyamide-6 (PA) containing EGMA copolymer were investigated using scanning electron microscopy (SEM), differential scanning calorimetry (DSC), advanced rheometric expansion system (ARES), and universal testing machine (UTM). From the results of thermal analysis by DSC, the melting point of the 30/70 PBT-PA blend was broadened after EGMA was added in the blends, since the enthalpy of melting of the PBT-PA somewhat decreased with the increase of EGMA content. From this result, it is suggested that the EGMA affected to the crystallization behavior and crystallinity of the PBT-PA blends. From SEM micrographs of the 70/30, 50/50, and 30/70 PBT-PA blends, the droplet size of the 30/70 PBT-PA blend was about 0.8 ${\mu}{\textrm}{m}$ which was smaller than that of the 50/50 and 70/30 PBT-PA blends. The complex viscosity of the 30/70 PBT-PA blend observed to be higher than that of the 50/50 and 70/30 PBT-PA blends. From the results of the morphology and rheological properties for the PBT-PA blends, it is suggested that the compatibility is increased in the 30/70 PBT-PA blend than the 50/50 and 70/30 PBT-PA blends. From the results of mechanical properties, it was found that the tensile strength of the 30/70 PBT-PA blend increased with the increase of EGMA up to 2 phr, while tensile strength of the blend in which EGMA content was higher than 2 phr decreased with the increase of EGMA content. From the results of morphological, thermal, rheological, and mechanical properties for the PBT-PA-EGMA blends, it is suggested that the EGMA could be used as a compatibilization role in the blends.

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Solderable 이방성 도전성 접착제를 이용한 BGA 접합공정 개발 (Development of BGA Interconnection Process Using Solderable Anisotropic Conductive Adhesives)

  • 임병승;이정일;오승훈;채종이;황민섭;김종민
    • 반도체디스플레이기술학회지
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    • 제15권4호
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    • pp.10-15
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    • 2016
  • In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.