• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1297-1305
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• 2004

Reliability of MEMS devices is receiving more attention as they are heading towards commercial production. In particular are the reliability and long-term stability of wafer level vacuum packaged MEMS gyroscope sensors subjected to cyclic mechanical stresses at high frequencies. In this study, we carried out several reliability tests such as environmental storage, fatigue, shock, and vibration, and we investigated the failure mechanisms of the anodically bonded vacuum gyroscope sensors. It was found that successful vacuum packaging could be achieved through reducing outgassing inside the cavity by deposition of titanium as well as by pre-taking process. The current gyroscope structure is found to be safe from fatigue failure for 1000 hours of operation test. The gyroscope sensor survives the drop and vibration tests without any damage, indicating robustness of the sensor. The reliability test results presented in this study demonstrate that MEMS gyroscope sensor is very close to commercialization.

• Journal of Applied Reliability
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• v.14 no.3
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• pp.169-175
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• 2014

In this paper, the evaluating test methods of the fire and the electric shock on the Electric pad using the house is proposed. We analyzed electric pad using magnetic shielded type hot wire because electric pad using the magnetic shielded type hot wire generally be used in the home. We analyzed FMEA in order to analyze the mechanism of the fire and the electric shock of the electric pad and designed testing methods (Durability tests on the environment, Mechanical durability tests, Electrical durability tests) obtained through the two-step QFD and tested. We verified the evaluating test methods of the fire and the electric shock on the Electric pad using the house through the analysis of the test results.

• Journal of the Korea Institute of Military Science and Technology
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• v.20 no.1
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• pp.98-107
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• 2017

Electric components equipped with naval shipboards must endure mechanical shock caused by various mechanical impulsive sources. Thus the components must be designed carefully and reliability test is an essential procedure before use. In this study, a new design technology applicable to a large and heavy shock generation system which can generate various specific real mechanical shocks in specified time domain was introduced. Commonly, the shock transmitted through the wall of naval shipboard consists of dual shocks. The primary shock is of a very high amplitude and very short period half-sine form. The following shock is of an exponentially decaying harmonic form of relatively longer period. Based on the different dynamic characteristics of two shocks, we proposed a sequential design procedure to determine spring and damping coefficients of the generation system. Some numerical simulation results showed the feasibility of the proposed method.

• Transactions of the Korean Society of Automotive Engineers
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• v.23 no.4
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• pp.380-387
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• 2015

Various forms of passive shock absorber have developed to supplement performance which is poorer than that of active shock absorber. It is called 'Hybrid Conventional Damper (HCD)'. Frequency sensing shock absorber that this study will cover belongs to the HCD. This study aims to demonstrate that performance of frequency sensing shock absorber is superior than that of passive shock absorber. Study process is as follows. Firstly, analysis models for both passive shock absorber and frequency sensing shock absorber are developed to secure reliability. Then, elements which cause difference of ride quality are found out through comparison of hysteresis characteristics. By comparison of frequency characteristic, furthermore, damping principle of frequency sensing shock absorber is understood. Also, it determines if the absorber performs well even though maximum excitation speed is changed. Finally, the study proves that performance of frequency sensing shock absorber is superior than that of passive shock absorber after comparing change of damping power in excitation condition that various frequencies are mixed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.489-493
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• 2005

TFT-LCD(Thin Film Transistor Liquid Crystal Display) module is representative commercial product of FPD(Flat Panel Display). Thickness of TFT-LCD module is very thin. It is adopted for major display unit for IT devices such as Cellular Phone, Camcorder, Digital camera and etc. Due to the harsh user environment of mobile IT devices, it requires complicated structure and tight assembly. And user requirements for the mechanical functionalities of TFT-LCD module become more strict. However, TFT-LCD module is normally weak to high level transient mechanical shock. Since it uses thin crystallized panel. Therefore, anti-shock performance is classified as one of the most important design specifications. Traditionally, the product reliability against mechanical shock is confirmed by empirical method in the design-prototype-drop/impact testredesign paradigm. The method is time-consuming and expensive process. It lacks scientific insight and quantitative evaluation. In this article, a systematic design evaluation of TFT-LCD module for mobile IT devices is presented with combinations of FEA and testing to support the optimal shock proof display design procedure.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.7 s.184
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• pp.130-137
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• 2006

TFT-LCD(Thin Film Transistor Liquid Crystal Display) module is representative commercial product of FPD(Flat Panel Display). Thickness of TFT-LCD module is very thin. It is adopted for major display unit for IT devices such as Cellular Phone, Camcorder, Digital camera and etc. Due to the harsh user environment of mobile IT devices, it requires complicated structure and tight assembly. And user requirements for the mechanical functionalities of TFT-LCD module become more strict. However, TFT-LCD module is normally weak to high level transient mechanical shock. Since it uses thin crystallized panel. Therefore, anti-shock performance is classified as one of the most important design specifications. Traditionally, the product reliability against mechanical shock is confirmed by empirical method in the design-prototype-drop/impact test-redesign paradigm. The method is time-consuming and expensive process. It lacks scientific insight and quantitative evaluation. In this article, a systematic design evaluation of TFT-LCD module for mobile IT devices is presented with combinations of FEA and testing to support the optimal shock proof display design procedure.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.15-20
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• 2017

In this paper, two types of assemblies using CNT-filled SACAs (with 0.03 wt% CNTs and without CNT) were prepared to investigate the influence of carbon nanotubes (CNTs) on the reliability properties of solderable anisotropic conductive adhesives (SACAs) with a low-melting-point alloy (LMPA). Two types of reliability test including thermal shock (TS: -55 to $125^{\circ}C$, 1000 cycles) and high-temperature and high-humidity (HTHH: $85^{\circ}C$, 85% RH, 1000 h) tests were conducted. The SACA assemblies with and without CNTs showed stable electrical reliability properties due to the formation of wide and stable metallurgical interconnection between corresponding metallizations by the molten LMPA fillers. Although the mechanical pull strength of CNT-filled SACA assemblies was decreased after thermal aging (because of the excessive layer growth and planarization of the IMCs), the CNT-filled SACA with 0.03wt% CNTs showed enhanced mechanical reliability properties compared with the SACA assemblies no CNTs. This enhancement in mechanical performance was due to the reinforcement effect of the CNTs. These results demonstrate that CNTs within the CNT-filled SACAs can improve the reliability properties of CNT-filled SACAs joints due to their superior physical properties.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1538-1541
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• 2005

For reliability evaluation of AC-PDP, one of the most important factor is sealing property. In this paper, the reliability evaluation test method of the commercialized sealing glass frit in AC-PDP was studied. 6 inch AC-PDP panels were tested for evaluation of sealing glass frit by vibration shock test, thermal shock test, non -destructive X-ray inspection, residual stress inspection and residual gas detection. These test methods are proposed as a standard for testing the reliability of sealing glass frit. The main failure mode of sealing glass frit in AC-PDP seems to be the crack propagation from thermal cycling rather than mechanical factor.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.53-57
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• 2013

Although the lowering of Ag content in Sn-3.0Ag-0.5Cu is known to improve the mechanical shock reliability of the solder joint, it is also known to be detrimental to the solderbility. In this study, the quaternary alloying effect of In and the minor alloying effects of Mn and Pd on the solderability, thermal cycling and mechanical shock reliabilities of the low Ag content Sn-1.2Ag-0.7Cu solder were investigated using board-level BGA packages. The solderability of Sn-1.2Ag-0.7Cu-0.4In was proved to be comparable to that of Sn-3.0Ag-0.5Cu but its thermal cycling reliability was inferior to that of Sn-3.0Ag-0.5Cu. While the 0.03 wt% Pd addition to the Sn-1.2Ag-0.7Cu-0.4In decreased the solderability and reliabilities of solder joint, the 0.1 wt% Mn addition was proved to be beneficial especially for the mechanical shock reliability compared to those of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu compositions. It was considered to be due that the Mn addition decreased the Young's modulus of low Ag content Pb-free solders.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.12
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• pp.76-81
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• 2000

Analysis on failure of the panel glass under mechanical shock is the main topic of this study. Since the glass for the LCD panel is thin, it needs to be designed to have enough toughness against mechanical shock. In this paper, a process of estimating fracture of the panel glass is proposed to guarantee reliability of the product. The fracture toughness of the panel glass is used as a criterion of the fracture based on an experimental approach. The stress intensity factor was calculated considering a model with the largest initial crack size on a cut surface and with the boundary force obtained from a dynamic finite element analysis. Critical surface roughness on the cut surface of a typical glass panel, to prevent fracture in case of bending mode, is obtained.