• Korean Journal of Materials Research
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• v.29 no.4
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• pp.264-270
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• 2019

As a case study on aspect ratio behavior, Kaolin, zeolite, $TiO_2$, pozzolan and diatomaceous earth minerals are investigated using wet milling with 0.3 pai media. The grinding process using small media of 0.3 pai is suitable for current work processing applications. Primary particles with average particle size distribution D50, ${\sim}6{\mu}m$ are shifted to submicron size, D50 ${\sim}0.6{\mu}m$, after grinding. Grinding of particles is characterized by various size parameters such as sphericity as geometric shape, equivalent diameter, and average particle size distribution. Herein, we systematically provide an overview of factors affecting the primary particle size reduction. Energy consumption for grinding is determined using classical grinding laws, including Rittinger's and Kick's laws. Submicron size is obtained at maximum frictional shear stress. Alterations in properties of wettability, heat resistance, thermal conductivity, and adhesion increase with increasing particle surface area. In the comparison of the aspect ratio of the submicron powder, the air heat conductivity and the total heat release amount increase 68 % and 2 times, respectively.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.48 no.2
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• pp.68-74
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• 2016

Nanofibrillated cellulose (NFC) was prepared from cotton linter after electron beam irradiation to investigate its effects on the manufacturing efficiency of the NFC preparation and the property changes by the treatment. Mechanical device (Super Masscolloider) was used to prepare the NFC and its passing frequency for each NFC preparation was recorded. More electron beam irradiation resulted in less passing frequency. Alpha cellulose content, molecular weight, crystallinity index, and thermal decomposition behavior of each treatment were lowered by electron beam treatment (10 and 100 kGy) and grinding process. NFC films were prepared to investigate their mechanical properties. There were little changes in tensile properties of the NFC films.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.684-685
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• 2006

In the present study, the powder metallurgical fabrication of $Bi_{0.4}Te_3Sb_{1.6}$ thermoelectric materials has been studied with specific interest to control the microstructure by the mechanical grinding process. The $Bi_{0.4}Te_3Sb_{1.6}$ thermoelectric powders with a various particle size distribution were prepared by the combination of the mechanical milling and blending processes. The specific electric resistivity of the $Bi_{0.4}Te_3Sb_{1.6}$ sintered bodies mainly depended on the orientation of the crystal structure rather than the particle size of the raw powders.

• Korean Journal of Food Science and Technology
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• v.34 no.5
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• pp.931-934
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• 2002

To establish the optimal conditions for increasing oil yields from grape seed, extraction solvent, extraction time, and temperature were examined. Using grinding, grinding and roasting, grinding and steaming, and grinding, roasting, and steaming methods. Pressing extraction method resulted in 34.0% oil yield. Grinding and roasting, grinding and steaming, and grinding, roasting, and steaming gave 64.3, 63.0, and 65.6% yield, respectively. Ether solvent treatment resulted in 77.4 and 80.9% recoveries after 24 and 48 h static, respectively. The results of sensory evaluation revealed, oils extracted under optimal condition showed the best flavor, aroma, and whor, followed by grinding, grinding and roasting, grinding, roasting, and steaming, and grinding and steaming. Taking these results together, the optimal methods for oils extraction from grape seed were as follows: grape seed ${\rightarrow}$ washing ${\rightarrow}$ drying ${\rightarrow}$ roasting ($95{\sim}100^{\circ}C$ for 20 min) ${\rightarrow}$ cooling (room temperature) grinding ${\rightarrow}$ (0.5 mm>) ${\rightarrow}$ steaming ($0.8{\sim}0.9\;kg{\cdot}f/cm^2$ for 10 min) ${\rightarrow}$ pressing ($1st\;400\;kg/cm^2\;for\;2{\sim}3\;min,\;2^{nd}\;550{\sim}600\;/cm^2$ for 10 min, $3^{rd}\;700kg/cm^2$ for 60 min) ${\rightarrow}$ oils (yield $;85{\sim}90%$).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.23 no.7 s.166
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• pp.1173-1181
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• 1999

In X-ray stress measurements for uni-directionally deformed surfaces such as grinding, a strongly curved $sin^2{\Psi} diagram, so called $\Psi-splitter, has been observed recently. It has been known that this is caused by the residual shear stress induced in the deformed layer by external forces. In this case it is necessary to consider this enough for ceramics and composite materials with tri-axial stress analysis. However, sufficient studies have not been done about the tri-axial stress analysis of the macro stress and micro. stress on each phase of the composite materials. The result of obtaining is as follows. 1. $\Psi-splitter does not appear in the vertical direction though $\Psi-splitter appears in grinding direction in WC-Co cemented carbides. The reversal of $\Psi-splitter to each phase does not appear. 2. $\Psi-splitter caused in WC-Co cemented carbides has a close relation in dislocation which accumulates in WC phase and phase transformation caused in Co phase. 3. The residual stress on the surface of grinding of each phase is in the state of the compression stress.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.6
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• pp.1533-1541
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• 1990

Cubic boron nitride (CBN) is known the second hardest material followed diamond and was provided industry as an abrasive grain in the late 1960's. Since the introduction of CBN, a large amount of research has been carried out to determine the best application condition for grinding operation. Despite the advantages in its characteristics, CBN has not yet gained full acceptance as more excellent abrasive grain than traditional one. The reason for this state is that the surface roughness ground by CBN is worse than by traditional one and dressing and truing is very difficult. This led user's resistance to the use of CBN as an abrasive grain. Present study is to investigate the cause of lower surface roughness ground by CBN single crystal abrasive grain comparing with traditional one.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.8 s.227
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• pp.1221-1228
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• 2004

The vertical roller mill is the important machine grinding and mixing various crude materials in the manufacturing process of portland cement. Table liner is one of grinding elements of vertical roller mill and is subjected to the cyclic bending stress by rollers load and the centrifugal force by rotation of table. It demands $4{\times}10^7$ cycle but has $4{\times}10^6{\sim}8{\times}10^6$ cycle. It fractures at the edge of grinding path of outside roller. The repair expense for it amounts to $30\%$ of total maintenance of vertical roller mill. Therefore, this study shows the fracture mechanism of table liner for vertical roller mill using HDM and fatigue analysis and makes the estimation for safety of vertical roller mill.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.22-27
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• 2010

The usage of ultra-precision machining is increasing by the manufacturing of precision optical elements such as camera lens, laser printer, CD player, DVD and microscope parts etc.. The WC alloy material is in wide use by mold core to improve the productivity and accuracy in manufacturing those precision parts. The WC alloy mould core can be machined effectively by the parallel grinding process which is an excellent technique for manufacturing of surface profile hard to machining materials such as the hardened metal alloy, Ceramics, Glass and so on. Magnetic assisted polishing as a final polishing process has also been utilized to obtain ultra-precision mirror surface with the elimination of traces presented on ground surface. It is able to deduce the optimal ultra-precision machining conditions of the WC alloy material from the experiment and analyses results.

• Journal of Applied Reliability
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• v.16 no.1
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• pp.26-31
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• 2016

Purpose: The purpose of this study was to investigate the effect of grinding process and thickness on the fracture strength of silicon die used for semiconductor substrate. Method: Silicon wafers with different thickness from $200{\mu}m$ to $50{\mu}m$ were prepared by chemical mechanical polishing (CMP) and dicing before grinding (DBG) process, respectively. Fracture load was measured by point load test for 50 silicon dies per each wafer. Results: Fracture strength at the center area was lower than that at the edge area of the wafer fabricated by DBG process, while random distribution of the fracture strength was observed for the CMPed wafer. Average fracture strength of DBGed specimens was higher than that of the CMPed ones for the same thickness of wafer. Conclusion: DBG process can be more helpful for lowering fracture probability during the semiconductor fabrication process than CMP process.

• Journal of Powder Materials
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• v.2 no.2
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• pp.142-148
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• 1995

2219 aluminum alloy bonded diamond wheels containing intermetallic compounds were fabricated by powder metallurgy method. Nickel and titanium were added in aluminum matrix piece. The hot pressing condition was $600^{\circ}C$ and 20 Mpa in the furnace of the electric resistance type. The mechanical properties and grinding tests were carried out to confirm the wheel performance. Aluminum oxide ceramics were chosen for use in the grinding tests. The test proved that the heat resistance 2219 aluminum bonded diamond wheel containing 15 wt% nickel and 15 wt% titanium respectively showed the best performance.