• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11a
• /
• pp.171-175
• /
• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics and metal, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter level dielectrics and metal. Especially, defects like (micro-scratch) lead to severe circuit failure, and affects yield. Current conditioning method - bladder type, orbital pad motion - usually provides unsuitable pad profile during ex-situ conditioning near the end of pad life. Since much of the pad wear occurs by the mechanism of bladder tripe conditioning and its orbital motion without rotation, we need to implement new ex-situ conditioner which can prevent abnormal regional force on pad caused by bladder-type and also need to rotate the pad during conditioning. Another important study of ADPC is related to the orbital scratch of which source is assumed as diamond grit dropped from the strip during ex-situ conditioning. Scratch from diamond grit damaged wafer severely so usual1y scraped. Figure 1 shows the typical shape of scratch damaged from diamond. We suspected that intensive forces to the edge area of bladder type stripper accelerated the drop of Diamond grit during conditioning, so new designed Flat stripper was introduced.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.05c
• /
• pp.166-169
• /
• 2003

In this study, we evaluated the characteristics by the addition of 3 different kinds of nonionic surfactant to improve the dispersion stability of slurries. Slurry stability is an issue in any industry in which settling of particles can result in poor performance. So we observed the variation of particle size and settling rate when the concentration and addition time of surfactant are changed. When the surfactant is added after milling process, the particle size and pH became low. It is supposed that the particle agglomeration was disturbed by adsorption of surfactant on alumina abrasive. The settling rate was relatively stable when nonionic surfactant is added about 0.1~1.0 wt%. When molecular weight(MW) is too small like Brij 35, it was appeared low effect on dispersion stability. Because it can't prevent coagulation and subsequent settling with too small MW. The proper quality of MW for slurry stability was presented about 500,000. Consequently, the addition of nonionic surfactant to alumina slurry has been shown to have very good effect on slurry stabilization. If we apply this results to copper CMP process, it is thought that we will be able to obtain better yield.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.11a
• /
• pp.527-527
• /
• 2007

CMP가 1980년 IBM에 의해 반도체 웨이퍼의 표면 연마를 위해 적용된 후, 많은 연구 개발의 노력으로 반도체 집적회로의 제조 공정에서 필수 핵심기술이 되었으나, 소모자재(연마패드, 탄성지지대, 슬러리, 패드 컨디셔너)의 비용이 CMP 공정 비용의 70% 이상을 차지하는 등 제조단가가 높다는 단점을 극복할 수가 없었다. 특히, 고가의 슬러리가 차지하는 비중이 40% 이상을 넘고 있어, 슬러리 원액의 소모량을 줄이기 위한 연구들이 현재 활발히 연구 중이다. 슬러리의 변수로는 연마입자의 종류 및 특성, 용액의 pH, 연마입자의 슬러리내 안정성 등이 있다. 슬러리내 연마입자는 연마량과 균일도 측면에서 밀접한 관계를 가지고 있다. 또한, 연마제의 영향에 따라 연마율의 차이 즉, CMP 특성의 변화를 보이고 있기 때문에 투입량 또한 최적화가 필요하다. 본 연구에서는 새로운 연마제의 특성을 알아보기 위해 탈이온수(de-ionized water; DIW)에 $CeO_2,\;MnO_2,\;ZrO_2$ 등을 첨가한 후 분산시간에 따른 연마 특성과 atomic force microscopy (AFM)분석을 통해 표면 거칠기를 비교 분석하였다. 그리고, 세 가지 종류의 연마제를 각각 1wt%, 3wt%, 5wt% 첨가하여 산화막에 대한 CMP 특성을 알아본 후, scanning electron microscopy (SEM) 측정과 입도 분석을 통해 그 가능성을 알아보았다.

• Journal of the Korean Society of Industry Convergence
• /
• v.23 no.6_2
• /
• pp.1051-1058
• /
• 2020

The chemical mechanical planarization (CMP) is a process of physically and chemically polishing the semiconductor substrate. The planarization quality of a substrate can be evaluated by the within wafer non-uniformity (WIWNU). In order to improve WIWNU, it is important to manage the pad profile. In this study, a device capable of non-contact measurement of the pad thickness profile was developed. From the measured pad profile, the profile of the pad surface and the groove was extracted using the envelope function, and the pad thickness profile was derived using the difference between each profile. Thickness profiles of various CMP pads were measured using the developed PMS and envelope function. In the case of IC series pads, regardless of the pad wear amount, the envelopes closely follow the pad surface and grooves, making it easy to calculate the pad thickness profile. In the case of the H80 series pad, the pad thickness profile was easy to derive because the pad with a small wear amount did not reveal deep pores on the pad surface. However, the pad with a large wear amount make errors in the lower envelope profile, because there are pores deeper than the grooves. By removing these deep pores through filtering, the pad flatness could be clearly confirmed. Through the developed PMS and the pad thickness profile calculation method using the envelope function, the pad life, the amount of wear and the pad flatness can be easily derived and used for various pad analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2010.06a
• /
• pp.375-375
• /
• 2010

CdTe as an absorber material is widely used in thin film solar cells with the heterostructure due to its almost ideal band gap energy of 1.45 eV, high photovoltaic conversion efficiency, low cost and stable performance. The deposition methods and preparation conditions for the fabrication of CdTe are very important for the achievement of high solar cell conversion efficiency. There are some rearranged reports about the deposition methods available for the preparation of CdTe thin films such as close spaced sublimation (CSS), physical vapor deposition (PVD), vacuum evaporation, vapor transport deposition (VTD), closed space vapor transport, electrodeposition, screen printing, spray pyrolysis, metalorganic chemical vapor deposition (MOCVD), and RF sputtering. The RF sputtering method for the preparation of CdTe thin films has important advantages in that the thin films can be prepared at low growth temperatures with large-area deposition suitable for mass-production. The authors reported that the optical and electrical properties of CdTe thin film were closely connected by the thickness-uniformity of the film in the previous study [1], which means that the better optical absorbance and the higher carrier concentration could be obtained in the better condition of thickness-uniformity for CdTe thin film. The thickness-uniformity could be controlled and improved by the some process parameters such as vacuum level and RF power in the sputtering process of CdTe thin films. However, there is a limitation to improve the thickness-uniformity only in the preparation process [1]. So it is necessary to introduce the external or additional method for improving the thickness-uniformity of CdTe thin film because the cell size of thin film solar cell will be enlarged. Therefore, the authors firstly applied the chemical mechanical polishing (CMP) process to improving the thickness-uniformity of CdTe thin films with a G&P POLI-450 CMP polisher [2]. CMP process is the most important process in semiconductor manufacturing processes in order to planarize the surface of the wafer even over 300 mm and to form the copper interconnects with damascene process. Some important CMP characteristics for CdTe were obtained including removal rate (RR), WIWNU%, RMS roughness, and peak-to-valley roughness [2]. With these important results, the CMP process for CdTe thin films was performed to improve the thickness-uniformity of the sputtering-deposited CdTe thin film which had the worst two thickness-uniformities of them. Some optical properties including optical transmittance and absorbance of the CdTe thin films were measured by using a UV-Visible spectrophotometer (Varian Techtron, Cary500scan) in the range of 400 - 800 nm. After CMP process, the thickness-uniformities became better than that of the best condition in the previous sputtering process of CdTe thin films. Consequently, the optical properties were directly affected by the thickness-uniformity of CdTe thin film. The absorbance of CdTe thin films was improved although the thickness of CdTe thin film was not changed.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.1
• /
• pp.39-46
• /
• 2021

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.

• Journal of dental hygiene science
• /
• v.17 no.4
• /
• pp.358-367
• /
• 2017

The purpose of this study was to evaluate the influence of water infiltration and flexural strength changes in dental porcelain with glazing treatment. The block specimens were prepared as experimental materials, using feldspar type commercial dental porcelain; then, these were fired at $940^{\circ}C$ for 1 minute. The fired specimens were polished with a dimension of $40{\times}5.5{\times}5mm$. The specimens were distributed to two experimental groups: with and without glazing treatment specimens (n=5), and they were immersed in a solution of pH 7 for 3, 7, and 20 days at $40^{\circ}C$ after fabrication. To evaluate the flexural strength changes with water infiltration treatment in specimens with and without glazing, the 3-point flexural test was performed, using a universal testing machine until failure occurred. Starting powder and fired specimens consisted of amorphous and leucite crystalline phase. The Vickers hardness of fired specimens was more than 1.6 times higher than that of the enamel of natural teeth. According to porosimeter results, the specimens without glazing treatment exhibited a porosity of about 14.7%, whereas the glazed specimens exhibited the lowest porosity at about 1.1%. The average flexural strength of glazed specimens was higher than the flexural strength of specimens without glazing treatment (p<0.05). The flexural strength of all specimens with and without glazing treatment deteriorated with accelerated aging in the solution. In addition, significant differences between these two treatment groups were observed in all of the specimens treated at various water infiltration periods (p<0.05). The exposure of internal pores and micro-cracks in the surface due to polishing of the fired specimens influenced mechanical behaviors. Especially, the flexural strength in specimens without glazing treatment has shown significant degradation with the infiltration of water. Therefore, this study suggests that glazing processes can improve mechanical properties of dental porcelain.

• Korean Chemical Engineering Research
• /
• v.51 no.5
• /
• pp.622-627
• /
• 2013

Colloidal silica is used in various industrial products such as chemical mechanical polishing slurry for planarization of silicon and sapphire wafer, organic-inorganic hybrid coatings, binder of investment casting, etc. An accurate determination of particle size and dispersion stability of silica sol is demanded because it has a strong influence on surface of wafer, film of coatings or bulks having mechanical, chemical and optical properties. The study herein is discussed on the effect of measurement results of average particle size, sol viscosity and electrophoretic mobility of particle according to the volume fraction of eight types of silica sol with different size and surface properties of silica particles which are presented by the manufacturer. The measured particle size and the mobility of these sol were changed by volume fraction or particle size due to highly active surface of silica particle and change of concentration of counter ion by dilution of silica sol. While in case the measured sizes of small particles less than 60 nm are increased with increasing volume fraction, the measured sizes of larger particles than 60 nm are slightly decreased. The mobility of small particle such as 12 nm are decreased with increase of viscosity. However, the mobility of 100 nm particles under 0.048 volume fraction are increased with increasing volume fraction and then decreased over higher volume fraction.

• Journal of IKEEE
• /
• v.12 no.3
• /
• pp.131-137
• /
• 2008

A silicon Fabry-Perot tunable thermo-optic filter for WDM using the thin film silicon coating is proposed and experimented. The filter is implemented by using the CMP process and polishing both sides of the commercial silicon wafer with normal thickness of 100${\mu}m{\pm}$1%. The filter also has 2-layer or 3-layer dielectrics thin film coating mirror which are alternated ${\lambda}$/4 layers of $SiO_2$($n_{low}$=1.44) and a-Si($n_{high}$=3.48) for the central wavelength of 1550nm by RF sputtering. The experiment shows that FSR is 3.61nm and FWHM is 0.56nm and the finesse is 6.4 for 2-layer mirror with the reflection of 61%, and that FSR is 3.36nm and FWHM is 0.13nm and the finesse is 25.5 for 3-layer mirror with the reflection of 89%. According to thermo-optic effect, the transmitted central wavelength of 1549.73nm at $23^{\circ}C$ is shifted to 1550.91nm at $30^{\circ}C$ and 1553.46nm at $60^{\circ}C$ for 2-layer mirror, and the transmitted central wavelength of 1549.83nm at $23^{\circ}C$ is shifted to 1550.92nm at $30^{\circ}C$ and 1553.07nm at $60^{\circ}C$ for 3-layer mirror.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.18 no.9
• /
• pp.244-250
• /
• 2017

The most important aspect determining the completeness of aprosthesis is itsmarginal and internal fit. Alloysare processed using a softening/hardening heat treatment methodin order to improve their mechanical, physical properties and polishing properties. To examinehow the heat treatment method affects the marginal and internal fit of the Ni-Cr alloy core,thirty dental stone models of the abutment of the mandibular left molar were manufactured.The Ni-Cr alloy coreswere manufactured by the dipping method for the experiment and dividedinto three groups; A for no heat treatment, B for softening heat treatment and C for hardening heat treatment. The marginal and internal fitsof all of the groups were measured by the silicone replica technique. A statistical analysis was performed using one-way ANOVA(${\alpha}=0.05$) in order to examine whether there is a significant difference in the average values of the marginal and internal fits among the three groups and it was found that themarginal fits (1, 6) were significantly different (p<0.05), but the internal fits (2, 3, 4, 5) were not significantly different (p>0.05). These results show that Ni-Cr alloys should not be processed bythe heat treatmentmethod.However, they need to be confirmed in further clinical application studies.