• Title/Summary/Keyword: mechanical grinding

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A Study on the Surface Grinding Characteristic of Engineering Cramics (엔지니어링 세라믹스의 평면 연삭 가공 특성에 관한 연구)

  • Kang, J.H.;Heo, S.J.;Kim, W.L.
    • Transactions of the Korean Society of Automotive Engineers
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    • v.2 no.6
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    • pp.38-49
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    • 1994
  • In this study, grindability of some representative engineering ceramics are experimentally investigated using resin bond diamond wheel with conventional surface grinding machine, and proper grinding conditions which can be obtained from various experimental results are established also for mechanical components which are proper to domestic circumstances with high reliability. And through the results of experiment, it is confirmed that grinding energies of the ceramics, especially in the case of $Al_2O_3$, are lower than steel with same machining condition in the conventional grinding because of their fine-brittle fracture mode type removal process, though the ceramics are well-known to unmachinable materials. And moreover, the total pass numbers needed for spark-out process to be completed are depend on their mechanical properties because that grinding stiffness is different from each other. The grinding force, ginding power and ground surface roughness are also measured and compared. Furthermore, the experiments carried out in this study, some useful results are obtained with can guide to grind engineering ceramics with conventional surface grinding machine.

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A Study on the Optimization of Grinding Energy Density for a Non-linear Grinding System with Dual Time Delay (이중 시간지연을 가지는 비선형 연삭기의 가공 에너지 밀도 최적화 연구)

  • Jung, Jeehyun;Kim, Pilkee;Lee, Jung-In;Lee, Sooyoung;Lee, Jong-Hang;Kim, Kyung-Dong;Seok, Jongwon
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.5
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    • pp.493-498
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    • 2013
  • The present study treats the optimization process for a non-linear grinding system with dual time delay, mainly from the energetic viewpoint. To this end, the stability of the grinding system is investigated first with regard to the grinding wheel rotation speed. The concept of grinding energy density is newly proposed as the primary figure of merit and this quantity is evaluated at various stable and limit cycle conditions. The computational results show that simple monotonic trend in energy density is observed under stable conditions, whilst rather complicated behaviors can appear when the conditions are associated with limit cycle oscillations. Finally, the relations between the vibration amplitude and the energy density and their implications on the engineering decision/compromise are discussed.

Slope Change of Surface Texturing Pattern Using Grinding (연삭을 이용한 Surface Texturing에서 패턴의 기울기 변화)

  • Jeong, Ji-Yong;Zhen, Yu;Ullah, Sahar M. Sana;Ko, TaeJo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.15 no.4
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    • pp.8-15
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    • 2016
  • Most machines lose a lot of energy due to friction. Wear due to friction also reduces performance. Therefore, it is important to reduce friction on the surface to improve energy efficiency and decrease wear. Surface texturing refers to making patterns on the surface for reducing friction. There are many surface texturing methods, such as using lasers, abrasive jet machining, and so on. Recently, mechanical manufacturing methods, such as cutting and grinding, have been highlighted. Among them, the grinding method has the advantage of making patterns in large areas quickly. Therefore, it is appropriate for surface texturing on large machines. This paper is a study on the slope change of the surface texturing pattern using grinding. Therefore, we researched the slopes of the patterns corresponding to "spindle speed and feed rate" and "curvature of workpiece surface" using a mathematical model and experiment. As a result, we made a proper mathematical model concerning our research. Therefore, using the mathematical model in this paper, we could predict the slope change of the pattern according to grinding conditions.

Detection Technique of Fault Phenomena Using Power Parameters in Grinding Process

  • Kwak, Jae-Seob;Ha, Man-Kyung
    • International Journal of Precision Engineering and Manufacturing
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    • v.3 no.1
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    • pp.5-12
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    • 2002
  • The grinding process has been mainly used fur finishing metal products as final machining stage. But chatter vibration and bum of a workpiece have a bad effect on the machined surface and should be detected in modern grinding process. This paper deals with a fault detection of the cylindrical plunge grinding process by power parameters. During the grinding process the power signals of an induced motor were sampled and used to determine the relationship between fault and change of power parameters. A neural network was used far detecting the grinding fault and an influence of power parameters to the grinding fault was analyzed.

A Study on High Efficiency Dressing of Diamond Grinding Wheel (다이야몬드 숫돌의 고능률 Dressing 에 관한 연구)

  • Choi, Kyoung-Il;Kang, Jae-Hoon;Jung, Yoon-Gyo
    • Journal of the Korean Society for Precision Engineering
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    • v.8 no.2
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    • pp.106-113
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    • 1991
  • A diamond grinding wheel is generally used to grind hard and brittle materials, such as advanced ceramics. It is, however, quite difficult to dress a diamond grinding wheel efficiently because of its high degree of hardness. In this study, some investigations are carried out to increase dressing efficiecy of resinoid bonded diamond grinding wheel. Dressing forces are measured over a wide range of dressing conditions, and SEM observation of a grinding wheel is carried out. Special attention is paid to comparison between stick method and rotary brake method. Results obtained in this study provide useful information determining reguired dressing time, and for choosing efficient dressing condition for diamond grinding wheel.

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A Study on the Improvement of Physical Properties for Titanium Alloy by the Grinding Conditions (연삭가공조건에 따른 티타늄 합금의 물성치 향상에 관한 연구)

  • Kim, Won Il;Lee, Yun Kyung;Wang, Duck Hyun;Heo, Soon
    • Journal of the Korean Society of Industry Convergence
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    • v.4 no.3
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    • pp.237-242
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    • 2001
  • Ti-6Al-4V alloy can be obtained the stability of organization and product treasure, the evaluation of the cutting ability and the mechanical characteristics after the heat treatment of annealing, solution and aging. The difficulty in machining titanium alloy is how treat the heat generated during the process. Because the heat conductivity of titanium alloy is regardfully low, the heat generated during grinding is accumulated in workpiece. and it causes the increasing of grinding wheel grits' wear and makes the ground surface rough. So, these characteristics in grinding of titanium alloy will change the mechanical properties of the titanium alloy. From this study. the mechanical characteristics of annealed one and solution and aging one treated Ti-6Al-4V alloy after grinding was concerned with checking out the bending strength and hardness. For the result, both of bending strength and hardness were increased at the burned area on the surface. Roughness value was remarkably high at the table speed of 10m/min.

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Study on the Teeth Grinding Condition of SCM415H Gears (SCM 415H 기어의 치면 연삭조건에 관한 연구)

  • Kim, Lae-sung;Kim, Jongmin;Choi, Chang;Liang, Longjun;Lyu, Sung-ki
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.14 no.2
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    • pp.19-24
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    • 2015
  • Gears are produced through a variety of methods. In general, a metal piece is formed into the general shape of a gear through rough cuts. The gear then moves on to a more precise machine that removes more material. Grinders work via abrasion, rubbing a rough surface against a work piece at such high speeds that it literally scrapes unwanted material away from the item. Since the grinder is spinning so fast, the material is removed very quickly. This allows a grinder to remove a very small amount without taking any unwanted material with it. This study investigates the effect of grinding process parameters like grinding spindle speed and table transfer speed on the gear grade and grinding efficiency.

Effect of Free Abrasives on Material Removal in Lap Grinding of Sapphire Substrate

  • Seo, Junyoung;Kim, Taekyoung;Lee, Hyunseop
    • Tribology and Lubricants
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    • v.34 no.6
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    • pp.209-216
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    • 2018
  • Sapphire is a substrate material that is widely used in optical and electronic devices. However, the processing of sapphire into a substrate takes a long time owing to its high hardness and chemical inertness. In order to process the sapphire ingot into a substrate, ingot growth, multiwire sawing, lapping, and polishing are required. The lap grinding process using pellets is known as one of the ways to improve the efficiency of sapphire substrate processing. The lap grinding process ensures high processing efficiency while utilizing two-body abrasion, unlike the lapping process which utilizes three-body abrasion by particles. However, the lap grinding process has a high material removal rate (MRR), while its weakness is in obtaining the required surface roughness for the final polishing process. In this study, we examine the effects of free abrasives in lap grinding on the material removal characteristics of sapphire substrate. Before conducting the lap grinding experiments, it was confirmed that the addition of free abrasives changed the friction force through the pin-on-disk wear test. The MRR and roughness reduction rate are experimentally studied to verify the effects of free abrasive concentration on deionized water. The addition of free abrasives (colloidal silica) in the lap grinding process can improve surface roughness by three-body abrasion along with two-body abrasion by diamond grits.

A Study on the Machining Characteristics of CVD-SiC (CVD-SiC 소재의 가공 특성에 관한 연구)

  • Park, Hwi-Keun;Lee, Won-Seok;Kang, Dong-Won;Park, In-Seung;Lee, Jong-Chan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.16 no.5
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    • pp.40-46
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    • 2017
  • A plasma gas control apparatus for semiconductor plasma etching processes securely holds a cathode for forming a plasma, confines the plasma during the plasma etching process, and discharges gas after etching. It is a key part of the etching process. With the advancement of semiconductor technology, there is increasing interest in parts for semiconductor manufacturing that directly affect wafers. Accordingly, in order to replace the plasma gas control device with a CVD-SiC material superior in mechanical properties to existing SiCs (Sintered-SiC, RB-SiC), a study on the grinding characteristics of CVD-SiC was carried out. It is confirmed that the optimal grinding condition was obtained when the result table feed rate was 2 m/min and the infeed depth was $5{\mu}m$.

Model Development of Flexible Disk Grinding Process

  • Yoo, Song-Min;Choi, Myung-Jin;Kim, Young-Jin
    • Journal of Mechanical Science and Technology
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    • v.14 no.10
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    • pp.1114-1121
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    • 2000
  • A flexible disk grinding process model was developed based on the dynamic relationship proposed by Kurfess and the influence of the major system parameters which potentially affect the grinding process was studied. Due to the process complexities, several new parameters were assumed to be kinematically dependent on the geometric layouts of the process. Different process stages had been defined depending on the kinematic relationships between the grinding disk and workpiece. A trend of depth of cut was simulated using the proposed model and compared with the empirically measured data in two dimensions. Due to a poor prediction capability of the first model, a modified model was proposed and a better performance has been proved to reveal a closer description of processed surface quality. Also a deflection length has been verified using a different analytical approach.

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