Evaluation of Mechanical Backside Damage of Silicon Wafer by Minority Carrier Recombination Lifetime and Photo-Acoustic Displacement Method
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- 한국결정성장학회:학술대회논문집
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- 한국결정성장학회 1997년도 Proceedings of the 13th KACG Technical Meeting `97 Industrial Crystallization Symposium(ICS)-Doosan Resort, Chunchon, October 30-31, 1997
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- pp.155-159
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- 1997